scholarly journals The Effect of Stirring Time and Cast Thickness on Morphology, Permeability, and Thermal Stability of Polysulfone/Polyvinylidene Fluoride Blended Membranes

2018 ◽  
Author(s):  
Pirim Setiarso ◽  
Nita Kusumawati ◽  
Supari Muslim ◽  
Maria Monica Sianita ◽  
Ruwanti Dewi Cahya Ningrum
Keyword(s):  
Thermal Stability ◽  
Polyvinylidene Fluoride ◽  
Stirring Time ◽  
Thermal Stability Of

Thermal stability of internal electric field and polarization distribution in blend of polyvinylidene fluoride and polymethylmethacrylate

1993 ◽  
Vol 74 (5) ◽  
pp. 3366-3372 ◽  
Author(s):  
Naoto Tsutsumi ◽  
Yoshiaki Ueda ◽  
Tsuyoshi Kiyotsukuri ◽  
Aimé S. DeReggi ◽  
G. Thomas Davis
Keyword(s):  
Thermal Stability ◽  
Electric Field ◽  
Polyvinylidene Fluoride ◽  
Internal Electric Field ◽  
Polarization Distribution ◽  
Thermal Stability Of

scholarly journals Influence of dopant on the specific features of formation and properties of nanocomposites of poly(3-methylthiophene) with polyvinylidene fluoride

2021 ◽  
pp. 159-174
Author(s):  
Alexander A. Pud ◽  
◽  
Nikolay A. Ogurtsov ◽  
Olga S. Kruglyak ◽  
◽  
...  
Keyword(s):  
Thermal Stability ◽  
Polyvinylidene Fluoride ◽  
Vinylidene Fluoride ◽  
Thermal Studies ◽  
Shell Morphology ◽  
Inhomogeneous Layer ◽  
Transmission Electron ◽  
Oxidant Concentration ◽  
Poly Vinylidene Fluoride ◽  
Thermal Stability Of

The work is devoted to the development and study of conducting nanocomposites of poly(3-methylthiophene) (P3MT) and poly(vinylidene fluoride) (PVDF), suitable for changing properties when interaction with of the environment components, and to find factors of influence on properties of such materials. The kinetic aspects of P3MT formation in the process of 3-methylthiophene (3MT) polymerization in PVDF dispersions in the presence of dopants of different nature, in particular, chloride (Cl-), as well as surface-active dodecylbenzenesulfonate (DBS-) and perfluorooctanoate (PFO-) anions are studied. It is found that DBS- and PFO- anions inhibit 3MT oxidation and decrease P3MT yield in comparison with those of chloride anions. It is shown that P3MT is formed through two consecutive kinetically different reactions of pseudo-first order in terms of the oxidant concentration. Transmission electron microscopy revealed that as a result of such polymerization nanoparticles of doped P3MT formed a surface inhomogeneous layer on PVDF particles, thus forming nanocomposite particles with core-shell morphology. Thermal studies showed higher thermal stability of the doped P3MT phase in the nanocomposite compared to the pure polymer. It is found that thermal stability of the P3MT phase in the PVDF/P3MT-DBS nanocomposites is higher than in the PVDF/P3MT-Cl. The influence of the dopant nature and content of doped P3MT on conductivity and sensitivity of the nanocomposites to vapors of harmful volatile organic compounds (acetone and isopropanol) is characterized. The strongest responses to acetone are shown by the nanocomposite with PFO- dopant. In the DBS- dopant case medium intensity responses are found and the lowest ones are observed for Cl- dopant. It is shown that the sensitivity of nanocomposites extremely depends on the conducting polymer content.

Method of evaluating the thermal stability of the pyroelectric properties of polyvinylidene fluoride: Effects of poling temperature and field

1982 ◽  
Vol 53 (10) ◽  
pp. 6520-6525 ◽  
Author(s):  
Danilo DeRossi ◽  
Aime S. DeReggi ◽  
Martin G. Broadhurst ◽  
Steven C. Roth ◽  
G. Thomas Davis
Keyword(s):  
Thermal Stability ◽  
Polyvinylidene Fluoride ◽  
Pyroelectric Properties ◽  
Poling Temperature ◽  
Thermal Stability Of

Magnetic properties and thermal stability of polyvinylidene fluoride—Fe2O3 nanocomposites

2020 ◽  
Vol 35 (2) ◽  
pp. 132-140 ◽  
Author(s):  
Victor Kuncser ◽  
Dorina Chipara ◽  
Karen S. Martirosyan ◽  
Gabriel Alexandru Schinteie ◽  
Elamin Ibrahim ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Magnetic Properties ◽  
Polyvinylidene Fluoride ◽  
Image Position ◽  
Thermal Stability Of

Abstract

scholarly journals Thermal Spectroscopy and Kinetic Studies of PEO/PVDF Loaded by Carbon Nanotubes

2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Laila Hussein Gaabour
Keyword(s):  
Activation Energy ◽  
Carbon Nanotubes ◽  
Thermal Stability ◽  
Heating Rate ◽  
Polyvinylidene Fluoride ◽  
Kinetic Studies ◽  
Multiwalled Carbon ◽  
Polymeric Matrices ◽  
Swcnts And Mwcnts ◽  
Thermal Stability Of

Nanocomposites of polyethylene oxide (PEO) and polyvinylidene fluoride (PVDF) without and with low content of single and multiwalled carbon nanotubes (SWCNTs-MWCNTs) were prepared and studied by thermogravimetric analysis (TGA) using different heating rate. TGA results indicate that the thermal stability of neat PEO/PVDF blend was improved with both heating rate and incorporation of carbon nanotubes (CNTs). The degradation temperature for neat blend was lower than those of the nanocomposites after adding both SWCNTs and MWCNTs. As increase of heating rate, the onset of decomposition is irregularly moved to higher temperatures. This indicates that the thermal stability of the polymeric matrices has been improved after addition of CNTs. The residual weight of the samples left increased steadily with adding of both SWCNTs and MWCNTs. Kinetic thermodynamic parameters such as activation energy, enthalpy, entropy, and Gibbs free energy are evaluated from TGA data using Coats-Redfern model. The values of all parameters irregularly decrease with increasing of heating rate due to increasing of heating rate temperature, the random scission of macromolecule chain in the polymeric matrices predominates and the activation energy has a lower value.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of
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