Solvents for irreversible sealing of microfluidic polymethylmethacrylate devices by solvent bonding technique

2020 ◽  
Vol 0 (12) ◽  
pp. 27-33
Author(s):  
T. A. Lukashenko ◽  
◽  
A. N. Zubik ◽  
A. L. Bulyanitsa ◽  
A. I. Tsimbalov ◽  
...  
Keyword(s):  
Adhesive Bonding ◽  
Qualitative And Quantitative ◽  
Working Volume ◽  
Solvent Bonding ◽  
Bonding Technique

The solvents to be compatible with polymethylmethacrylate (PMMA) were selected on the basis of qualitative and quantitative criteria. The features of the solvent bonding connecting seam of the irreversible bonding PMMA of various trademarks have been studied. It is shown that the method of solvent bonding with vinylacetate can be an alternative to adhesive bonding when sealing microchips since the solvent bonding connecting seam makes a smaller contribution to the change in the working volume of microstructures.

Tacky COC: a solvent bonding technique for fabrication of microfluidic systems

2016 ◽  
Author(s):  
Nico Keller ◽  
Tobias M. Nargang ◽  
Dorothea Helmer ◽  
Bastian E. Rapp
Keyword(s):  
Microfluidic Systems ◽  
Solvent Bonding ◽  
Bonding Technique

Strength prediction of T-peel joints by a hybrid spot-welding/adhesive bonding technique

2016 ◽  
Vol 94 (3) ◽  
pp. 181-198 ◽  
Author(s):  
F. J. S. de Almeida ◽  
R. D. S. G. Campilho ◽  
F. J. G. Silva
Keyword(s):  
Spot Welding ◽  
Adhesive Bonding ◽  
Strength Prediction ◽  
Bonding Technique

Microleakage and Shear Punch Bond Strength in Class II Primary Molars Cavities Restored with Low Shrink Silorane Based versus Methacrylate Based Composite using Three Different Techniques

2010 ◽  
Vol 35 (2) ◽  
pp. 173-181 ◽  
Author(s):  
Amal Ezzeldin Fahmy ◽  
Nadia Moustafa Farrag
Keyword(s):  
Composite Materials ◽  
Bond Strength ◽  
Adhesive Bonding ◽  
Composite Resin ◽  
Class Ii ◽  
Primary Molars ◽  
Resin Composites ◽  
Mode Of Failure ◽  
Shear Punch ◽  
Bonding Technique

Objectives: This in vitro study aimed to evaluate the gingival microleakage in class II cavities in primary molars restored with a low shrink silorane resin composite (Filtek P90) or a nanohybride composite resin(Filtek supreme XT) using three different techniques, (total bonding, closed or open sandwich techniques)lined by nano-filled resin modified glass ionomer cement RMGIC (Ketac N100). Additionally, the shear punch bond strength between the two types of composite and KN100 was also examined. Study design:For microleakage test, two standardized class II slot cavities were prepared in proximal surfaces of 60 sound extracted primary molars which were divided into 2 groups of 30 each according to the type of composite. Each group was subdivided into 3 groups (n = 10) according to the restorative technique used. The restored teeth were examined for microleakage after immersion in 2% methylene blue dye using stereomicroscope at 20 X. Microleakage scores among the groups were compared using Kruskal Wallis test followed by pair wise Mann Whitney U test at P ≤ 0.05. Thirty disc specimens were prepared for determining the shear punch bond strength between the two composite materials and the KN100. Specimens were divided into 5 groups (n = 6) according to the adhesive protocol. The differences in mean bond strength values in MPa between groups were statistically analyzed using ANOVA followed by pair wise Tukey Post hoc test at P ≤ 0.05.Mode of failure was also evaluated for all groups. Results: Both the silorane resin and nano-composite resin showed superior marginal seal with the total bonding technique compared to closed and open sandwich techniques. The recorded mean shear punch bond strength values showed no statistical significant difference between the two resin composites without or with their adhesive bonding systems when bonded to the nano-ionomer. All specimens showed cohesive mode of failures except for silorane resin with Adper Easy Bond Self Etch Adhesive (AEBSEA) which showed adhesive mode of failure. Conclusions: The best marginal seal was obtained with the total bonding technique using both resin composites. The shear punch bond strength between KN100 and the two composite materials was not affected by either of the used adhesive bonding agent.

Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel

2009 ◽  
Vol 74 ◽  
pp. 183-186
Author(s):  
Lu Jun Zhang ◽  
Andre Bossche
Keyword(s):  
Microfluidic Device ◽  
Intermediate Layer ◽  
Adhesive Bonding ◽  
Microfluidic Devices ◽  
Process Equipment ◽  
Wafer Level ◽  
Bonding Technique

This paper presents a method to fabricate the microfluidic devices with insulated electrodes on top and bottom sides of the channel. To form the channel containing vertically opposing electrodes, two processed substrates were bonded together with an SU-8 intermediate layer sandwiched in between. An adhesive bonding technique, at wafer level, with accurate alignment was developed. Instead of using wafer bonder, the bonding was conducted on a hotplate, which relieves the requirement on the process equipment to a great extent.

Low Temperature Wafer Level Adhesive Bonding Using BCB for Resonant Pressure Sensor

2012 ◽  
Vol 503 ◽  
pp. 55-60 ◽  
Author(s):  
Yu Xin Li ◽  
De Yong Chen ◽  
Jun Bo Wang
Keyword(s):  
Low Temperature ◽  
Pressure Sensor ◽  
Adhesive Bonding ◽  
Time Pressure ◽  
Bonding Process ◽  
Wafer Level ◽  
Bonding System ◽  
Sensor Package ◽  
Bonding Technique

This paper presents a method of low temperature wafer level adhesive bonding using non-photosensitive bisbenzocyclobutene (BCB) from Dow Co for resonant pressure sensor package. The bonding process is performed at the temperature below 250oC, with the pressure on the wafer 2-3 Bar in vacuum in a wafer bonding system. According to the bonding process, pre-bake time, pumping time, pressure placed on the sensor and the thickness of cross-linked layer are the most important factors. Experiments show that more than 95% of the area is successfully bonded, the hermeticity maintains well after thermal shock and long term tests, and the tensile strength of the fabricated bonds is up to 40MPa. The bonding technique was successfully tested in the fabrication process of resonant pressure sensor, and the results show that this bonding technique is a viable MEMS encapsulation technology for hermetically cavity sealing.

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