Study on rectification of issues faced by ultrasonic welding of medical “e-stethoscope” by adhesive bonding technique

Objectives: This in vitro study aimed to evaluate the gingival microleakage in class II cavities in primary molars restored with a low shrink silorane resin composite (Filtek P90) or a nanohybride composite resin(Filtek supreme XT) using three different techniques, (total bonding, closed or open sandwich techniques)lined by nano-filled resin modified glass ionomer cement RMGIC (Ketac N100). Additionally, the shear punch bond strength between the two types of composite and KN100 was also examined. Study design:For microleakage test, two standardized class II slot cavities were prepared in proximal surfaces of 60 sound extracted primary molars which were divided into 2 groups of 30 each according to the type of composite. Each group was subdivided into 3 groups (n = 10) according to the restorative technique used. The restored teeth were examined for microleakage after immersion in 2% methylene blue dye using stereomicroscope at 20 X. Microleakage scores among the groups were compared using Kruskal Wallis test followed by pair wise Mann Whitney U test at P ≤ 0.05. Thirty disc specimens were prepared for determining the shear punch bond strength between the two composite materials and the KN100. Specimens were divided into 5 groups (n = 6) according to the adhesive protocol. The differences in mean bond strength values in MPa between groups were statistically analyzed using ANOVA followed by pair wise Tukey Post hoc test at P ≤ 0.05.Mode of failure was also evaluated for all groups. Results: Both the silorane resin and nano-composite resin showed superior marginal seal with the total bonding technique compared to closed and open sandwich techniques. The recorded mean shear punch bond strength values showed no statistical significant difference between the two resin composites without or with their adhesive bonding systems when bonded to the nano-ionomer. All specimens showed cohesive mode of failures except for silorane resin with Adper Easy Bond Self Etch Adhesive (AEBSEA) which showed adhesive mode of failure. Conclusions: The best marginal seal was obtained with the total bonding technique using both resin composites. The shear punch bond strength between KN100 and the two composite materials was not affected by either of the used adhesive bonding agent.

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Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique

2016 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2016.7970016 ◽

2016 ◽

Cited By ~ 1

Author(s):

S. E. Kucuk Eroglu ◽

W. Y. Choo ◽

Y. Leblebici

Keyword(s):

Adhesive Bonding ◽

Integration Process ◽

3D Integration ◽

Parylene C ◽

Bonding Technique

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Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.74.183 ◽

2009 ◽

Vol 74 ◽

pp. 183-186

Author(s):

Lu Jun Zhang ◽

Andre Bossche

Keyword(s):

Microfluidic Device ◽

Intermediate Layer ◽

Adhesive Bonding ◽

Microfluidic Devices ◽

Process Equipment ◽

Wafer Level ◽

Bonding Technique

This paper presents a method to fabricate the microfluidic devices with insulated electrodes on top and bottom sides of the channel. To form the channel containing vertically opposing electrodes, two processed substrates were bonded together with an SU-8 intermediate layer sandwiched in between. An adhesive bonding technique, at wafer level, with accurate alignment was developed. Instead of using wafer bonder, the bonding was conducted on a hotplate, which relieves the requirement on the process equipment to a great extent.

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Low Temperature Wafer Level Adhesive Bonding Using BCB for Resonant Pressure Sensor

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.503.55 ◽

2012 ◽

Vol 503 ◽

pp. 55-60 ◽

Cited By ~ 1

Author(s):

Yu Xin Li ◽

De Yong Chen ◽

Jun Bo Wang

Keyword(s):

Low Temperature ◽

Pressure Sensor ◽

Adhesive Bonding ◽

Time Pressure ◽

Bonding Process ◽

Wafer Level ◽

Bonding System ◽

Sensor Package ◽

Bonding Technique

This paper presents a method of low temperature wafer level adhesive bonding using non-photosensitive bisbenzocyclobutene (BCB) from Dow Co for resonant pressure sensor package. The bonding process is performed at the temperature below 250oC, with the pressure on the wafer 2-3 Bar in vacuum in a wafer bonding system. According to the bonding process, pre-bake time, pumping time, pressure placed on the sensor and the thickness of cross-linked layer are the most important factors. Experiments show that more than 95% of the area is successfully bonded, the hermeticity maintains well after thermal shock and long term tests, and the tensile strength of the fabricated bonds is up to 40MPa. The bonding technique was successfully tested in the fabrication process of resonant pressure sensor, and the results show that this bonding technique is a viable MEMS encapsulation technology for hermetically cavity sealing.

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Thin-film silicon solar cells using an adhesive bonding technique

IEEE Transactions on Electron Devices ◽

10.1109/16.944200 ◽

2001 ◽

Vol 48 (9) ◽

pp. 2090-2094 ◽

Cited By ~ 7

Author(s):

H. Takato ◽

R. Shimokawa

Keyword(s):

Thin Film ◽

Solar Cells ◽

Adhesive Bonding ◽

Silicon Solar Cells ◽

Thin Film Silicon ◽

Bonding Technique

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Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer

Sensors ◽

10.3390/s20113333 ◽

2020 ◽

Vol 20 (11) ◽

pp. 3333

Author(s):

Wei Liu ◽

Dawei Wu

Keyword(s):

Low Temperature ◽

Polyvinylidene Fluoride ◽

Adhesive Bonding ◽

Ultrasonic Transducer ◽

Wearable Devices ◽

Center Frequency ◽

Pvdf Film ◽

Element Analysis ◽

Acoustic Performance ◽

Bonding Technique

This paper presents the development of a flexible piezoelectric micromachined ultrasonic transducer (PMUT) that can conform to flat, concave, and convex surfaces and work in air. The PMUT consists of an Ag-coated polyvinylidene fluoride (PVDF) film mounted onto a laser-manipulated polymer substrate. A low temperature (<100 °C) adhesive bonding technique is adopted in the fabrication process. Finite element analysis (FEA) is implemented to confirm the capability of predicting the resonant frequency of composite diaphragms and optimizing the device. The manufactured PMUT exhibits a center frequency of 198 kHz with a wide operational bandwidth. Its acoustic performance is demonstrated by transmitting and receiving ultrasound in air on curved surface. The conclusions from this study indicate the proposed PMUT has great potential in ultrasonic and wearable devices applications.

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