scholarly journals Characterization of Analog Circuits Based on Cloud Computing

2018 ◽  
pp. 118-124
Author(s):  
A.A. Lyalinsky ◽  
Keyword(s):  
Cloud Computing ◽  
Analog Circuits

Strategic Values of Cloud Computing Transformation

2021 ◽  
pp. 1668-1684
Author(s):  
Mohamed Makhlouf ◽  
Oihab Allal-Chérif
Keyword(s):  
Cloud Computing ◽  
Economic Activity ◽  
Exploratory Study ◽  
Managerial Cognition ◽  
Strategic Objectives ◽  
Size And Structure ◽  
Organizational Requirements

This article aims to study the strategic transformative value dimensions of cloud computing. Organizational requirements, managerial strategic objectives, and their attendant challenges are very specific indicators that enable characterization of these dimensions. An exploratory study of 173 cases of companies, covering 17 distinct economic activity sectors, spread over all continents, was conducted, taking into account contingency factors such as culture, size, and structure. The elements of industry, strategy, and technology were also considered, as well as managerial cognition. The analyses of needs, objectives, challenges, implemented solutions, and results of the transformation to cloud computing, enabled us to identify these dimensions. Strategies to maximize the transformative value of cloud computing are then presented. The results of this study can be used by managers to facilitate and optimize this cloud computing transformation.

scholarly journals A Generic Test Board for the Electrical Characterization of ULP and ULV Fully-Differential Integrated Analog Circuits

2019 ◽  
Vol 14 (3) ◽  
pp. 1-7
Author(s):  
Lucas Compassi Severo ◽  
Wilhelmus Adrianus Maria Van Noije
Keyword(s):  
Analog Circuits ◽  
Input Impedance ◽  
Electrical Characterization ◽  
Active Filters ◽  
Ultra Low Power ◽  
Signal Conversion ◽  
Fully Differential ◽  
Test Board ◽  
Output Driver

The characterization of ultra-low power (ULP) fully-differential/balanced amplifiers and active filters is challenging due to the incompatibility with the classical single-ended (SE) and 50 Ω  impedance equipment. Interface circuits between the device under test (DUT) and the equipment are needed to perform the signal conversion and to work as voltage buffers. In this work, we propose a generic test circuits to be used in the characterization of ULP and ultra-low voltage (ULV) analog circuits. The test board includes balun transformers to the signal conversion, a high input impedance and low capacitance output driver and voltage regulators to provide the target DUT supply voltage. The characterization of the proposed PCB demonstrates a bandwidth of 30 MHz, output driver input impedance of 5 MΩ with 2.5 pF capacitance and low input-referred noise. The proposed circuit was applied to the electrical characterization of two fully-differential ULV and ULP analog integrated circuits.

Processing and characterization of high Jc NbN superconducting tunnel junctions for THz analog circuits and RSFQ

1999 ◽  
Vol 9 (2) ◽  
pp. 3216-3219 ◽  
Author(s):  
V. Larrey ◽  
J.-C. Villegier ◽  
M. Salez ◽  
F. Miletto-Granozio ◽  
A. Karpov
Keyword(s):  
Analog Circuits ◽  
Tunnel Junctions ◽  
Superconducting Tunnel Junctions

Remarks on Statistical Design Centering

2011 ◽  
Vol 57 (2) ◽  
pp. 159-167 ◽  
Author(s):  
Leszek Opalski
Keyword(s):  
Computational Complexity ◽  
Analog Circuits ◽  
Complexity Analysis ◽  
Statistical Design ◽  
Problem Formulation ◽  
Quality Indices ◽  
Op Amp ◽  
Design Case ◽  
Design Centering

Remarks on Statistical Design CenteringThe paper overviews optimization based statistical design centering techniques for analog circuits. Emphasis is placed on dependence between formulation of quality indices, problem formulation, and computational complexity of design centering algorithms, executed in single- or multiple-processor environments. For characterization of solution techniques a standard CMOS op-amp design case and a simplified computational complexity analysis are used.

Characterization of Thick Film Technology for 300°C Packaging

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000097-000107 ◽  
Author(s):  
Rui Zhang ◽  
R. Wayne Johnson ◽  
Vinayak Tilak ◽  
Tan Zhang ◽  
David Shaddock
Keyword(s):  
Thick Film ◽  
Analog Circuits ◽  
Passive Components ◽  
Term Operation ◽  
C Storage ◽  
Selection Of ◽  
Device Technology ◽  
Thick Film Technology

Geothermal well logging and instrumentation applications require electronics capable of 300°C operation. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. However, to build functional circuits, an interconnection and packaging technology must be demonstrated to provide interconnectivity between different SiC devices and passive components. For long-term operation, organic based packaging is limited to ∼250°C with careful selection of materials. Thick film technology based on ceramics and metals has potential for higher operating temperatures. In this work the effect of 300°C storage on the adhesion of different thick film Au conductors and a multilayer dielectric have been studied. In addition, the electrical properties of the dielectric have been studied as a function of temperature and of high temperature aging. Assembly technologies: component attach, wire bonding and external lead attach have also been investigated and the results are reported.

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