EBAC Analysis with Chemically Enhanced FIB Milling Assists Technique on Large Kerf/PCM Test Structure

Electron Beam ◽

Ion Beam ◽

Test Structure ◽

Top Down ◽

Area Of Interest ◽

Milling Method ◽

Focus Ion Beam ◽

Abstract The ability to expose a huge kerf/PCM (Process Control Monitor) test structure at the same level is limited from top down finger polishing. Also, in Scanning Electron Microscopy (SEM) the electron beam (e-beam) shift for electron beam absorbed current (EBAC) analysis is not able to cover the whole structure. The recently implemented technique described herein combines the focus ion beam (FIB) chemical enhanced milling method with EBAC analysis to stop the polishing at the upper layer and split the EBAC analysis into portions from the test structure. These help to improve the area of interest (AOI) evenness and enable the extension of the EBAC analysis.

Investigation of Die Tilting of Packages with Single and Multi-chips

10.31399/asm.cp.istfa2018p0429 ◽

2018 ◽

Author(s):

Lo Chea Wee ◽

Tan Sze Yee ◽

Gan Sue Yin ◽

Goh Cin Sheng

Keyword(s):

Electron Microscopy ◽

Electron Beam ◽

Optical Microscopy ◽

Device Performance ◽

Electronic Components ◽

Area Of Interest ◽

On Chip ◽

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.

105. Looking through the ice: Quality control of cryopreserved cells and tissues with cryo focus ion beam scanning electron microscopy

Cryobiology ◽

10.1016/j.cryobiol.2010.10.109 ◽

2010 ◽

Vol 61 (3) ◽

pp. 393-394

Author(s):

A. Katsen-Globa ◽

I. Meiser ◽

D. Putz ◽

A. Cismak ◽

A. Heilmann ◽

...

Keyword(s):

Electron Microscopy ◽

Quality Control ◽

Ion Beam ◽

Beam Scanning ◽

Focus Ion Beam ◽

Biological application of focus ion beam-scanning electron microscopy (FIB-SEM) to the imaging of cartilaginous fibrils and osteoblastic cytoplasmic processes

Journal of Oral Biosciences ◽

10.1016/j.job.2016.11.004 ◽

2017 ◽

Vol 59 (1) ◽

pp. 55-62 ◽

Cited By ~ 10

Author(s):

Tomoka Hasegawa ◽

Takashi Endo ◽

Erika Tsuchiya ◽

Ai Kudo ◽

Zhao Shen ◽

...

Keyword(s):

Electron Microscopy ◽

Ion Beam ◽

Biological Application ◽

Beam Scanning ◽

Focus Ion Beam ◽

Cytoplasmic Processes ◽

Focus Ion Beam/Scanning Electron Microscopy Characterization of Osteoclastic Resorption of Calcium Phosphate Substrates

Tissue Engineering Part C Methods ◽

10.1089/ten.tec.2016.0361 ◽

2017 ◽

Vol 23 (2) ◽

pp. 118-124 ◽

Cited By ~ 5

Author(s):

Anna Diez-Escudero ◽

Montserrat Espanol ◽

Edgar B. Montufar ◽

Gemma Di Pompo ◽

Gabriela Ciapetti ◽

...

Keyword(s):

Electron Microscopy ◽

Calcium Phosphate ◽

Ion Beam ◽

Osteoclastic Resorption ◽

Focus Ion Beam ◽

Microscopy Characterization ◽

Scanning Electron Microscopy Characterization ◽

High Resolution Scanning Electron Microscopy

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100086696 ◽

1991 ◽

Vol 49 ◽

pp. 478-479

Author(s):

David Joy ◽

James Pawley

Keyword(s):

Electron Microscopy ◽

Electron Beam ◽

Electron Microscope ◽

High Resolution ◽

Scanning Electron Microscope ◽

Electron Probe ◽

Impact Point ◽

Interaction Volume ◽

The scanning electron microscope (SEM) builds up an image by sampling contiguous sub-volumes near the surface of the specimen. A fine electron beam selectively excites each sub-volume and then the intensity of some resulting signal is measured. The spatial resolution of images made using such a process is limited by at least three factors. Two of these determine the size of the interaction volume: the size of the electron probe and the extent to which detectable signal is excited from locations remote from the beam impact point. A third limitation emerges from the fact that the probing beam is composed of a finite number of discrete particles and therefore that the accuracy with which any detectable signal can be measured is limited by Poisson statistics applied to this number (or to the number of events actually detected if this is smaller).

Ultrastructural Features of Normal and Diseased Hair Revealed by Ion Beam Etching and Freeze Fracture

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100115419 ◽

1975 ◽

Vol 33 ◽

pp. 358-359

Author(s):

M. Spector ◽

A. C. Brown

Keyword(s):

Electron Microscopy ◽

Ectodermal Dysplasia ◽

Ion Beam ◽

Freeze Fracture ◽

Ion Current ◽

Ion Beam Etching ◽

Pili Torti ◽

Argon Ion ◽

Ion beam etching and freeze fracture techniques were utilized in conjunction with scanning electron microscopy to study the ultrastructure of normal and diseased human hair. Topographical differences in the cuticular scale of normal and diseased hair were demonstrated in previous scanning electron microscope studies. In the present study, ion beam etching and freeze fracture techniques were utilized to reveal subsurface ultrastructural features of the cuticle and cortex.Samples of normal and diseased hair including monilethrix, pili torti, pili annulati, and hidrotic ectodermal dysplasia were cut from areas near the base of the hair. In preparation for ion beam etching, untreated hairs were mounted on conducting tape on a conducting silicon substrate. The hairs were ion beam etched by an 18 ky argon ion beam (5μA ion current) from an ETEC ion beam etching device. The ion beam was oriented perpendicular to the substrate. The specimen remained stationary in the beam for exposures of 6 to 8 minutes.

Microscopy Methods for Biofilm Imaging: Focus on SEM and VP-SEM Pros and Cons

Biology ◽

10.3390/biology10010051 ◽

2021 ◽

Vol 10 (1) ◽

pp. 51

Author(s):

Michela Relucenti ◽

Giuseppe Familiari ◽

Orlando Donfrancesco ◽

Maurizio Taurino ◽

Xiaobo Li ◽

...

Keyword(s):

Electron Microscopy ◽

Ion Beam ◽

Ruthenium Red ◽

Variable Pressure ◽

Sem Images ◽

Advantages And Disadvantages ◽

Pros And Cons ◽

Microscopy Techniques ◽

Several imaging methodologies have been used in biofilm studies, contributing to deepening the knowledge on their structure. This review illustrates the most widely used microscopy techniques in biofilm investigations, focusing on traditional and innovative scanning electron microscopy techniques such as scanning electron microscopy (SEM), variable pressure SEM (VP-SEM), environmental SEM (ESEM), and the more recent ambiental SEM (ASEM), ending with the cutting edge Cryo-SEM and focused ion beam SEM (FIB SEM), highlighting the pros and cons of several methods with particular emphasis on conventional SEM and VP-SEM. As each technique has its own advantages and disadvantages, the choice of the most appropriate method must be done carefully, based on the specific aim of the study. The evaluation of the drug effects on biofilm requires imaging methods that show the most detailed ultrastructural features of the biofilm. In this kind of research, the use of scanning electron microscopy with customized protocols such as osmium tetroxide (OsO4), ruthenium red (RR), tannic acid (TA) staining, and ionic liquid (IL) treatment is unrivalled for its image quality, magnification, resolution, minimal sample loss, and actual sample structure preservation. The combined use of innovative SEM protocols and 3-D image analysis software will allow for quantitative data from SEM images to be extracted; in this way, data from images of samples that have undergone different antibiofilm treatments can be compared.