scholarly journals Revealing Spider Silk's 3D Nanostructure Through Low Temperature Plasma Etching and Advanced Low-Voltage SEM

2019 ◽  
Vol 5 ◽  
Author(s):  
Nicola Stehling ◽  
Kerry J. Abrams ◽  
Chris Holland ◽  
Cornelia Rodenburg
2006 ◽  
Vol 914 ◽  
Author(s):  
Nagraj S Kulkarni ◽  
Prabhakar Tamirisa ◽  
Galit Levitin ◽  
Richard J Kasica ◽  
Dennis W Hess

AbstractA low temperature plasma etching process for patterning copper interconnects is proposed as a solution to the size effect issue in the resistivity of copper. Key features of this etching process based on a previous thermochemical analysis of the Cu-Cl-H system are discussed. Potential benefits of a subtractive etching scheme based on this process in comparison with the damascene scheme for copper-based interconnect processing in sub-100 nm features are presented in the context of the ITRS roadmap. Preliminary experimental work on plasma etching of Cu thin films using the proposed process is discussed.


2020 ◽  
Author(s):  
Bodrikov Ivan Vasilievich ◽  
Grinvald Iosif Isaevich ◽  
Titov Evgeniy Yuryevich ◽  
Titov Evgeniy Yuryevich ◽  
Razov Evgeniy Nikolaevich

This article is focused on the transformation of di- and trichloromethane by induced low-voltage discharges in the liquid phase. To generate discharges, a direct current source is used (capacitance 2200 μF, voltage 60 V). The products and probable intermediates of the CH2Cl2 and CHCl3 transformation were determined by the methods of thermodynamic modeling, FTIR spectroscopy and electron microscopy. Under the action of low-voltage discharges on the liquid substrates, needle fullerene- like structures are formed. In this case the gas phase consists mainly of hydrogen chloride. From the simulation of the nonequilibrium composition of particles and molecular systems it follows that in the course of induced reactions of CH2Cl2 and CHCl3 and geminal elimination of HCl molecules, predominantly carbene-type intermediates are generated. Keywords: dichloromethane, trichloromethane, low temperature plasma, discharges in the liquid phase


2008 ◽  
Vol 26 (2) ◽  
pp. 253-258 ◽  
Author(s):  
D. Celo ◽  
R. Vandusen ◽  
T. Smy ◽  
J. Albert ◽  
N. G. Tarr ◽  
...  

1993 ◽  
Vol 13 (3) ◽  
pp. 521-537 ◽  
Author(s):  
Jeffrey A. Gregus ◽  
Matthew F. Vernon ◽  
Richard A. Gottscho ◽  
Geoffrey R. Scheller ◽  
William S. Hobson ◽  
...  

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