scholarly journals Microstructure and Formation Mechanism of Ultrasound-Assisted Transient Liquid Phase Bonded Magnesium Alloys with Ni Interlayer

Materials ◽  
2019 ◽  
Vol 12 (22) ◽  
pp. 3732 ◽  
Author(s):  
Yinan Li ◽  
Chengfei Yang ◽  
Zilong Peng ◽  
Zhiyuan Wu ◽  
Zhuang Cui

Ultrasound-assisted transient liquid phase bonding (U-TLP) has been regarded as a promising brazing process to join magnesium alloys with a Sn and Zn interlayer; however, the formation of brittle magnesium intermetallic compounds (Mg2Sn, MgZn, and MgZn2) compromises the mechanical properties of the joints. In this study, Mg alloy U-TLP joints with a Ni interlayer were evaluated based on shear strength and hardness measurement. Microstructural evolution along with ultrasonic duration time and intermetallic compound formation were characterized using X-ray diffraction and electron microscopy methods. The results show that incremental ultrasonic durations of up to 30 s lead to the microstructural evolution from the Mg2Ni layer, eutectic compounds (Mg2Ni and α-Mg) to α-Mg (Ni), accompanied by shear strength increases. The maximum value of the shear strength is 107 MPa. The role that ultrasound vibration played in brazing was evaluated, and showed that the MgO film was broken by the acoustic softening effect when the interlayer and base metal were solid. As the MgO and Mg substrate have different stress reduction τ, this plastic mismatch helps to break the oxide film. Additionally, the diffusion between the solid Mg substrate and Ni interlayer is accelerated greatly by the acoustic pressure based on the DICTRA dynamic calculation.

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.


2014 ◽  
Vol 33 (6) ◽  
pp. 525-529 ◽  
Author(s):  
X.Y. Gu ◽  
Z.Z. Duan ◽  
X.P. Gu ◽  
D.Q. Sun

AbstractIn the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.


2019 ◽  
Vol 944 ◽  
pp. 593-599
Author(s):  
Ben Sheng Huang ◽  
Xiong Wen ◽  
Xing Zhao ◽  
Guang Wen Li

Aluminum foams/aluminum plate was transient liquid phase diffusion bonded with Cu/Al/Cu composite interlayer, then the investigation on joint microstructure, element diffusion and joint strength was conducted at 565°C. The results showed that, there was a significant grain boundary penetration phenomenon near the interface and it was more seriously at the side of aluminum foams. The XRD results showed indicated that the main phases near the interface were α-Al, CuAl2, AlCu, Al4Cu9, Al2O3. By EDS line scanning, it indicated that the diffusion behavior of elements was different at three regions, compared with the edge region, the interface of the central region was better and the depth of element diffusion is larger, at the pore region, the liquefaction of interlayer was not successfully and the morphology was lamellar. Mechanical properties test showed that the largest shear strength of joint was 4.61 MPa when the duration was 40 min. Key words: Aluminum foams; transient liquid phase bonding; microstructure; element diffusion; shear strength


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