scholarly journals Xenon Flash Lamp Lift-Off Technology without Laser for Flexible Electronics

Micromachines ◽  
2020 ◽  
Vol 11 (11) ◽  
pp. 953
Author(s):  
Sang Il Lee ◽  
Seong Hyun Jang ◽  
Young Joon Han ◽  
Jun yeub Lee ◽  
Jun Choi ◽  
...  

This study experimentally investigated process mechanisms and characteristics of newly developed xenon flash lamp lift-off (XF-LO) technology, a novel thin film lift-off method using a light to heat conversion layer (LTHC) and a xenon flash lamp (XFL). XF-LO technology was used to lift-off polyimide (PI) films of 8.68–19.6 μm thickness. When XFL energy irradiated to the LTHC was 2.61 J/cm2, the PI film was completely released from the carrier substrate. However, as the energy intensity of the XFL increased, it became increasingly difficult to completely release the PI film from the carrier substrate. Using thermal gravimetric analysis (TGA), Fourier-transform infrared spectroscopy (FTIR) and transmittance analysis, the process mechanism of XF-LO technology was investigated. Thermal durability of the PI film was found to deteriorate with increasing XFL energy intensity, resulting in structural deformation and increased roughness of the PI film surface. The optimum energy intensity of 2.61 J/cm2 or less was found to be effective for performing XF-LO technology. This study provides an attractive method for manufacturing flexible electronic boards outside the framework of existing laser lift-off (LLO) technology.

1984 ◽  
Vol 68 (Appendix) ◽  
pp. 45-46
Author(s):  
Hiromitsu Ishii ◽  
Kiyoshi Iida ◽  
Norio Muroi

Author(s):  
Yongzhong Wu ◽  
Jianqiang Zhu ◽  
Zhixiang Zhang ◽  
Yangshuai Li

Understanding the radiation model of a flash lamp is essential for the reflector design of a laser amplifier. Reflector design often involves several simplifying assumptions, like a point or Lambertian source; either of these assumptions may lead to significant errors in the output distribution. In practice, source non-idealities usually result in sacrificing the amplifier’s gain coefficient. We propose a novel test technique for attaining the xenon flash lamp absolute spectral intensity at various angles of view, and then accurately predict radiation distributions and generate the reflector shape. It is shown that due to the absorption of emitted radiation by the lamp itself, the behavior of the radiation model at various wavelengths is different. Numerical results of xenon plasma absorption coefficient were compared with the measured data. A reasonable agreement was obtained for the absorption coefficient parameters. Thus, this work provides a useful analytical tool for the engineering design of laser amplifier reflectors using xenon flash lamps as pumps.


1964 ◽  
Vol 35 (11) ◽  
pp. 1615-1616 ◽  
Author(s):  
J. W. Tucker ◽  
J. N. Bradford

2018 ◽  
Vol 46 (10) ◽  
pp. 3584-3590 ◽  
Author(s):  
Seung-Ho Song ◽  
Chan-Gi Cho ◽  
Su-Mi Park ◽  
Hyun-Il Park ◽  
Hong-Je Ryoo

2012 ◽  
Vol 24 (10) ◽  
pp. 2474-2478
Author(s):  
张雏 Zhang Chu ◽  
林德江 Lin Dejiang ◽  
沈洪斌 Shen Hongbin ◽  
徐春梅 Xu Chunmei ◽  
陈晓寒 Chen Xiaohan

2015 ◽  
Vol 52 (6) ◽  
pp. 061101
Author(s):  
王伶俐 Wang Lingli ◽  
赵友全 Zhao Youquan ◽  
翟瑞伟 Zhai Ruiwei ◽  
李霞 Li Xia ◽  
姜楠 Jiang Nan ◽  
...  

2016 ◽  
Vol 55 (24) ◽  
pp. 6596
Author(s):  
Youquan Zhao ◽  
Dexia Guo ◽  
Xiao Liu ◽  
Lingli Wang ◽  
Nan Jiang ◽  
...  

Polymers ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 546
Author(s):  
Seong Hyun Jang ◽  
Young Joon Han ◽  
Sang Yoon Lee ◽  
Geonho Lee ◽  
Jae Woong Jung ◽  
...  

Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.


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