scholarly journals Additive Manufacturing of Micro-Electro-Mechanical Systems (MEMS)

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1374
Author(s):  
Giorgio De Pasquale
Keyword(s):  
Additive Manufacturing ◽  
Technological Development ◽  
Mechanical Systems ◽  
Digital Design ◽  
The Other ◽  
Micro Electro Mechanical Systems ◽  
Freeform Fabrication ◽  
Mems Fabrication ◽  
Comparative Advantages ◽  
Am Processes

Recently, additive manufacturing (AM) processes applied to the micrometer range are subjected to intense development motivated by the influence of the consolidated methods for the macroscale and by the attraction for digital design and freeform fabrication. The integration of AM with the other steps of conventional micro-electro-mechanical systems (MEMS) fabrication processes is still in progress and, furthermore, the development of dedicated design methods for this field is under development. The large variety of AM processes and materials is leading to an abundance of documentation about process attempts, setup details, and case studies. However, the fast and multi-technological development of AM methods for microstructures will require organized analysis of the specific and comparative advantages, constraints, and limitations of the processes. The goal of this paper is to provide an up-to-date overall view on the AM processes at the microscale and also to organize and disambiguate the related performances, capabilities, and resolutions.

scholarly journals Comparing additive manufacturing technologies for customised wrist splints

2015 ◽  
Vol 21 (3) ◽  
pp. 230-243 ◽  
Author(s):  
Abby Megan Paterson ◽  
Richard Bibb ◽  
R. Ian Campbell ◽  
Guy Bingham
Keyword(s):  
Additive Manufacturing ◽  
Upper Extremity ◽  
Digital Design ◽  
Future Research ◽  
Fused Deposition Modelling ◽  
Full Potential ◽  
Content Type ◽  
Fused Deposition ◽  
Am Processes ◽  
Design For Am

Purpose – The purpose of this paper is to compare four different additive manufacturing (AM) processes to assess their suitability in the context of upper extremity splinting. Design/methodology/approach – This paper describes the design characteristics and subsequent fabrication of six different wrist splints using four different AM processes: laser sintering (LS), fused deposition modelling (FDM), stereolithography (SLA) and polyjet material jetting via Objet Connex. The suitability of each process was then compared against competing designs and processes from traditional splinting. The splints were created using a digital design workflow that combined recognised clinical best practice with design for AM principles. Findings – Research concluded that, based on currently available technology, FDM was considered the least suitable AM process for upper extremity splinting. LS, SLA and material jetting show promise for future applications, but further research and development into AM processes, materials and splint design optimisation is required if the full potential is to be realised. Originality/value – Unlike previous work that has applied AM processes to replicate traditional splint designs, the splints described are based on a digital design for AM workflow, incorporating novel features and physical properties not previously possible in clinical splinting. The benefits of AM for customised splint fabrication have been summarised. A range of AM processes have also been evaluated for splinting, exposing the limitations of existing technology, demonstrating novel and advantageous design features and opportunities for future research.

C-Axis Oriented ZnO Film by RF Sputtering and its Integration with MEMS Processing

2007 ◽  
Vol 1052 ◽  
Author(s):  
Sudhir Chandra ◽  
Ravindra Singh
Keyword(s):  
Resistivity Measurement ◽  
Mechanical Systems ◽  
Rf Sputtering ◽  
Fabrication Process ◽  
Zno Films ◽  
Front Side ◽  
Zno Film ◽  
Micro Electro Mechanical Systems ◽  
Mems Fabrication ◽  
Film Side

AbstractIn the present work, we report a new fabrication process to integrate the “c-axis oriented” ZnO films with bulk-micromachined silicon diaphragms. ZnO films are very sensitive to the chemicals used in the micro-electro-mechanical systems (MEMS) fabrication process which include acids, bases and etchants of different material layers (e.g. SiO2, chromium, gold etc.). A Si3N4 layer is incorporated to protect the ZnO film from the etchants of chromium and gold used for patterning the electrodes. A mechanical jig is used for protecting the front side (ZnO film side) of the wafer from ethylenediamine pyrocatechol water (EPW) during the anisotropic etching of silicon. The resistivity measurement performed on the ZnO film integrated with micro-diaphragm shows the reliability of the fabrication process proposed in this work.

Design and Fabrication of a Three-DOF MEMS Stage Based on Nested Structures

2012 ◽  
Author(s):  
Yong-Sik Kim ◽  
Nicholas G. Dagalakis ◽  
Satyandra K. Gupta
Keyword(s):  
Cross Talk ◽  
Translational Motion ◽  
Mechanical Systems ◽  
Degree Of Freedom ◽  
The Other ◽  
Micro Electro Mechanical Systems ◽  
Nested Structures ◽  
Positioning Stage ◽  
Out Of Plane ◽  
Kinematic Mechanism

This paper presents the design, fabrication and testing of a Micro Electro Mechanical Systems (MEMS) based positioning stage which is capable of generating translational motions along X, Y and Z axes, respectively. For this purpose, two existing 1 Degree of Freedom (DOF) in-plane positioning stages and one 1 DOF out-of-plane actuator are merged together for 3 DOF motions. For successful integration between three independent systems, a platform in the chosen 1 DOF in-plane stage is utilized to embed another system. For a successful combination between three independent systems, two nested structures are adapted as a serial kinematic mechanism. With the nested structures, one 1 DOF in-plane positioning stage is embedded into the other 1 DOF in-plane stage for in-plane translational motions along the X and the Y axes. And then, one 1 DOF out-of-plane actuator is embedded for the translational motion along the Z axis. The proposed 3 DOF system has demonstrated an ability to generate at least 20 μm along X, Y and Z axes, respectively. The cross talk between the three axes is also measured and is less than 4 percent of the intended displacement.

scholarly journals PCB Netlist Obfuscation with Micro Electro Mechanical Systems and Additive Manufacturing Techniques

2021 ◽  
Author(s):  
John True ◽  
Chengjie Xi ◽  
Aslam Khan ◽  
Josh Hihath ◽  
Navid Asadizanjani
Keyword(s):  
Additive Manufacturing ◽  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Mechanical Systems ◽  
X Rays ◽  
Micro Electro Mechanical Systems ◽  
X Ray ◽  
Functional Connections ◽  
Macro Scale ◽  
Non Destructive

Abstract Semiconductor manufacturing has been outsourced to un-trusted regions due to globalization. The complex multistep fabrication of micro-scale integrated circuits (ICs) and the tedious assembly of macro-scale Printed Circuit Boards (PCBs) are vulnerable to malicious attacks from design to final delivery. PCBs provide the functional connections of Integrated Circuits (ICs), sensors, power supplies, etc. of many critical electronic systems for consumers, corporations, and governments. The feature sizes of PCB signal traces in 2D and vias in 3D are an order of magnitude larger than IC devices, and are thereby more vulnerable to non-destructive attacks such as X-ray or probing. Active and passive countermeasures have been successfully developed for IC devices, however PCBs devices are difficult to wholly secure from all attacks. Passive countermeasures for X-ray attacks using high-z materials to block and scatter X-rays are effective, but there is a lack of active and passive countermeasures for PCB. In this paper, a framework for passively obfuscating a PCB's critical connections between components, such as ICs, from non-destructive attacks is demonstrated. This framework can be further extended to incorporate active countermeasures in future work. A proof of concept for a PCB electronic design automation (EDA) tool which combines the small features of micro electro-mechanical systems (MEMS), simulation of X-ray, and 3D PCB Manufacturing to iteratively optimize PCB design to thwart reverse engineering and probing attacks. Index Terms—Additive Manufacturing, MEMS, Hardware Assurance, Physical Inspection, Non-Destructive Technology

scholarly journals Additive Manufacturing in Industry

2021 ◽  
Vol 11 (2) ◽  
pp. 840 ◽  
Author(s):  
Roberto Citarella ◽  
Venanzio Giannella
Keyword(s):  
Additive Manufacturing ◽  
The Other ◽  
Structural Behavior ◽  
Manufacturing Processes ◽  
Structural Components ◽  
Special Issue ◽  
Concentration Effects ◽  
Fatigue And Fracture ◽  
Design Freedom ◽  
Am Processes

The advent of additive manufacturing (AM) processes applied to the fabrication of structural components has created the need for design methodologies and structural optimization approaches that take into account the specific characteristics of the fabrication process. While AM processes give unprecedented geometrical design freedom, which can result in significant reductions in the components’ weight (e.g., through part count reduction), on the other hand, they have implications for the fatigue and fracture strength, because of residual stresses and microstructural features. This is due to stress concentration effects, anisotropy, distortions and defects whose effects still need investigation. This Special Issue aims at gathering together research investigating the different features of AM processes with relevance for their structural behavior, particularly, but not exclusively, from the viewpoints of fatigue, fracture and crash behavior. Although the focus of this Special Issue is on AM, articles dealing with other manufacturing processes with related analogies can also be included, in order to establish differences and possible similarities.

Optical phase modulators using deformable waveguides actuated by micro-electro-mechanical systems

2011 ◽  
Vol 36 (7) ◽  
pp. 1089 ◽  
Author(s):  
Wei-Chao Chiu ◽  
Chun-Che Chang ◽  
Jiun-Ming Wu ◽  
Ming-Chang M. Lee ◽  
Jia-Min Shieh
Keyword(s):  
Mechanical Systems ◽  
Micro Electro Mechanical Systems ◽  
Optical Phase ◽  
Phase Modulators ◽  
Optical Phase Modulators

scholarly journals MODEL-BASED DESIGN OF AM COMPONENTS TO ENABLE DECENTRALIZED DIGITAL MANUFACTURING SYSTEMS

2021 ◽  
Vol 1 ◽  
pp. 2127-2136
Author(s):  
Olivia Borgue ◽  
John Stavridis ◽  
Tomas Vannucci ◽  
Panagiotis Stavropoulos ◽  
Harry Bikas ◽  
...  
Keyword(s):  
Additive Manufacturing ◽  
Manufacturing Systems ◽  
Production Systems ◽  
Data Generation ◽  
Production Networks ◽  
Model Based ◽  
Manufacturing Technologies ◽  
Am Processes ◽  
Final Consumer

AbstractAdditive manufacturing (AM) is a versatile technology that could add flexibility in manufacturing processes, whether implemented alone or along other technologies. This technology enables on-demand production and decentralized production networks, as production facilities can be located around the world to manufacture products closer to the final consumer (decentralized manufacturing). However, the wide adoption of additive manufacturing technologies is hindered by the lack of experience on its implementation, the lack of repeatability among different manufacturers and a lack of integrated production systems. The later, hinders the traceability and quality assurance of printed components and limits the understanding and data generation of the AM processes and parameters. In this article, a design strategy is proposed to integrate the different phases of the development process into a model-based design platform for decentralized manufacturing. This platform is aimed at facilitating data traceability and product repeatability among different AM machines. The strategy is illustrated with a case study where a car steering knuckle is manufactured in three different facilities in Sweden and Italy.

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