scholarly journals Three-Dimensional Magnetic Induction Tomography: Practical Implementation for Imaging throughout the Depth of a Low Conductive and Voluminous Body

Sensors ◽  
2021 ◽  
Vol 21 (22) ◽  
pp. 7725
Author(s):  
Martin Klein ◽  
Daniel Erni ◽  
Dirk Rueter
Keyword(s):  
Magnetic Induction ◽  
3D Imaging ◽  
Three Dimensional ◽  
Practical Implementation ◽  
Excitation Field ◽  
Technical Performance ◽  
Central Regions ◽  
Entire Depth ◽  
Magnetic Induction Tomography ◽  
Practical Demonstration

Magnetic induction tomography (MIT) is a contactless, low-energy method used to visualize the conductivity distribution inside a body under examination. A particularly demanding task is the three-dimensional (3D) imaging of voluminous bodies in the biomedical impedance regime. While successful MIT simulations have been reported for this regime, practical demonstration over the entire depth of weakly conductive bodies is technically difficult and has not yet been reported, particularly in terms of more realistic requirements. Poor sensitivity in the central regions critically affects the measurements. However, a recently simulated MIT scanner with a sinusoidal excitation field topology promises improved sensitivity (>20 dB) from the interior. On this basis, a large and fast 3D MIT scanner was practically realized in this study. Close agreement between theoretical forward calculations and experimental measurements underline the technical performance of the sensor system, and the previously only simulated progress is hereby confirmed. This allows 3D reconstructions from practical measurements to be presented over the entire depth of a voluminous body phantom with tissue-like conductivity and dimensions similar to a human torso. This feasibility demonstration takes MIT a step further toward the quick 3D mapping of a low conductive and voluminous object, for example, for rapid, harmless and contactless thorax or lung diagnostics.

scholarly journals Three-dimensional Magnetic Induction Tomography: Improved Performance for the Center Regions inside a Low Conductive and Voluminous Body

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1306
Author(s):  
Martin Klein ◽  
Daniel Erni ◽  
Dirk Rueter
Keyword(s):  
Magnetic Induction ◽  
Three Dimensional ◽  
Central Area ◽  
Electromagnetic Properties ◽  
Interior Region ◽  
Noise Floor ◽  
Sensitivity Map ◽  
Improved Performance ◽  
Magnetic Induction Tomography ◽  
Conductive Volume

Magnetic induction tomography (MIT) is a contactless technique that is used to image the distribution of passive electromagnetic properties inside a voluminous body. However, the central area sensitivity (CAS) of this method is critically weak and blurred for a low conductive volume. This article analyzes this challenging issue, which inhibits even faint imaging of the central interior region of a body, and it suggests a remedy. The problem is expounded via two-dimensional (2D) and three-dimensional (3D) eddy current simulations with different transmitter geometries. On this basis, it is shown that a spatially undulating exciter coil can significantly improve the CAS by >20 dB. Consequently, the central region inside a low conductive voluminous object becomes clearly detectable above the noise floor, a fact which is also confirmed by practical measurements. The improved sensitivity map of the new arrangement is compared with maps of more typical circular MIT geometries. In conclusion, 3D MIT reconstructions are presented, and for the same incidence of noise, their performance is much better with the suggested improvement than that with a circular setup.

Design and calibration of an IVEM for general 3-dimensional imaging of non-diffracting materials

1992 ◽  
Vol 50 (2) ◽  
pp. 1040-1041
Author(s):  
Neil Rowlands ◽  
Jeff Price ◽  
Michael Kersker ◽  
Seichi Suzuki ◽  
Steve Young ◽  
...  
Keyword(s):  
3D Imaging ◽  
Tomographic Reconstruction ◽  
Three Dimensional ◽  
3 Dimensional ◽  
3D Microstructure ◽  
Image Translation ◽  
Digital Correlation ◽  
On Line ◽  
Mechanical Stage ◽  
Projection Angle

Three-dimensional (3D) microstructure visualization on the electron microscope requires that the sample be tilted to different positions to collect a series of projections. This tilting should be performed rapidly for on-line stereo viewing and precisely for off-line tomographic reconstruction. Usually a projection series is collected using mechanical stage tilt alone. The stereo pairs must be viewed off-line and the 60 to 120 tomographic projections must be aligned with fiduciary markers or digital correlation methods. The delay in viewing stereo pairs and the alignment problems in tomographic reconstruction could be eliminated or improved by tilting the beam if such tilt could be accomplished without image translation.A microscope capable of beam tilt with simultaneous image shift to eliminate tilt-induced translation has been investigated for 3D imaging of thick (1 μm) biologic specimens. By tilting the beam above and through the specimen and bringing it back below the specimen, a brightfield image with a projection angle corresponding to the beam tilt angle can be recorded (Fig. 1a).

Inspection of defects in CFRP by improved magnetic induction tomography

2019 ◽  
Vol 61 (3) ◽  
pp. 255-259
Author(s):  
Lipan Zhang ◽  
Qifeng Meng ◽  
Kai Song ◽  
Ming Gao ◽  
Zhiyuan Cheng
Keyword(s):  
Magnetic Induction ◽  
Magnetic Induction Tomography

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

Image Reconstruction with the Fourier Coefficients for Magnetic Induction Tomography

2020 ◽  
Vol 16 (2) ◽  
pp. 156-163
Author(s):  
Jingwen Wang ◽  
Xu Wang ◽  
Dan Yang ◽  
Kaiyang Wang
Keyword(s):  
Inverse Problem ◽  
Image Reconstruction ◽  
Magnetic Induction ◽  
Fourier Coefficients ◽  
Signal Reconstruction ◽  
Reconstruction Algorithm ◽  
Reconstruction Method ◽  
Measurement Equation ◽  
Image Reconstruction Method ◽  
Magnetic Induction Tomography

Background: Image reconstruction of magnetic induction tomography (MIT) is a typical ill-posed inverse problem, which means that the measurements are always far from enough. Thus, MIT image reconstruction results using conventional algorithms such as linear back projection and Landweber often suffer from limitations such as low resolution and blurred edges. Methods: In this paper, based on the recent finite rate of innovation (FRI) framework, a novel image reconstruction method with MIT system is presented. Results: This is achieved through modeling and sampling the MIT signals in FRI framework, resulting in a few new measurements, namely, fourier coefficients. Because each new measurement contains all the pixel position and conductivity information of the dense phase medium, the illposed inverse problem can be improved, by rebuilding the MIT measurement equation with the measurement voltage and the new measurements. Finally, a sparsity-based signal reconstruction algorithm is presented to reconstruct the original MIT image signal, by solving this new measurement equation. Conclusion: Experiments show that the proposed method has better indicators such as image error and correlation coefficient. Therefore, it is a kind of MIT image reconstruction method with high accuracy.

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