scholarly journals Experimental Analysis of Pin- Fin By Varying Geometry and Material

2020 ◽  
Vol 9 (6) ◽  
pp. 704-709
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Convection Heat Transfer ◽  
Maximum Efficiency ◽  
Pin Fin ◽  
Cross Section Area ◽  
Section Area ◽  
Efficiency And Effectiveness ◽  
Specific Temperature ◽  
Effectiveness And Efficiency

This paper aims to investigate the performance of fin effectiveness, efficiency and to improve the heat dissipation characteristics by varying fin geometries and materials. Here the system flows natural convection and forced convection heat transfer. The greatest ‘h’ value will be acquired at a specific point by changing the velocity of the fluid. Acquiring maximum efficiency and effectiveness of the pin-fin apparatus can be accomplished at a specific temperature. In this cross-section area of fins are considered as constant. The heat conveyed along the length of the fin, Reynolds number, Nusselts number, Heat Transfer coefficient, Effectiveness and Efficiency of the fins were evaluated and compared with the fluid fluent (CFD) analysis

Heat Transfer Analysis of Solid and Perforated Fins in Regular Arrangement

2019 ◽  
Vol 16 (10) ◽  
pp. 4262-4265
Author(s):  
Rupesh Gupta ◽  
Varinder Singh ◽  
Sheifali Gupta ◽  
Deepali Gupta
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Heat Transfer Analysis ◽  
Pin Fin ◽  
Cross Section Area ◽  
Section Area ◽  
Regular Arrangement ◽  
Pin Fins ◽  
Extended Surfaces ◽  
Rectangular Chamber

Extended surfaces are widely used in various applications like aerospace parts design, cooling and also in solar collectors for effective dissipation of heat. The present paper gives us an idea about the heat transfer analysis for solid pin fin and perforated pin fins that are fitted in a rectangular chamber. The rectangular chamber has a cross section area of 300 * 200 mm2. It is concluded from the experiment that perforated pin fin always works better as compared to solid pin fin in all conditions. Moreover, for lower range of Reynolds number, solid pin fin performs better whereas for higher range of Reynolds number, perforated pin fin performs better as compared to circular pin fin.

Effect of Heat Sink Structure Improvement on Heat Dissipation Performance in High Heat Flux

2016 ◽  
Author(s):  
Zhuo Cui
Keyword(s):  
Heat Resistance ◽  
Water Flow ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Convection Heat Transfer ◽  
Cooling Water ◽  
High Heat Flux ◽  
Pin Fin ◽  
Pin Fins ◽  
Pin Fin Arrays

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.

Experimental and Numerical Investigation of Natural Convection Heat Transfer From Horizontal Rectangular Plate Fin Pin Fin Arrays

2020 ◽  
Author(s):  
Sunil V. Dingare ◽  
Narayan K. Sane ◽  
Ratnakar R. Kulkarni
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Natural Convection ◽  
Numerical Model ◽  
Convection Heat Transfer ◽  
Natural Convection Heat Transfer ◽  
Convection Heat ◽  
Pin Fin ◽  
Pin Fins ◽  
Fin Spacing

Abstract Fins are commonly employed for cooling of electronic equipment, compressors, Internal Combustion engines and for heat exchange in various heat exchangers. In short fin (length to height ratio, L/H = 5) arrays used for natural convection cooling, a stagnation zone forms at the central portion and that portion is not effective for carrying away heat. An attempt is made to modify plate fin heat sink geometry (PFHS) by inserting pin fins in the channels formed between plate fins and a plate fin pin fin heat sink (PFPFHS) is constructed to address this issue. An experimental setup is developed to validate numerical model of PFPFHS. The three-dimensional elliptic governing equations were solved using a finite volume based computational fluid dynamics (CFD) code. Fluent 6.3.26, a finite volume flow solver is used for solving the set of governing equations for the present geometry. Cell count based on grid independence and extended domain is used to obtain numerical results. Initially, the numerical model is validated for PFHS cases reported in the literature. After obtaining a good agreement with results from the literature, the numerical model for PFHS is modified for PFPFHS and used to carry out systematic parametric study of PFPFHS to analyze the effects of parameters like fin spacing, fin height, pin fin diameter, number of pin fins and temperature difference between fin array and surroundings on natural convection heat transfer from PFPFHS. It is observed that it is impossible to obtain optimum performance in terms of overall heat transfer by only concentrating on one or two parameters. The interactions among all the design parameters must be considered. This thesis presents Experimental and Numerical study of natural convection heat transfer from horizontal rectangular plate fin and plate fin pin fin arrays. The parameters of study are fin spacing, temperature difference between the fin surface and ambient air, fin height, pin fin diameter, number of pin fins and method of positioning pin fins in the fin channel. Experimental set up is validated with horizontal plate standard correlations. Results are generated in the form of variation in average heat transfer coefficient (ha), base heat transfer coefficient (hb), average Nusselt number (Nua) and base Nusselt number (Nub). Total 512 cases are studied numerically and finally an attempt is made to correlate the Nusselt Number (Nu), Rayleigh Number (Ra), increase in percentage by inserting pin fins (% Area), ratios like spacing to height (S/H) and L/H obtained in the present study.

scholarly journals Effect of an axial hole on natural convection heat transfer from a cylindrical pin fin attached to a horizontal plate

2018 ◽  
Vol 22 (6 Part A) ◽  
pp. 2493-2502
Author(s):  
Saurav Manna ◽  
Subhas Haldar ◽  
Subrata Ghosh
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Convection Heat Transfer ◽  
Base Plate ◽  
Hole Diameter ◽  
Natural Convection Heat Transfer ◽  
Convection Heat ◽  
Horizontal Plate ◽  
Pin Fin ◽  
Laminar Natural Convection

Heat transfer under laminar natural convection from a hollow cylindrical fin mounted on a horizontal base plate has been numerically studied. The flow outside the fin is much stronger than that inside the hole and as a consequence the rate of heat transfer from a hollow fin is primarily due to the contribution by the outer surface of the fin. Fortunately, the rate of heat transfer is not negatively affected by the presence of the hole at the fin centre. On the contrary, when the Grashof number is higher or the hole diameter is bigger, the inside surface contributes marginally to the heat transfer. A hollow fin saves material and weighs less compared to a solid fin. So, this feature may be exploited.

Effect of Inclined Angle of Radiator on Natural Convective Heat Dissipation Performance

2019 ◽  
Author(s):  
Tengfei Ma ◽  
Wen Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Transfer Coefficient ◽  
Natural Convection ◽  
Heat Dissipation ◽  
Deflection Angle ◽  
Experimental Conditions ◽  
Pin Fin ◽  
Inclined Angle ◽  
Gravity Direction

Abstract The effects of inclined angle on the heat transfer of radiators under natural convection are analyzed with experiment and numerical simulation, there are three radiators with straight fin, oblique fin and pin fin respectively (based on 150 × 150 × 45mm). The numerical simulation could agree with the experiment. The straight fin radiator could provide the best heat dissipation performance under experimental conditions and normal installation angle. The pin fin radiator has the largest heat transfer coefficient, around 7 W/m2·K. The influence of deflection angle is discussed on the heat dissipation capability of the radiator. The heat dissipation of the pin fin radiator is less sensitive to the gravity direction than the straight fin and oblique fin ones.

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Yuanchen Hu ◽  
Md Obaidul Hossen ◽  
Zhimin Wan ◽  
Muhannad S. Bakir ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit ◽  
High Performance ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Removal ◽  
Power Estimation ◽  
Leakage Power ◽  
Pin Fin ◽  
Pin Fins

Abstract Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation bottleneck due to the increased volumetric heat generation and reduced surface area. Previous work demonstrated that pin-fin enhanced microgap cooling, which provides fluidic cooling between layers could potentially address the heat dissipation challenge. In this paper, a compact multitier pin-fin single-phase liquid cooling model has been established for both steady-state and transient conditions. The model considers heat transfer between layers via pin-fins, as well as the convective heat removal in each tier. Spatially and temporally varying heat flux distribution, or power map, in each tier can be modeled. The cooling fluid can have different pumping power and directions for each tier. The model predictions are compared with detailed simulations using computational fluid dynamics/heat transfer (CFD/HT). The compact model is found to run 120–600 times faster than the CFD/HT model, while providing acceptable accuracy. Actual leakage power estimation is performed in this codesign model, which is an important contribution for codesign of 3D-SICs. For the simulated cases, temperatures could decrease 3% when leakage power estimation is adopted. This model could be used as electrical-thermal codesign tool to optimize thermal management and reduce leakage power.

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