scholarly journals SOFTWARE FOR THE THERMAL FIELD CALCULATION IN 3D MODELS OF SEMICONDUCTOR DEVICES

2020 ◽  
Vol 256 (1) ◽  
pp. 49-56
Author(s):  
A.A. Vasilevskiy ◽  
K.A. Ivanov ◽  
E.S. Konsentsiush ◽  
An.V. Redka
Keyword(s):  
Solid State ◽  
Thermal Model ◽  
Thermal Field ◽  
Semiconductor Devices ◽  
3D Models ◽  
Model Testing ◽  
Field Calculation

In this paper we demonstrate the performance of the software designed for thermal model testing of solid-state microwave modules and compare it with the similar software ANSYS Icepak.

Technological Features of the Liquid-Solid State of the Boundary Layer in the Processes of Bimetallic Products

2022 ◽  
Vol 1049 ◽  
pp. 53-61
Author(s):  
Valeriy Lykhoshva ◽  
Dmitry Glushkov ◽  
Elena Reintal ◽  
Valeriy V. Savin ◽  
Ludmila Alexeyevna Savina ◽  
...  
Keyword(s):  
Mathematical Modeling ◽  
Experimental Data ◽  
Boundary Layer ◽  
Solid State ◽  
Liquid Phase ◽  
Contact Zone ◽  
Thermal Field ◽  
Thermal State ◽  
Existence Time ◽  
Modeling Data

The hydrodynamic and thermal state in the contact zone of the layers of a bimetallic product obtained by pouring liquid iron onto a solid steel billet, which changes in time and is responsible for the strength of the diffusion joint and the geometric parameters of the transition layer, has been investigated. Simplified analytical dependences, mathematical modeling data and experimental results of the liquid phase existence time in the contact zone based on research of the melt velocities during pouring and changes in the thermal field are presented. It is shown that simplified calculations data coincide in order and are close in values ​​to the calculations of mathematical modeling and experimental data, which makes it possible to use them for preliminary rough estimates by technologists and metallurgists.

SOME ASPECTS OF THERMAL MODEL TESTING IN SPACE CHAMBERS

1967 ◽  
Author(s):  
K. W. Nutt ◽  
J. A. van der Bliek
Keyword(s):  
Thermal Model ◽  
Model Testing

A Real-Time Thermal Model for Monitoring of Power Semiconductor Devices

2015 ◽  
Vol 51 (4) ◽  
pp. 3361-3367 ◽  
Author(s):  
Tanya Kirilova Gachovska ◽  
Bo Tian ◽  
Jerry L. Hudgins ◽  
Wei Qiao ◽  
John F. Donlon
Keyword(s):  
Real Time ◽  
Thermal Model ◽  
Semiconductor Devices ◽  
Power Semiconductor ◽  
Power Semiconductor Devices

Distributed and coupled 2D electro-thermal model of power semiconductor devices

2014 ◽  
Vol 66 (2) ◽  
pp. 20102 ◽  
Author(s):  
Ghania Belkacem ◽  
Stéphane Lefebvre ◽  
Pierre-Yves Joubert ◽  
Mounira Bouarroudj-Berkani ◽  
Denis Labrousse ◽  
...  
Keyword(s):  
Thermal Model ◽  
Semiconductor Devices ◽  
Power Semiconductor ◽  
Power Semiconductor Devices

Numerical Modeling of Thermal Field Distribution during Friction Stir Welding (FSW) of Dissimilar Materials

2016 ◽  
Vol 254 ◽  
pp. 261-266
Author(s):  
Bogdan Radu ◽  
Cosmin Codrean ◽  
Radu Cojocaru ◽  
Cristian Ciucă
Keyword(s):  
Numerical Modeling ◽  
Friction Stir Welding ◽  
Solid State ◽  
Thermal Field ◽  
Welding Process ◽  
Dissimilar Materials ◽  
Dissimilar Joints ◽  
Element Analysis ◽  
Friction Stir ◽  
The Cost

Friction Stir Welding (FSW) is an innovative solid state welding process, relatively new in industry, which allow welding of two or more materials which have very different properties, particularly thermal properties as fusion temperature, thermal expansion coefficient, specific heat and thermal conduction and have a predisposition to form intermetallic brittle phases, neither one of the components to be weld reach to the melting point. Being a solid state welding process temperature field is very important for the quality of the welded joint, and a lot of researches focused on this topic. This paper presents some results in modeling and estimation of thermal field developed during FSW of dissimilar joints, using Finite Element Analysis. Numerical modeling of thermal field allows engineers to predict, in advance, the evolution of temperature and to estimate the behavior of the welded materials during the welding process. This will reduce significantly the time and number of experiments that have to be carried out, in the process of establishing a good FSW technology, as well as reducing significantly the cost of the tests.

Thermal field calculation in a horizontal profile of exterior walls

2018 ◽  
Vol 1 ◽  
pp. 23-29
Author(s):  
Alexander Kravchuk ◽  
Anzhelika Kravchuk ◽  
Ivan Tarasyuk
Keyword(s):  
Thermal Field ◽  
Field Calculation

Thermal-Field Experimental Study of a Thin Circular Carbon-Fiber Tube in Stratosphere Environment

2011 ◽  
Vol 189-193 ◽  
pp. 1027-1030
Author(s):  
Fen Bo Pei ◽  
Guo Quan Tao ◽  
Zhe Wu
Keyword(s):  
Heat Transfer ◽  
Thermal Model ◽  
Thermal Field ◽  
Thermal State ◽  
Radiant Heat ◽  
Radiant Heat Transfer ◽  
The Sun ◽  
Coupling Problem ◽  
Whole Process ◽  
And Performance

The changeable, atrocious environment of stratosphere affects the capability and performance of the structure. An effective and economical approach used to analyze thermal state of stratospheric aerostat was investigated in this study. A simplified thermal model was built in environmental experiment which simulates stratosphere and takes radiation of the sun, air and earth. This model solved a coupling problem of heat conduction, heat convection and radiant heat transfer and obtained a pleasant result through numerical simulations of Fluent. The whole process makes great effect to further analysis and study of stratospheric structure.

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