Research and Application of Output Spectrum of Parallel Five-Microring Resonator Frequency Band

2018 ◽  
Vol 55 (3) ◽  
pp. 032302
Author(s):  
连乐 Lian Le ◽  
付杰 Fu Jie ◽  
杨超山 Yang Chaoshan ◽  
韩根亮 Han Genliang
2009 ◽  
Vol 23 (20n21) ◽  
pp. 2471-2481
Author(s):  
YUHAI WANG ◽  
CHUNSHENG MA ◽  
XIN YAN ◽  
DAMING ZHANG

Formulas for the transfer function and the output power gain are presented for an Er 3+/ Yb 3+ codoped series-cascaded double microring resonator (MRR). Around the pumping wavelength of 974 nm and the central signal wavelength of 1530 nm, the effects of the pump power, signal power, Er 3+/ Yb 3+ dopant concentrations and amplitude coupling ratios on the signal output spectrum are analyzed. The computed results show that the device can possess both the filtering and amplifying functions for the signal light. In the case of the amplitude coupling ratio between the microring and the channel being 0.17, and that between two microrings being 0.012, the device can produce more than 10.13 dB signal power gain.


2020 ◽  
Vol E103.C (11) ◽  
pp. 588-596
Author(s):  
Masamune NOMURA ◽  
Yuki NAKAMURA ◽  
Hiroo TARAO ◽  
Amane TAKEI

2014 ◽  
Vol 73 (11) ◽  
pp. 993-1003 ◽  
Author(s):  
R. V. Golovashchenko ◽  
V. N. Derkach ◽  
M. K. Zaetz ◽  
V. G. Korzh ◽  
A. S. Plevako ◽  
...  
Keyword(s):  

2008 ◽  
Vol 67 (13) ◽  
pp. 1207-1215 ◽  
Author(s):  
V. K. Kiselyov ◽  
M. S. Yanovsky ◽  
V. I. Bezborodov ◽  
Ye. M. Kuleshov

Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


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