Smart Automotive Systems Supported by Configurable FPGA, IoT, and Artificial Intelligence Techniques

2020 ◽  
pp. 108-132
Author(s):  
S. Saravanan
Keyword(s):  
Artificial Intelligence ◽  
Network Information ◽  
Automotive Systems ◽  
Control Units ◽  
Field Programmable ◽  
Pros And Cons ◽  
Assistance Systems ◽  
Essential Knowledge ◽  
Intelligent Assistance ◽  
Dedicated Hardware

Modern vehicles are very complex by incorporating various computational signals and critical information transactions. Electronic control units (ECUs) are embedded with various software functions, network information, sensor/actuator communication, and dedicated hardware. Altogether, the special hardware needs to be adaptable to the current needs of next-generation vehicles. This chapter will give a broad idea about modern automotive systems by considering various factors. Finding the best reconfigurable field programmable gate array (FPGA)-based hardware, intelligent assistance systems for drivers and various communication protocols are elaborated in this chapter. Moreover, it also provides the essential knowledge of IoT-based smart automotive systems along with its pros and cons. This chapter also gives the awareness and comparative study of artificial intelligence (AI) systems in the present smart automotive systems. The overall observation of this chapter will satisfy the audience by knowing the reconfigurable FPGA, IoT, and artificial intelligence-based automotive systems.

scholarly journals The Pros & Cons of Business Innovation at IT Organizations

2019 ◽  
Vol 7 (1) ◽  
pp. 82-85
Author(s):  
Geetha Swaminathan
Keyword(s):  
Artificial Intelligence ◽  
Machine Learning ◽  
Information Technology ◽  
Cloud Computing ◽  
New Technologies ◽  
Global Market ◽  
Innovative Product ◽  
Business Innovation ◽  
It Organization ◽  
Pros And Cons

In the 21st Century, the buzzword is often used in all fields is “Innovation". It is no wonder using Innovation in day to the conversation as well as striving for innovation execution at organisations in Information Technology (IT) sectors. When we need to talk about innovation in IT sectors in the fast-moving technology IT organisations, they are in a position in increasing its capability in its innovative product and services. There is a lot of benefits out of business innovations that are being reaped in IT companies; there are apparent disadvantages are also the outcome of them. It is quite common, despite all benefits and drawbacks, they are in apposition to survive in the global market. That becomes a great challenge to all IT organisations. In IT organisations which consist of departments such as Development, Testing, Consulting, Networking, Infrastructure, Process and having common platforms and legacy languages, Apart from that they are in the way of invading new technologies such as Digital, Mobile, IoT, Artificial Intelligence, Machine learning Cloud computing. In all the fields, as mentioned above and area, they need to do innovation to sustain their business. This paper will provide elaborate results on Pros and Cons of Business Innovation in IT Organization.

Intelligent Assistance Systems for Marketing Decisions

2020 ◽  
pp. 70-82
Author(s):  
Mirela Dogaru ◽  
Dumitru Alexandru Stoica ◽  
Aurelian Vânceanu
Keyword(s):  
New Technology ◽  
Market Requirements ◽  
Assistance Systems ◽  
Continuous Use ◽  
Intelligent Assistance

Today's technology has evolved greatly and influences us in different ways, more or less beneficial, depending on each user and the needs of each consumer. It has a beneficial influence on organizations, thanks to the continuous use of technologies being as innovative and topical as possible. So organizations need to keep pace and adapt to new technology requirements to thrive in their environment business and to be aware of market requirements. The role of marketing is to grasp the unfulfilled needs of people and to create new and attractive solutions.

Advancements in Flip Chip Assembly Equipment and Processes

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001328-001358 ◽  
Author(s):  
Bob Chylak ◽  
Horst Clauberg ◽  
Daniel Buergi
Keyword(s):  
Flip Chip ◽  
First Generation ◽  
Standard Process ◽  
Productivity Improvement ◽  
Gate Arrays ◽  
Fine Pitch ◽  
Field Programmable ◽  
Programmable Gate Arrays ◽  
Pros And Cons ◽  
Bonding Method

High I/O devices such as microprocessors, applications processors and field programmable gate arrays have transitioned from wire bonding to flip chip interconnect as the I/O densities have increased above 2000. As the bump pitch shrinks the standard process flow for production flip chip processes is challenged. As the bump pitch continues to shrink the accuracy of standard flip chip bonders is not adequate for the fine pitch packages of tomorrow. The options to resolve this issue are extending the accuracy for standard flip chip bonders or moving the assembly of these packages to the inherently more accurate thermo-compression bonders. This paper will discuss the pros and cons of each approach along with showing data which indicates what accuracies are actually required. Although substrate manufacturers have developed low CTE designs which mitigate the warpage caused by the mismatch between the Si die and the substrate as the assembled package travels through the reflow oven, warpage at finer pitches is becoming more and more difficult to control in flip chip processes. Thermocompression (TC) bonding is seen as the next-generation packaging technology that will resolve this issue through local reflow of the solder and elimination of the reflow oven. Despite the tremendous technical and quality advantages of TC bonding, adoption has been limited by the relatively low throughput of the first generation thermocompression bonders. In this paper we describe bonding results obtained with an innovative flip chip bonding method to optimize the process to dramatically improve the throughput by applying flux directly to the substrate rather than dipping the pillars in a bath. A study of this process and comparison of various methods of accomplishing it along with their related costs are discussed in the paper. A second large productivity improvement that is promising by eliminating the need for cooling the die before transferring die that has pre-applied underfill film laminated to it is also studied with productivity models developed. Finally a unique equipment concept for managing the transition from mass reflow to thermo-compression bonding will be presented.

scholarly journals Mixed-Method Design for User Behavior Evaluation of Automated Driver Assistance Systems: An Automotive Industry Case

2019 ◽  
Vol 1 (1) ◽  
pp. 1803-1812 ◽  
Author(s):  
Julia Orlovska ◽  
Fjolle Novakazi ◽  
Casper Wickman ◽  
Rikard Soderberg
Keyword(s):  
Automotive Industry ◽  
User Behavior ◽  
Driver Assistance ◽  
Driver Assistance Systems ◽  
Subjective Data ◽  
Automotive Systems ◽  
Mixed Method Design ◽  
Stressful Experience ◽  
Assistance Systems ◽  
Depth Interviews

AbstractAutomotive systems are changing rapidly from purely mechanical to smart, programmable assistants. These systems react and respond to the driving environment and communicate with other subsystems for better driver support and safety. However, instead of supporting, the complexity of such systems can result in a stressful experience for the driver, adding to the workload. Hence, a poorly designed system, from a usability and user experience perspective, can lead to reduced usage or even ignorance of the provided functionalities, especially concerning Adaptive Driver Assistance Systems.In this paper, the authors propose a combined design approach for user behavior evaluation of such systems. At the core of the design is a mixed methods approach, where objective data, which is automatically collected in vehicles, is augmented with subjective data, which is gathered through in- depth interviews with end-users. The aim of the proposed methodology design is to improve current practices on user behavior evaluation, achieve a deeper understanding of driver's behavior, and improve the validity and rigor of the named results.

Ambient Intelligence Environments

2011 ◽  
pp. 92-98 ◽  
Author(s):  
Carlos Ramos
Keyword(s):  
Artificial Intelligence ◽  
Embedded Systems ◽  
Ambient Intelligence ◽  
New World ◽  
Physical World ◽  
Human Being ◽  
Human Machine Interaction ◽  
Artificial Intelligence Research ◽  
Essential Knowledge ◽  
Machine Interaction

The trend in the direction of hardware cost reduction and miniaturization allows including computing devices in several objects and environments (embedded systems). Ambient Intelligence (AmI) deals with a new world where computing devices are spread everywhere (ubiquity), allowing the human being to interact in physical world environments in an intelligent and unobtrusive way. These environments should be aware of the needs of people, customizing requirements and forecasting behaviours. AmI environments may be so diverse, such as homes, offices, meeting rooms, schools, hospitals, control centers, transports, touristic attractions, stores, sport installations, and music devices. Ambient Intelligence involves many different disciplines, like automation (sensors, control, and actuators), human-machine interaction and computer graphics, communication, ubiquitous computing, embedded systems, and, obviously, Artificial Intelligence. In the aims of Artificial Intelligence, research envisages to include more intelligence in the AmI environments, allowing a better support to the human being and the access to the essential knowledge to make better decisions when interacting with these environments

scholarly journals RISC Conversions for LNS Arithmetic in Embedded Systems

Mathematics ◽  
2020 ◽  
Vol 8 (8) ◽  
pp. 1208 ◽  
Author(s):  
Peter Drahoš ◽  
Michal Kocúr ◽  
Oto Haffner ◽  
Erik Kučera ◽  
Alena Kozáková
Keyword(s):  
Embedded Systems ◽  
Number System ◽  
Real Time Control ◽  
Gate Arrays ◽  
Time Control ◽  
Camera Systems ◽  
Control Units ◽  
Field Programmable ◽  
Programmable Gate Arrays ◽  
Logarithmic Number

The paper presents an original methodology for the implementation of the Logarithmic Number System (LNS) arithmetic, which uses Reduced Instruction Set Computing (RISC). The core of the proposed method is a newly developed algorithm for conversion between LNS and the floating point (FLP) representations named “looping in sectors”, which brings about reduced memory consumption without a loss of accuracy. The resulting effective RISC conversions use only elementary computer operations without the need to employ multiplication, division, or other functions. Verification of the new concept and related developed algorithms for conversion between the LNS and the FLP representations was realized on Field Programmable Gate Arrays (FPGA), and the conversion accuracy was evaluated via simulation. Using the proposed method, a maximum relative conversion error of less than ±0.001% was achieved with a 22-ns delay and a total of 50 slices of FPGA consumed including memory cells. Promising applications of the proposed method are in embedded systems that are expanding into increasingly demanding applications, such as camera systems, lidars and 2D/3D image processing, neural networks, car control units, autonomous control systems that require more computing power, etc. In embedded systems for real-time control, the developed conversion algorithm can appear in two forms: as RISC conversions or as a simple RISC-based logarithmic addition.

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