Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

2007 ◽  
pp. 2115-2118
Author(s):  
Yun Fu ◽  
Qi Zhang ◽  
Feng Sun ◽  
Hao Yu Bai
Keyword(s):  
Solder Joint ◽  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

2007 ◽  
Vol 561-565 ◽  
pp. 2115-2118
Author(s):  
Yun Fu ◽  
Qi Zhang ◽  
Feng Sun ◽  
Hao Yu Bai
Keyword(s):  
Solder Joint ◽  
Intermetallic Compounds ◽  
Aging Time ◽  
Isothermal Aging ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Cu6sn5 Layer ◽  
Free Solder

The growth and morphology of the intermetallic compounds (IMC) formed at the interface between the solder ( Sn–3.5Ag–0.5Cu ) and the Cu substrate of the lead - free solder joint have been investigated by means of isothermal aging at 125°C. The scalloped Cu6Sn5 intermetallic compound layer was formed at the interface between the solder and Cu substrate upon reflow. The thickness of Cu6Sn5 layer increased with aging time. Cu3Sn appeared between Cu6Sn5 layer and Cu substrate when isothermally aged for 100 hours. Compare to Cu6Sn5 , the thickness of Cu3Sn was rather low, and nearly did not increase with aging time. In this paper, the comparison was made among the Sn-Pb and the Sn-Ag-Cu(SAC) solders which were pre-treated differently before soldering.

A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint

2018 ◽  
Vol 941 ◽  
pp. 2087-2092
Author(s):  
Yusuke Nakata ◽  
Motoki Kurasawa ◽  
Tomihito Hashimoto ◽  
Kenji Miki ◽  
Ikuo Shohji
Keyword(s):  
Solder Joint ◽  
Intermetallic Compounds ◽  
Thermal Cycle ◽  
The Other ◽  
Lead Free ◽  
Lead Free Solder ◽  
Large Area ◽  
Longitudinal Elastic Modulus ◽  
Free Solder ◽  
The Ideal

A pillar shaped intermetallic compounds (IMCs) dispersed solder joint is a highly durable joint to achieve large area joining. The aim of this study is to investigate the ideal dispersion amount of pillar shaped IMCs. The dispersion rate of pillar shaped IMCs depend on the joining temperature. Pillar shaped IMCs dispersion rates are 3.5% and 5.5% when the joining temperature are 300 °C and 330 °C, respectively. Longitudinal elastic modulus are improved by forming pillar shaped IMCs. As a result of examination of the durability by the thermal cycle test, the durability of the joint with the dispersion rate of 3.5% was similar to that without pillar shaped IMCs, while that with the dispersion rate of 5.5% was remarkably improved. In the case of the dispersion rate of 3.5%, pillar shaped IMCs unevenly distributed and cracks tend to progress. On the other hand, in the case of the dispersion rate of 5.5%, pillar shaped IMCs were uniformly dispersed throughout the joint and suppressed crack propagation. Comparison of durability between pillar shaped IMCs solder and indium added solder to verify the effect of pillar shaped IMCs demonstrated that pillar shaped IMCs solder were more durable than indium added solder.

Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes

2012 ◽  
Author(s):  
Nor Akmal Fadil ◽  
Ali Ourdjini ◽  
Azmah Hanim Mohamed Ariff ◽  
Siti Rabiatul Aisha Idris
Keyword(s):  
Intermetallic Compounds ◽  
Surface Finish ◽  
Isothermal Aging ◽  
Flip Chip ◽  
Electroless Nickel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Under Bump Metallization ◽  
Surface Finishes ◽  
Free Solder

Teknologi flip chip memberikan ketumpatan I/O yang sangat tinggi dan mengambil kira prestasi elektrikal yang paling baik dalam penyambungan komponen elektronik. Oleh itu, kajian tentang sebatian antara logam dilaksanakan untuk mengkaji kesan saiz bebola pateri bagi beberapa penyudahan permukaan, iaitu Kuprum dan Nikel tanpa elektrod/Palladium tanpa elektrod/Emas rendaman (ENEPIG). Pelogaman di bawah pateri (UBM) Ni/Pd/Au bagi aplikasi flip chip digunakan dengan sangat meluas dalam pembungkusan elektronik. Analisis FESEM dilakukan untuk menganalisis morfologi dan komposisi bagi sebatian antara logam (IMC). IMC yang terbentuk antara pateri Sn–Pb dan tanpa Pb dengan penyudahan permukaan kuprum semasa proses pematrian logam secara umumnya adalah (Cu, Ni)6Sn5 dan Cu6Sn5 dan Cu6Sn5. Sementara IMC utama yang terbentuk antara pateri Sn–Pb dan tanpa Pb dengan penyudahan permukaan ENEPIG adalah (Ni, Cu)3Sn4 dan Ni3Sn4. Hasil daripada analisis morfologi menggunakan FESEM dengan EDX menyatakan penuaan sesuhu pada suhu 150°C menyebabkan penebalan dan pengasaran struktur IMC serta menjadikan bentuknya kepada lebih sfera. Tebal IMC bagi kedua–dua penyudahan yang dikaji adalah lebih tinggi bagi bebola patri yang lebih kecil. Daripada hasil kajian juga, didapati bahawa kadar pertumbuhan IMC adalah lebih tinggi apabila pematrian dilakukan atas penyudahan kuprum berbanding ENEPIG. Hasil kajian juga menunjukkan ketebalan IMC adalah berkadaran dengan masa penuaan sesuhu. Kata kunci: Flip chip; Kumprum dan Nikel tanpa elektrod; Palladium tanpa elektrod; Emas rendaman (ENEPIG); Pelogaman di bawah pateri (UMB) Ni/Pd/Au Flip chip technology provides the ultimate in high I/O–density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) which is widely used in electronics packaging as under–bump metallization (UBM) for flip–chip application nowadays. In this research, field emission scanning electron microscopy (FE–SEM) analyses were conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between Sn–Pb and lead–free solder with Cu surface finish during reflowing were mainly (Cu, Ni)6Sn5 dan Cu6Sn5. While the main IMCs formed between Sn–Pb and lead–free solder on ENEPIG surface finish are (Ni, Cu)3Sn4 and Ni3Sn4. The results from FESEM with energy dispersive x–ray (EDX) have revealed that isothermal aging at 150°C has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated ware found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. Key words: Electroless nickel; electroless palladium; immersion gold (ENEPIG); flip chip; Ni/Pd/Au Under–bump metallization (UMB)

IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages

2009 ◽  
Vol 6 (2) ◽  
pp. 119-124 ◽  
Author(s):  
Sang Ha Kim ◽  
Hiroshi Tabuchi ◽  
Chika Kakegawa ◽  
Han Park
Keyword(s):  
Solder Joint ◽  
Isothermal Aging ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Surface Finishes ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Free Solder

Intermetallic compound (IMC) growth behavior of lead-free solder plays an important role in ball grid array (BGA) solder joint reliability for flip chip BGA (FCBGA) packaging applications. The growth mechanism of IMC is reported based on a diffusion model. Thermal treatment such as accelerated thermal cycling (ATC) and isothermal aging exposure also contribute to the growth rate and morphology of lead-free solder IMC. Among the lead-free solder alloys, Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) solder is a promising substitute for Sn-Pb because of its good mechanical properties and wettability with current surface finishes. After thermal exposure, BGA solder joint reliability is degraded due to IMC formation and growth. In this study, two different thermal treatments, ATC and isothermal aging, and two different pad surface finishes, solder on pad (SOP) and electroless Ni immersion gold (ENIG), are considered in terms of IMC growth rate and mechanical solder joint reliability. An SOP finished interface forms a thin ε-phase Cu3Sn layer and a scallop-like η-phase Cu6Sn5 layer. In contrast, the ENIG finished interface forms a thick (Cu,Ni)6Sn5 IMC layer and prevents overall IMC growth. Different surface finished test vehicles are evaluated in an ATC test in a 0°C to 100°C temperature range and the Ni diffusion layer shows a longer solder joint fatigue lifetime than the nondiffusion barrier interface based on the micro cross-section and dye penetration analysis results. In an isothermal aging test at 100°C and 150°C, the aging temperature and time are valid factors to decide mechanical shock reliability. Interfacial fractures are found in the 100°C aged test vehicle due to easier crack propagation at the interface between the thin Cu3Sn layer and the scallop-like Cu6Sn5 layer based on SEM microstructure analysis results. Finally, this investigation proposes how to improve solder joint reliability and prevent interfacial fracture for SAC305 lead-free application.

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