The Pressure Design of Wet Shift Clutch Based on Thermoelastic Instability Analysis

2013 ◽  
Vol 288 ◽  
pp. 287-295
Author(s):  
Xian Quan Zhang ◽  
He Yan Li ◽  
Chang Song Zheng ◽  
Jia Xin Zhao ◽  
Biao Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Dynamic Pressure ◽  
Calculation Model ◽  
Pressure Amplitude ◽  
Conduction Model ◽  
Friction Materials ◽  
Pressure Calculation ◽  
Perturbation Pressure ◽  
Shift Clutch

This paper investigated the dynamic pressure distribution on the plates within a wet shift clutch in hydrodynamic machineries for one engagement. The perturbation pressure model, heat conduction model and pressure calculation model excited by thermoealstic instability was developed. And wrote calculation programs with Maple 15 to analyze the influence of two kinds of typical friction materials, different thermal conductivity, different initial engagement speed on perturbation pressure amplitude and its impact on the pressure design margin and design radius. The results show that the margin can be decreased and design radius can be reduced, so power density increased. When the slipping speed is controlled within 16m /s, the radius can be reduced to about 1/2 of the original value.

scholarly journals Constructal Design of an Arrow-Shaped High Thermal Conductivity Channel in a Square Heat Generation Body

Entropy ◽  
2020 ◽  
Vol 22 (4) ◽  
pp. 475 ◽  
Author(s):  
Fengyin Zhang ◽  
Huijun Feng ◽  
Lingen Chen ◽  
Jiang You ◽  
Zhihui Xie
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Heat Generation ◽  
Degrees Of Freedom ◽  
High Thermal Conductivity ◽  
Maximum Temperature ◽  
Thermal Conductivity Ratio ◽  
Maximum Temperature Difference ◽  
Conduction Model ◽  
Three Degrees Of Freedom

A heat conduction model with an arrow-shaped high thermal conductivity channel (ASHTCC) in a square heat generation body (SHGB) is established in this paper. By taking the minimum maximum temperature difference (MMTD) as the optimization goal, constructal designs of the ASHTCC are conducted based on single, two, and three degrees of freedom optimizations under the condition of fixed ASHTCC material. The outcomes illustrate that the heat conduction performance (HCP) of the SHGB is better when the structure of the ASHTCC tends to be flat. Increasing the thermal conductivity ratio and area fraction of the ASHTCC material can improve the HCP of the SHGB. In the discussed numerical examples, the MMTD obtained by three degrees of freedom optimization are reduced by 8.42% and 4.40%, respectively, compared with those obtained by single and two degrees of freedom optimizations. Therefore, three degrees of freedom optimization can further improve the HCP of the SHGB. Compared the HCPs of the SHGBs with ASHTCC and the T-shaped one, the MMTD of the former is reduced by 13.0%. Thus, the structure of the ASHTCC is proven to be superior to that of the T-shaped one. The optimization results gained in this paper have reference values for the optimal structure designs for the heat dissipations of various electronic devices.

Thermal Conductivity of Nanochanneled Alumina

2000 ◽  
Author(s):  
A. R. Kumar ◽  
D.-A. Achimov ◽  
T. Zeng ◽  
G. Chen
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Experimental Study ◽  
Heat Conduction ◽  
Room Temperature ◽  
Conduction Model ◽  
Heat Conduction Model ◽  
Anisotropic Heat Conduction ◽  
3Ω Technique

Abstract We present an experimental study on the thermal conductivity of anodized alumina with regular nanochannels. Thermal conductivity values in both directions parallel and perpendicular to the nanochannel axis are measured at room temperature using the 3ω technique. An anisotropic heat conduction model is developed to analyze the experimental data.

Analysis of Heat and Moisture Transfer Beneath Freezer Foundations-Part II

2004 ◽  
Vol 126 (2) ◽  
pp. 726-731 ◽  
Author(s):  
Moncef Krarti ◽  
Pirawas Chuangchid ◽  
Pyeongchan Ihm
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Numerical Solution ◽  
Moisture Transfer ◽  
Temperature Profiles ◽  
Two Dimensional ◽  
Soil Thermal Conductivity ◽  
Heat And Moisture Transfer ◽  
Conduction Model ◽  
Heat And Moisture

This paper discusses selected results from a numerical solution of two-dimensional heat and moisture transfer within frozen and unfrozen soils beneath freezer slab foundations. In particular, the numerical solution is used to determine soil temperature profiles as well as freezer foundation heat gains. Finally, an effective soil thermal conductivity is successfully utilized in a pure heat conduction model to predict ground-coupled heat gains for freezers.

scholarly journals Effects of anisotropic composite skin on electrothermal anti-icing system

2019 ◽  
Vol 233 (14) ◽  
pp. 5403-5413 ◽  
Author(s):  
Xiaobin Shen ◽  
Xiaochuan Liu ◽  
Guiping Lin ◽  
Xueqin Bu ◽  
Dongsheng Wen
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Water Film ◽  
Transfer Model ◽  
Anisotropy Axis ◽  
Mass Model ◽  
Conduction Model ◽  
Anisotropic Thermal Conductivity ◽  
Anisotropic Heat Conduction ◽  
Heat And Mass Model

To study the effects of anisotropic thermal conductivity of composite aircraft skin on the heat transfer characteristics of electrothermal anti-icing system, the differential equation of anisotropic heat conduction was established using coordinate transformation of principal anisotropy axis. In addition, it was coupled with the heat and mass transfer model of the runback water film on the anti-icing surface to perform numerical simulation of the electrothermal anti-icing system. The temperature results of the vertical and cylindrical orthotropic thermal conduction in the rectangular and semi-cylindrical composite skin were consistent with those obtained by the traditional orthotropic model, which verified the anisotropic heat conduction model. The temperature distribution of anti-icing surface agreed well with the literature data, which validated the coupled heat and mass model of the runback water flow and the anisotropic skin. The anisotropic thermal conductivity of composite skin would make temperature change more gradual, and the effect was more significant where the curvature of the temperature curve was greater. However, the anti-icing surface of the electrothermal anti-icing system was slightly affected by the anisotropic heat conduction of the multilayered composite skin.

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

2016 ◽  
Vol 138 (4) ◽  
Author(s):  
Cheng Chen ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Lattice Boltzmann Method ◽  
Lattice Boltzmann ◽  
Boltzmann Transport ◽  
Conduction Model ◽  
Total Energy Density ◽  
Diffusion Term ◽  
Boltzmann Method ◽  
The Impact

In this paper, a lattice Boltzmann method (LBM)-based model is developed to simulate the subcontinuum behavior of multidimensional heat conduction in solids. Based on a previous study (Chen et al., 2014, “Sub-Continuum Thermal Modeling Using Diffusion in the Lattice Boltzmann Transport Equation,” Int. J. Heat Mass Transfer, 79, pp. 666–675), phonon energy transport is separated to a ballistic part and a diffusive part, with phonon equilibrium assumed at boundaries. Steady-state temperature/total energy density solutions from continuum scales to ballistic scales are considered. A refined LBM-based numerical approach is applied to a two-dimensional simplified transistor model proposed by (Sinha et al. 2006, “Non-Equilibrium Phonon Distributions in Sub-100 nm Silicon Transistors,” ASME J. Heat Transfer, 128(7), pp. 638–647), and the results are compared with the Fourier-based heat conduction model. The three-dimensional (3D) LBM model is also developed and verified at both the ballistic and continuous limits. The impact of film thickness on the cross-plane and in-plane thermal conductivities is analyzed, and a new model of the supplementary diffusion term is proposed. Predictions based on the finalized model are compared with the existing in-plane thermal conductivity measurements and cross-plane thermal conductivity molecular dynamics (MD) results.

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