Modeling of Material Removal Mechanism in Micro Electric Discharge Milling of Ti-6Al-4V

2014 ◽  
Vol 592-594 ◽  
pp. 516-520 ◽  
Author(s):  
Basil Kuriachen ◽  
Jose Mathew
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Milling Process ◽  
Work Piece ◽  
Machining Parameters ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Electric Discharge Milling

Micro EDM milling process is accruing a lot of importance in micro fabrication of difficult to machine materials. Any complex shape can be generated with the help of the controlled cylindrical tool in the pre determined path. Due to the complex material removal mechanism on the tool and the work piece, a detailed parametric study is required. In this study, the influence of various process parameters on material removal mechanism is investigated. Experiments were planned as per Response Surface Methodology (RSM) – Box Behnken design and performed under different cutting conditions of gap voltage, capacitance, electrode rotation speed and feed rate. Analysis of variance (ANOVA) was employed to identify the level of importance of machining parameters on the material removal rate. Maximum material removal rate was obtained at Voltage (115V), Capacitance (0.4μF), Electrode rotational Speed (1000rpm), and Feed rate (18mm/min). In addition, a mathematical model is created to predict the material removal

Study on the Material Removal Rate of Nano-ZrO2 Ceramics under Ultrasonic Vibration Assisted Diamond Fly-Cutting

2018 ◽  
Vol 932 ◽  
pp. 30-35
Author(s):  
Yan Yan Yan ◽  
Yi Fan Lv ◽  
Jun Li Liu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Spindle Speed ◽  
Machining Parameters ◽  
Removal Mechanism ◽  
Cutting Depth ◽  
Four Levels

According to the removal mechanism of ductile regime machining of nanoZrO2 ceramics and the dynamic characteristics of ultrasonic vibration assisted diamond flying cutting (UVADFC), the model of the material removal rate (MRR) of nanoZrO2 ceramics under UVADFC and diamond flying cutting (DFC) have been proposed by infinitesimal method,. In this paper, the experiment of three factors and four levels was carried out to study the relationships between MRR and the machining parameters (cutting depth , spindle speed n and feed rate c). The results of the experiment shows that UVADFC is a cost-effective method which is applied to the machining of nanoZrO2 ceramics, and the MRR of nanoZrO2 ceramics under UVADFC is 1.3-2 times greater than that of DFC, and the degree of the factors significantly influence on the MRR of nanoZrO2 ceramics are feed rate, cutting depth, spindle speed in a sequence whether it is DFC or UVADFC. The results will shed more light on the material removal mechanism of UVADFC.

Study on Chemical Mechanical Polishing Removal Mechanism of Monocrystalline Silicon

2014 ◽  
Vol 538 ◽  
pp. 40-43
Author(s):  
Hong Wei Du ◽  
Yan Ni Chen
Keyword(s):  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Silicon Wafers ◽  
Monocrystalline Silicon ◽  
Mechanical Polishing ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Polishing Pressure

In this paper, material removal mechanism of monocrystalline silicon by chemical etching with different solutions were studied to find effective oxidant and stabilizer. Material removal mechanism by mechanical loads was analyzed based on the measured acoustic signals in the scratching processes and the observation on the scratched surfaces of silicon wafers. The chemical mechanical polishing (CMP) processes of monocrystalline silicon wafers were analyzed in detail according to the observation and measurement of the polished surfaces with XRD. The results show that H2O2 is effective oxidant and KOH stabilizer. In a certain range, the higher concentration of oxidant, the higher material removal rate; the higher the polishing liquid PH value, the higher material removal rate. The polishing pressure is an important factor to obtain ultra-smooth surface without damage. Experimental results obtained silicon polishing pressure shall not exceed 42.5kPa.

Material Removal Mechanism in Vibration-Assisted Finishing

2009 ◽  
Vol 69-70 ◽  
pp. 158-162 ◽  
Author(s):  
Yu Wang ◽  
Shao Hui Yin ◽  
Takeo Shinmura
Keyword(s):  
Material Removal Rate ◽  
Vibration Frequency ◽  
Material Removal ◽  
Removal Rate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Finishing Process ◽  
Vibration Assistance

In this paper, it is explored the material removal mechanism in vibration-assisted finishing process. On the basis of some experiments, the finishing characteristics are represented summarily. Though the analysis, it is shown that the vibration assistance method may increase cutting distance and speed of abrasive and material removal in per unit finishing distance which is affected by vibration frequency and amplitude, in-process abrasives behavior. What more, the increase in material removal rate is mainly due to an increase in material removal per unit finishing distance which is affected by the effects of abrasives cross-cutting.

scholarly journals Modeling and Analysis of the Material Removal Rate for Ultrasonic Vibration-assisted Polishing of Optical Glass BK7

2021 ◽  
Author(s):  
Yingdong Liang ◽  
Chao Zhang ◽  
Xin Chen ◽  
Tianqi Zhang ◽  
Tianbiao Yu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Material Removal Model

Abstract The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.

scholarly journals Optimization of Machining Parameters for MRR and Surface Roughness for 7024 AL-alloy in Pocket Milling Process

2019 ◽  
Vol 26 (1) ◽  
pp. 10-16
Author(s):  
Mustafa Mohammed Abdulrazaq ◽  
Adil Shabeeb Jaber ◽  
Ahmed Salman Hammood ◽  
Ahmed Ghazi Abdulameer
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Milling Process ◽  
Depth Of Cut ◽  
Al Alloy ◽  
Machining Parameters ◽  
Good Surface ◽  
Good Surface Roughness

The objective of this work is the investigation of milling process variables which resulting in optimal values of the surface roughness and material removal rate during machining of 7024 Al-alloy. The machining operation implemented on C-TEK CNC milling machine. The effects of the selected parameters on the chosen characteristics have been accomplished using Taguchi’s parameter design approach; also ANOVA had been used to evaluate the contribution of each parameter on the process outputs. Different feed rates are used ranging from (60, 80 and 100) mm/min, found that high feed rates gives a high material removal rates and good surface roughness. On the other hand, using three levels of spindle speeds found that a higher spindle speeds gives better surface roughness with a little effect on MRR. The process results showed that maximum MRR achieved (2.40) mm3/min when machining feed rate (100) mm/min, spindle speed (1000) r.p.m, and depth of cut (0.6) mm while good surface roughness (0.41 µm) when machining feed rate (100) mm/min, spindle speed (1000) r.p.m, and depth of cut (0.2) mm. The level of importance of the machining parameters for material removal rate and surface roughness and is determined by using Taguchi designing experiments and the variance analysis (ANOVA).

EXPERIMENTAL ANALYSIS, STATISTICAL MODELING AND OPTIMIZATION OF EFFECTIVE PARAMETERS ON SURFACE QUALITY IN CORTICAL BONE MILLING PROCESS

2020 ◽  
Vol 20 (04) ◽  
pp. 1950078
Author(s):  
MAHDI QASEMI ◽  
M-MORAD SHEIKHI ◽  
MOJTABA ZOLFAGHARI ◽  
VAHID TAHMASBI
Keyword(s):  
Surface Quality ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cutting Speed ◽  
Milling Process ◽  
Artificial Joint ◽  
Effective Parameters ◽  
Tool Diameter

Knee joint surgery for artificial joint replacement is common in orthopedic surgeries. In this operation, there is a need to prepare the surface of the cortical bone for mounting the artificial joint. Therefore, milling process is frequently performed. Since the surgeon should be careful not to hurt bone tissue and neurons and also minimize waste of blood, the operation should be performed in the shortest possible time. This study, for the first time, focuses on modeling and optimization of effective parameters of bone milling including cutting speed, feed rate and tool diameter on surface roughness and material removal rate using response surface method. Results showed that in order to achieve maximum surface quality, minimum feed rate, maximum tool diameter and down milling procedure should be selected. On the other hand, the maximum material removal rate coincides with maximum feed rate and tool diameter. Therefore, cutting speed of 3000[Formula: see text]rpm, feed rate of 50[Formula: see text]mm/min, tool diameter of 5[Formula: see text]mm and down milling procedure can satisfy both high surface quality and high material removal rate.

Performance Analysis of Trihexyltetradecylphosphonium Chloride Ionic Fluid under MQL Condition in Hard turning

2020 ◽  
Vol 17 (1) ◽  
pp. 7629-7647
Author(s):  
A. Pandey ◽  
R. Kumar ◽  
A. K. Sahoo ◽  
A. Paul ◽  
A. Panda
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cutting Speed ◽  
Coconut Oil ◽  
Chip Morphology ◽  
Weight Fraction ◽  
Cutting Fluid ◽  
Depth Of Cut

The current research presents an overall performance-based analysis of Trihexyltetradecylphosphonium Chloride [[CH3(CH2)5]P(Cl)(CH2)13CH3] ionic fluid mixed with organic coconut oil (OCO) during turning of hardened D2 steel. The application of cutting fluid on the cutting interface was performed through Minimum Quantity Lubrication (MQL) approach keeping an eye on the detrimental consequences of conventional flood cooling. PVD coated (TiN/TiCN/TiN) cermet tool was employed in the current experimental work. Taguchi’s L9 orthogonal array and TOPSIS are executed to analysis the influences, significance and optimum parameter settings for predefined process parameters. The prime objective of the current work is to analyze the influence of OCO based Trihexyltetradecylphosphonium Chloride ionic fluid on flank wear, surface roughness, material removal rate, and chip morphology. Better quality of finish (Ra = 0.2 to 1.82 µm) was found with 1% weight fraction but it is not sufficient to control the wear growth. Abrasion, chipping, groove wear, and catastrophic tool tip breakage are recognized as foremost tool failure mechanisms. The significance of responses have been studied with the help of probability plots, main effect plots, contour plots, and surface plots and the correlation between the input and output parameters have been analyzed using regression model. Feed rate and depth of cut are equally influenced (48.98%) the surface finish while cutting speed attributed the strongest influence (90.1%). The material removal rate is strongly prejudiced by cutting speed (69.39 %) followed by feed rate (28.94%) whereas chip reduction coefficient is strongly influenced through the depth of cut (63.4%) succeeded by feed (28.8%). TOPSIS significantly optimized the responses with 67.1 % gain in closeness coefficient.

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