Effect of Different Curing Catalysts on Curing Behavior of Transparent Epoxy Molding Compound for SMD LED Packaging

The transparent epoxy molding compound (EMC) for integrated circuits (IC) packaging was prepared by using tetrahydromethyl-1,3-isobenzofurandione as curing agent, respectively using 2-methyl imidazole and triphenyl phosphine as curing accelerator. The effect of curing accelerator type on curing behavior of EMC was investigated by non-isothermal DSC method in this paper. Based on Kissinger method, Crane method and Ozawa method, the kinetic parameters such as activation energy and reaction order of the curing reaction were obtained. The characteristic temperatures of the curing process such as gel temperature, curing temperature and post-curing temperature were calculated by extrapolation. The results showed that EMC with 2-methyl imidazole had a lower activation energy compared to EMC with triphenyl phosphine, which provided the basic data for the optimal recipe of EMC and the determination of IC packaging technologies.

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The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.509.15 ◽

2014 ◽

Vol 509 ◽

pp. 15-19

Author(s):

Ming Shan Yang ◽

Ran Yan ◽

Yu Hong Yan ◽

Yang Liu

Keyword(s):

Activation Energy ◽

Coordination Compound ◽

Addition Reaction ◽

Curing Temperature ◽

Basic Data ◽

Dynamic Parameters ◽

Large Power ◽

Curing Behavior ◽

Dsc Method ◽

Reaction Level

The organosilicone gel material for large-power LED packaging was prepared through Si-H addition reaction of hydrogen-silicone with vinyl-silicone catalyzed by Pt coordination compound in this paper. The curing behavior was investigated by DSC method, and the curing dynamic parameters were obtained, i.e., the curing activation energy and reaction level of the system were 79.23kJ/mol and 0.8271 respectively, the initial curing temperature, maximum curing temperature and post-curing temperature were 75°C, 90°Cand 120°C, respectively, which supplied the basic data for the preparation and application of organosilicone materials for large-power LED packaging.

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The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.211-212.638 ◽

2011 ◽

Vol 211-212 ◽

pp. 638-642 ◽

Cited By ~ 1

Author(s):

Ming Shan Yang ◽

Jian Wei Liu ◽

Lin Kai Li

Keyword(s):

Thermal Stability ◽

Epoxy Resin ◽

Curing Kinetics ◽

Curing Temperature ◽

Molding Compound ◽

Ic Packaging ◽

Ortho Cresol ◽

Novolac Epoxy ◽

Kinetics Of ◽

Thermal Stability Of

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

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Preparation of Hexaphenylamine Cyclotriphosphazene and its Green Flame Retardance on Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.239-242.1386 ◽

2011 ◽

Vol 239-242 ◽

pp. 1386-1390

Author(s):

Ming Shan Yang ◽

Lin Kai Li

Keyword(s):

Integrated Circuits ◽

Integrated Circuit ◽

Flame Retardants ◽

Large Scale ◽

Reaction Rate ◽

Flame Retardance ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Synthesis Parameters ◽

Halogen Free

The hexaphenylamine cyclotriphosphazene (HPACTPZ) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of HPACTPZ was analyzed by FTIR and NMR in this paper. Using HPACTPZ synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by HPACTPZ was up to UL 94 V0 rating(3.2mm) and the oxygen index of the EMC was up to 35.8%, which indicates that HPACTPZ has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, HPACTPZ accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

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Synthesis of Phosphazene Flame Retardant and its Application in Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.216.474 ◽

2011 ◽

Vol 216 ◽

pp. 474-478 ◽

Cited By ~ 1

Author(s):

Ming Shan Yang ◽

Jian Wei Liu ◽

Lin Kai Li

Keyword(s):

Integrated Circuits ◽

Flame Retardant ◽

Integrated Circuit ◽

Flame Retardants ◽

Large Scale ◽

Flame Retardance ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Synthesis Parameters ◽

Halogen Free

The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of TPCTP was analyzed by FTIR in this paper. Using TPCTP synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by TPCTP was up to UL 94 V0 rating(1.6mm) and the oxygen index of the EMC was up to 34.5%, which indicates that TPCTP has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, TPCTP accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

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