The Curing Kinetics of Multiscale [Ni(EDTA)]-2 Intercalated Zn-Al Layered Double Hydroxides: Glass Fiber–Epoxy Composite Prepreg

In the present research, the effect of Zn2Al layered double hydroxides (LDH) and nickel (II)-EDTA complex intercalated LDH (LDH-[Ni(EDTA)]-2) on the cure kinetics of glass fiber/epoxy prepreg (GEP) was explored using nonisothermal differential scanning calorimetry (DSC). The results showed that LDH caused a shift in the cure temperature toward lower temperatures while accelerating the curing of epoxy prepregs. The use of LDH-[Ni(EDTA)]-2 more profoundly influenced the acceleration of the curing process. The curing kinetics of prepregs was assessed through the differential isoconversional Friedman (FR) technique and the integration method of Flynn–Wall–Ozawa (FWO) and Kissinger–Akahira–Sunose (KAS). A decrease was detected in the E α value of glass fiber/LDH-[Ni(EDTA)]-2/epoxy (GELP) and glass fiber/LDH-[Ni(EDTA)]-2/epoxy (GELNiP) prepregs at small cure degrees relative to GEP, suggesting the catalytic effect of LDH or LDH-[Ni(EDTA)]-2 on the initial epoxy/amine reaction. Furthermore, LDH-[Ni(EDTA)]-2 performed better due to the catalyst role of nickel (II). Moreover, the activation energy exhibited lower reliance on the degree of conversion in the cases of GELP and GELNiP rather than pure epoxy prepregs. An autocatalytic model was used to evaluate the curing behavior of the system. Based on the results, the curing reaction of the epoxy prepreg can be described by the autocatalytic Šesták-Berggren model even after the incorporation of LDH or LDH-[Ni(EDTA)]-2. The kinetic parameters of the autocatalytic model (such as E α , A , m , n ) and the equations explaining the curing behavior of prepregs were introduced as well whose predictions were in line with the experimental findings.

Correlation between the Flow and Curing Behavior of Hard Magnetic Fillers in Thermosets and the Magnetic Properties

Polymer bonded magnets based on thermoplastics are economically produced by the injection molding process for applications in sensor and drive technology. Especially the lack of orientation in the edge layer, as well as the chemical resistance and the creep behavior limit the possible implementations of thermoplastic based polymer bonded magnets. However, thermoset based polymer bonded magnets have the opportunity to expand the applications by complying with the demands of the chemical industry or pump systems through to improved chemical and thermal resistance, viscosity and creep behavior of thermosets. This paper investigates the influence of hard magnetic particles on the flow and curing behavior of highly filled thermoset compounds based on an epoxy resin. The basic understanding of the behavior of those highly filled hard magnetic thermoset systems is essential for the fabrication of polymer bonded magnets based on thermosets in the injection molding process. It is shown that several factors like the crystal structure, the particle shape and size, as well as the thermal conductivity and the adherence between filler and matrix influence the flow and curing behavior of highly filled thermoset compounds based on epoxy resin. However, these influencing factors can be applied to any filler system with respect to a high filler amount in a thermoset compound, as they are based on the material behavior of particles. Further, the impact of the flow and curing behavior on the magnetic properties of polymer bonded magnets based on thermosets is shown. With that, the correlation between material based factors and magnetic properties within thermosets are portrayed.

Structural Adhesives Tapes Based on a Solid Epoxy Resin and Multifunctional Acrylic Telomers

Thermally curable pressure-sensitive structural adhesives tapes (SATs) were compounded using a solid epoxy resin and multifunctional acrylic telomer solutions (MATs) prepared by a thermally initiated telomerization process in an epoxy diluent containing two kinds of telogens (CBr4 or CBrCl3). Dynamic viscosity, K-value, and volatile mater content in MATs (i.e., MAT-T with CBr4, MAT-B with CBrCl3) were investigated in relation to telogen type and content. The influence of MATs on the self-adhesive features and curing behavior of UV-crosslinked tapes as well as on the shear strength of thermally cured aluminum–SAT–aluminum joints was investigated as well. Increasing the telogen dose (from 5 to 15 wt. parts) caused significant improvement in the adhesion (+315% and +184%), tack (+147% and +298%), and cohesion (+414% and +1716%) of SATs based on MAT-T and MAT-B, respectively. Additionally, MATs with high telogen content (especially the MAT-T-type) improved the resistance of cured joints to aviation fuel, humidity, and elevated temperature. The highest overlap shear strength values were registered for SATs based on MATs containing 7.5 wt. parts of CBr4 (16.7 MPa) or 10 wt. parts of CBrCl3 (15.3 MPa).

Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties during processing. An empirical equation can describe the reaction kinetics of the curing behavior of an investigated material, which is usually estimated using experimental methods. In this study, the curing process of an epoxy resin, the polymer matrix in an epoxy molding compound, is computed concerning thermal influence using molecular dynamics. Furthermore, the accelerated reaction kinetics, which are influenced by an increased reaction cutoff distance, are investigated. As a result, the simulated crosslink density with various cutoff distances increases to plateau at a crosslink density of approx. 90% for the investigated temperatures during curing time. The reaction kinetics are derived according to the numerical results and compared with the results using experimental methods (dielectric analysis and differential scanning calorimetry), whereby the comparison shows a good agreement between experiment and simulation.