The Cooling Principle of the LED Finned Radiator and its Heat Dissipation Theory Analysis

2015 ◽  
Vol 729 ◽  
pp. 234-239
Author(s):  
Ke Li ◽  
Jian Ming Liu ◽  
Xin Zhang
Keyword(s):  
Heat Pipe ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Fourth Generation ◽  
Photoelectric Conversion Efficiency ◽  
Theory Analysis ◽  
Photoelectric Conversion ◽  
Light Emitting ◽  
New Energy ◽  
Renewable Energy Storage

Human demand for energy is increasing, non-renewable energy storage on Earth drastic drop in the new energy is in exploring the application stage, humans had to find a way for existing energy saving. LED (Light Emitting Diode) as a fourth-generation light source and its high photoelectric conversion efficiency, environmental protection, long life, the application of many changes and other advantages of the various countries on the national lighting issues[1].This paper explore the cooling area, the material and Presence of heat pipe 's Influence on the heat sink effect. Length of the heat pipe 's affect on heat pipe fin type radiator cooling effect.

Research on Scales Reflecting Cup Based on Scheme Macro Language Programming

2015 ◽  
Vol 729 ◽  
pp. 228-233
Author(s):  
Zhi Qin Huang ◽  
Li Pu Huang ◽  
Lian Di Zhao
Keyword(s):  
Light Emitting Diode ◽  
Fourth Generation ◽  
Photoelectric Conversion Efficiency ◽  
Product Model ◽  
Photoelectric Conversion ◽  
Light Emitting ◽  
New Energy ◽  
Long Life ◽  
Increasing Demand ◽  
Renewable Energy Storage

The increasing demand for energy, non-renewable energy storage on Earth drastic drop in the new energy is in exploring the application stage, humans had to find a way for existing energy saving. LED (Light Emitting Diode) as a fourth-generation light source and its high photoelectric conversion efficiency, environmental protection, long life, the application of many changes and other advantages of the various countries on the national lighting issues[1]. This paper researched scales reflecting cup and Scheme macro language programming briefly, explained the program about scales reflecting cup written by Scheme macro language and the process of using TracePro software to product model briefly, then compared with traditional reflecting cup and analyzed.

scholarly journals Dispensing Technology of 3D Printing Optical Lens with Its Applications

Energies ◽  
2019 ◽  
Vol 12 (16) ◽  
pp. 3118 ◽  
Author(s):  
Fang-Ming Yu ◽  
Ko-Wen Jwo ◽  
Rong-Seng Chang ◽  
Chiung-Tang Tsai
Keyword(s):  
Solar Cells ◽  
Light Emitting Diode ◽  
Contact Angles ◽  
Luminous Flux ◽  
Photoelectric Conversion Efficiency ◽  
Fluid Viscosity ◽  
Photoelectric Conversion ◽  
Uv Curable ◽  
Lens Array ◽  
Light Emitting

Current 3D printed lens technology faces reduced efficiency due to stepped and stacked lens surfaces. This research employs a faster jet dispensing method which reduces these issues. It uses UV-curable material and merges droplets before they are cured to obtain very smooth lens surfaces without any post-processing and without manufacturing a mold for lens structures. This technology can be applied to lens manufacturing in a variety of products, especially in the form of arrays, saving development time and reducing cost. Two experiments of LED (Light-emitting diode) lens and solar cell lens array mask implementations are presented to demonstrate the power of the method. Furthermore, this study analyzes the effect of different contact angles created by jet dispensing technology, including a detailed exploration of fluid viscosity and tooling heating parameters. Our results show that the LED lens can be manufactured to increase the luminous flux of large angles. Furthermore, the lens array mask for solar cells can be manufactured to reduce sunlight reflection and increase secondary refraction, which enables solar cells to achieve higher photoelectric conversion efficiency and to increase their power generation up to 4.82%.

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Improved Heat Dissipation in GaN-Based Thin-Film Light-Emitting Diode with Lateral-Electrode Configuration

2015 ◽  
Vol 7 (2) ◽  
pp. 283-286
Author(s):  
Jiang-Yong Zhang ◽  
Lei-Ying Ying ◽  
Ming Chen ◽  
Wen-Jie Liu ◽  
Jian Yu ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Electrode Configuration ◽  
Light Emitting

Thermal Performance Evaluation and Economic Analysis of LED Integrated with Thermoelectric Cooler Package

2011 ◽  
Vol 216 ◽  
pp. 106-110 ◽  
Author(s):  
Hong Qin ◽  
Da Liang Zhong ◽  
Chang Hong Wang
Keyword(s):  
Economic Analysis ◽  
Thermal Performance ◽  
Power Dissipation ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Vital Role ◽  
Junction Temperature ◽  
Total Power ◽  
Thermoelectric Cooler ◽  
Light Emitting

Thermal management is an important issue for light emitting diodes’ utilization. For high power light emitting diode (LED), active heat dissipation method plays a vital role. As a new cooling device, thermoelectric cooler (TEC) is applied in LED packaging for the precisely temperature controlled advantage. In order to evaluate the thermal performance of the TEC packaging designs in LED, experimental measurement is used to assess the chip’s junction temperature of three different cooling models, which include the heatsink model, the heatsink and fan model and the TEC, heatsink and fan model. Based on the research, it is better to apply TEC cooling methods with the power dissipation of LED less than 35 W and the wind speed is 3.6 m/s. However, the power dissipation of TEC itself plays a vital role of the total power dissipation of LED packaging. The results of economic analysis shows that the LED integrated with TEC package achieves 22.34% and 44.73% electric energy saving under the condition of 20 W and 30 W power dissipation of the LED chip contrasts to the fluorescent lamp, but sacrifices 2.71% electric power under the condition of 10 W power dissipation of the LED chip.

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