Fracture Properties of Cement Pastes Modified by Fine Ground Ceramic Powder

2014 ◽  
Vol 1054 ◽  
pp. 182-187 ◽  
Author(s):  
Pavel Reiterman ◽  
Ondřej Holčapek ◽  
Kirill Polozhiy ◽  
Petr Konvalinka

Paper deals with utilization of fine ground ceramic powder as a supplementary cement addition. Present work follows previous research focused on the basic physical and hygric properties of cement composites with ceramic powder application. Present work introduce rheological, mechanical and fracture properties of cement pastes investigated during maturation at time 7 days. Presented data are added by results of pore characteristic having essential impact to final properties. Obtained data confirm previous assumption of retarding of hydration process, but final fracture properties indicate increased durability of cement pastes with fine ceramic powder addition.

2014 ◽  
Vol 897 ◽  
pp. 188-191 ◽  
Author(s):  
Pavel Reiterman ◽  
Ondřej Holčapek ◽  
Monika Čáchová ◽  
Filip Vogel ◽  
Marcel Jogl ◽  
...  

The motivation for utilization of active admixtures in concrete lies primarily in a positive effect on properties of hardened concrete with regard to its durability. Fine parts complement the grain size distribution curve, but also due to subsequent hydration arise phases with better resistance to aggressive substances from surrounding environment. Process of pozzolanic reaction is also associated with a reduction in open capillary porosity, causing a gradual reduction of the permeability of concrete. The paper presents an experimental program focused on the monitoring of evolution of basic and hygric properties of concrete with fine ceramic powder addition.


1987 ◽  
Vol 34 (9) ◽  
pp. 383-386 ◽  
Author(s):  
Takeo Nakagawa ◽  
Nobuyuki Takahashi ◽  
Hiroyuki Noguchi ◽  
Reiko Cho

2015 ◽  
Vol 41 ◽  
pp. S111-S116 ◽  
Author(s):  
Xia Zhao ◽  
Wenfeng Liu ◽  
Wei Chen ◽  
Shengtao Li

2016 ◽  
Vol 707 ◽  
pp. 35-42
Author(s):  
Tereza Kulovaná ◽  
Jaroslav Pokorný ◽  
Milena Pavlíková ◽  
Martina Záleská ◽  
Zbyšek Pavlík

Waste ceramic powder originating from the contemporary hollow bricks production is studied as a supplementary cementitious material in mortar composition. For the ceramic powder and cement, the measurement of chemical composition is done using XRF analysis. XRD device is used for the amorphous phase content measurement. The particle size distribution of ceramics and cement is accessed on a laser diffraction principle. Pozzolanic activity of ceramic powder was determined by the modified Chapelle test. The blended binder containing ceramic powder in an amount of 8, 16, and 24% of mass of cement is used for the preparation of mortars which are then characterized using the measurement of basic physical properties and mechanical properties. Among the basic physical properties, bulk density, matrix density and total open porosity are measured. The mechanical resistivity of mortars with blended binder is accessed by the compressive strength, flexural strength, and dynamic Young’s modulus measurement. Additionally, pore-size distribution of the developed mortars is analyzed using mercury intrusion porosimetry. Experimental data shows that an application of 24% waste ceramics in the blended binder provides sufficient mechanical resistivity of the mortar.


2015 ◽  
Author(s):  
O. Holčapek ◽  
P. Reiterman ◽  
M. Jogl ◽  
J. Koťátková ◽  
P. Konvalinka

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.


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