Molecular Dynamics Simulation of a Cutting Method by Making Use of Localized Hydrostatic Pressure

2016 ◽  
Vol 1136 ◽  
pp. 156-161 ◽  
Author(s):  
Jun Shimizu ◽  
Keito Uezaki ◽  
Li Bo Zhou ◽  
Takeyuki Yamamoto ◽  
Teppei Onuki ◽  
...  

This study aims to develop a cutting method, which enables to generate a localized hydrostatic pressure field in the vicinity of cutting zone in order to improve the machined surface integrity without causing unnecessary plastic deformation. In the previous work, a molecular dynamics simulation was performed using a newly developed cutting tool equipped with a planer jig with a rectangular hole for the cutting chip elimination, and it was confirmed that the developed cutting tool has advantages in giving a relatively high-hydrostatic stress field in the vicinity of the cutting zone and in suppressing the burr formation. In this report, further molecular dynamics simulation was performed in order to clarify the influence of jig shape on the cutting phenomena and machined surface integrity. As a result, it is found that a cutting tool of which front and side except for the rectangular hole are covered by the planer jig is the most advantageous for supplying high hydrostatic pressure and suppressing burr formation.

2012 ◽  
Vol 523-524 ◽  
pp. 167-172 ◽  
Author(s):  
Keito Uezaki ◽  
Jun Shimizu ◽  
Li Bo Zhou ◽  
Teppei Onuki ◽  
Hirotaka Ojima

Improving machined surface integrity is one of the important issues in the precision machining. This study aims to develop a cutting tool, which enables to generate a local hydrostatic pressure field in the vicinity of the cutting point to suppress the extra plastic flow in the workpiece, because it is known that materials including metals never cause plastic flow and fracture no matter how much greater hydrostatic pressure field is given. In this paper, a simple cutting tool with planer jig is proposed and a molecular dynamics simulation of cutting is performed as the first step. As a result, it is confirmed that the reduction of the plastic deformation, mainly in the burr formation become remarkable with the proposed model due to the suppression of extra side plastic flow, and relatively high-hydrostatic stress field is formed in the vicinity of cutting point. However, it is also observed that relatively many dislocations are generated beneath the cutting groove.


2006 ◽  
Vol 05 (04n05) ◽  
pp. 547-551 ◽  
Author(s):  
H. WU ◽  
F. Z. FANG ◽  
Q. X. PEI

Since no physical approach can be employed to study the mechanism in micro cutting, the molecular dynamics simulation is becoming more and more important. In this study, the results of molecular dynamics modeling and analysis on the nanometric machining on silicon surface are presented. According to the simulation, some phenomena in the nanometric cutting process are found. First, surface elastic rebound happens on the cut surface after cutter moving away. The value of the surface elastic rebound is calculated in the simulation. Second, the atoms near the corner of work piece swirl up following the cutter moving direction at the initial stage of removing atoms from the work piece. Third, the simulation results show that no matter how small material removal is, the burr is always formed at the edge of work piece.


Metals ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 1278
Author(s):  
Jianhua Li ◽  
Ruicheng Feng ◽  
Haiyang Qiao ◽  
Haiyan Li ◽  
Maomao Wang ◽  
...  

In this work, the distribution and evolution of micro-defect in single crystal γ-TiAl alloy during nanometer cutting is studied by means of molecular dynamics simulation. Nanometer cutting is performed along two typical crystal directions: [ 1 ¯ 00 ] and [ 1 ¯ 01 ] . A machined surface, system potential energy, amorphous layer, lattice deformation and the formation mechanism of chip are discussed. The results indicate that the intrinsic stacking fault, dislocation loop and atomic cluster are generated below the machined surface along the cutting crystal directions. In particular, the Stacking Fault Tetrahedron (SFT) is generated inside the workpiece when the cutting crystal direction is along [ 1 ¯ 00 ] . However, a “V”-shape dislocation loop is formed in the workpiece along [ 1 ¯ 01 ] . Furthermore, atomic distribution of the machined surface indicates that the surface quality along [ 1 ¯ 00 ] is better than that along [ 1 ¯ 01 ] . In a certain range, the thickness of the amorphous layer increases gradually with the rise of cutting force during nanometric cutting process.


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