Numerical Modeling of the Thermal Performance of 3D SiP with TSV

2011 ◽  
Vol 189-193 ◽  
pp. 1610-1613
Author(s):  
Kai Lin Pan ◽  
Jing Huang ◽  
Jing Liu ◽  
Wei Tao Zhu ◽  
Guo Tao Ren

Electronic package development is driven by the continuous increase in demands for miniaturization of products with enhanced performances. Three Dimensional System in Package (3D SiP) has become a key technology to satisfy the request. The 3D SiP with Through Silicon Via (TSV) technology is developed for chip to chip stacking in a package with superior electrical performance than conventional structures. In this study, we evaluate the thermal performance of 3D SiP with TSV technology using Finite Element Method (FEM). The evaluation topics covered impacts of various materials of mold, 3D SiP models with and without TSV, and various convention conditions. The results indicated that the role of TSVs in heat dissipation is not obvious in this study, and the maximum temperature merged in the center of the chip1 under different conditions which are considered.

1976 ◽  
Vol 15 (2) ◽  
pp. 197-222
Author(s):  
R. J. Hartman

This paper uses the general solution of the linearized initial-value problem for an unbounded, exponentially-stratified, perfectly-conducting Couette flow in the presence of a uniform magnetic field to study the development of localized wave-type perturbations to the basic flow. The two-dimensional problem is shown to be stable for all hydrodynamic Richardson numbers JH, positive and negative, and wave packets in this flow are shown to approach, asymptotically, a level in the fluid (the ‘isolation level’) which is a smooth, continuous, function of JH that is well defined for JH < 0 as well as JH > 0. This system exhibits a rich complement of wave phenomena and a variety of mechanisms for the transport of mean flow kinetic and potential energy, via linear wave processes, between widely-separated regions of fluid; this in addition to the usual mechanisms for the absorption of the initial wave energy itself. The appropriate three-dimensional system is discussed, and the role of nonlinearities on the development of localized disturbances is considered.


2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).


2018 ◽  
Vol 10 (11) ◽  
pp. 168781401880864 ◽  
Author(s):  
Piotr Grzes

A three-dimensional numerical model of a disk brake to study temperature on a discrete contact of rough surfaces has been developed. It includes the system of equations formulated based on thermotribological postulates of heat dynamics of friction and wear with mutual influence of contact pressure, velocity, properties of materials, and temperature. Two approaches of calculation of the flash temperature and its influence on the maximum temperature during a single braking application were studied. Changes in the contact temperature, sliding velocity, and the thermomechanical wear during braking were shown and discussed. It was found that two of the examined variants of calculation of the flash temperature agree well for the three considered materials of the brake pads combined with the cast iron disk, at each initial sliding velocity in the range from 5 to 20 m s−1.


1996 ◽  
Vol 74 (1-2) ◽  
pp. 4-9
Author(s):  
M. R. M. Witwit

The energy levels of a three-dimensional system are calculated for the rational potentials,[Formula: see text]using the inner-product technique over a wide range of values of the perturbation parameters (λ, g) and for various eigenstates. The numerical results for some special cases agree with those of previous workers where available.


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