Fabrication and Application of CVD Diamond-Coated Copper Wire Drawing Die

2011 ◽  
Vol 328-330 ◽  
pp. 1182-1187 ◽  
Author(s):  
Qing Shun Tang ◽  
Yuan Hui Yang
Keyword(s):  
Surface Quality ◽  
Diamond Film ◽  
Copper Wire ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Cvd Diamond ◽  
Wire Drawing ◽  
Coating Film ◽  
Drawing Die ◽  
Coated Wire

To improve the surface quality and adhesion of diamond film is the key factors to realize CVD diamond coating widely applied in the wear-resistance parts field. Through optimizing deposition process parameters, the article used the straight wiredrawing chemical vapor deposition to depose the diamond film in the bore surface of WC-CO carbide wiredrawing mould. The surface topography of the coating, film quality and surface roughness were detected and the preparation of CVD diamond film coated wire drawing mould in drawing copper wires production line was applied. The experimental results show that working life of diamond film coated wire drawing mould improved to 40~ 50 of that traditional hard alloy mould, and the controlled copper wire had the better precision and surface quality.

Deposition and Application of CVD Diamond Film on the Interior-Hole Surface of Shaped-Wire Drawing Die

2012 ◽  
Vol 217-219 ◽  
pp. 1022-1027
Author(s):  
Liu Jin Bian ◽  
Zi Chao Lin ◽  
Fang Hong Sun ◽  
Song Shou Guo
Keyword(s):  
Surface Quality ◽  
Diamond Film ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Cvd Diamond ◽  
Wire Drawing ◽  
Drawing Die ◽  
Before And After ◽  
Cvd Diamond Film ◽  
Drawing Dies

Abstract：The shaped-wire drawing dies are used more and more popularly in the metal product industry for several advantages of locked structure. In present investigation, a layer of CVD diamond film is deposited on the interior-hole surface of shaped-wire drawing die using a hot filament chemical vapor deposition (HFCVD) method, followed by a surface polishing process, aiming at further prolonging its working lifetime of shaped-wire drawing dies and improving the surface quality of produced wires. The scanning electron microscopy (SEM), surface profiler and Raman spectroscopy are adopted to present the characterization of both as-deposited CVD diamond films before and after polishing. Furthermore, the performance of as-fabricated CVD diamond coated drawing dies is examined in the practical production process. The results show that as-deposited CVD diamond films are homogeneous and the working surface is smoother after polishing. Comparing with the conventional shaped drawing dies, the working lifetime of the diamond coated shaped-wire drawing dies can be increased by a factor of above 10, and the shaped wires with higher surface quality can be obtained.

Study on the Surface Integrity of Polished Diamond Thick Film Prepared by EACVD

2007 ◽  
Vol 359-360 ◽  
pp. 319-323
Author(s):  
Feng Xu ◽  
Dun Wen Zuo ◽  
Rong Fa Chen ◽  
Wen Zhuang Lu ◽  
Min Wang
Keyword(s):  
Surface Roughness ◽  
Thick Film ◽  
Surface Integrity ◽  
Diamond Film ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Cvd Diamond ◽  
Deformation Energy ◽  
Polished Surface ◽  
Cvd Diamond Film

Chemical vapor deposited (CVD) diamond film is a good materials for cutting tools as its a series of excellent properties. But because of its polycrystalline morphology, CVD diamond thick film has a rough surface that limits its application in engineering. In this paper, study was carried out on the mechanical lapping of diamond film. It is shown that surface roughness of the film was reduced from Ra 4.5μm to Ra 0.2μm after 50-minute polishing. The surface integrity of polished diamond thick film was investigated, which includes surface roughness, morphology and residual stress. There are a lot of micro defects such as grooves, gas cavities and micro cracks on the polished surface, which are the intrinsic defects generated in the deposition process of CVD diamond film. The tensile stress of the film reduced through polishing as the release of the deformation energy stored in the film.

The Performance of Plasma and Multi-Physical Fields in DC Arc Plasma Reactor for CVD Diamond Film

2016 ◽  
Vol 852 ◽  
pp. 1140-1146
Author(s):  
Xiao Jing Li ◽  
Yong Liang Gao ◽  
Yan Yin ◽  
Shun Qi Zheng ◽  
Yang Sheng Zheng
Keyword(s):  
Diamond Film ◽  
Gas Flow ◽  
Plasma Reactor ◽  
Plasma Temperature ◽  
Chemical Vapor ◽  
Cvd Diamond ◽  
Arc Plasma ◽  
Cvd Diamond Film ◽  
Physical Fields ◽  
Dc Arc

Numerical simulation method was developed to investigate the performance of plasma and multi-physical fields in direct current (DC) arc plasma reactor for chemical vapor deposition (CVD) Diamond film,in order to obtain more information on the process of CVD. Finite Volume Method (FVM) was adopted. Continuous arc forming and the dynamic formation process of rotating arc plasma were shown in this paper. Multi-physics field in deposition chamber were modeled including flow field, temperature field. Distribution of velocity and temperature were obtained by solving momentum and energy equation with SIMPLE separation algorithm. Simulation results show that, plasma temperature near the cathode tip is the highest, which is more than 1×104K. The plasma distribution shape like the bell jar. The changing regularity of outlet velocity, temperature and static pressure with the distance from the anode center were revealed. The effectiveness of plasma temperature and gas flow calculated was confirmed by the experimental results. The research results provide the theoretical foundation for obtaining uniform diamond thick film.

MASS PRODUCTION OF HFCVD DIAMOND-COATED WIRE-DRAWING DIES WITHOUT FILAMENT THROUGH THE HOLE

2021 ◽  
pp. 2150006
Author(s):  
XIN SONG ◽  
CHENG-CHUAN WANG ◽  
XIN-CHANG WANG ◽  
FANG-HONG SUN
Keyword(s):  
Mass Production ◽  
Cfd Simulation ◽  
Chemical Vapor ◽  
Wire Drawing ◽  
Cemented Carbide ◽  
Small Aperture ◽  
Coated Wire ◽  
Volume Method ◽  
Hot Filament ◽  
Drawing Dies

Hot filament chemical vapor deposition (HFCVD) diamond-coated small aperture wire-drawing dies from [Formula: see text] to [Formula: see text][Formula: see text]mm are in high demand. A new deposition technique without filaments through the inner hole of wire-drawing dies is proposed, accompanied with the specially designed fixtures. Temperature distribution on the deposition surfaces is studied by computational fluid dynamics (CFD) simulation based on the finite volume method (FVM); both case study and mass production simulations are accomplished. Excellent performance and uniform multilayer MCD/NCD/MCD/NCD films are successfully deposited on the inner-hole surfaces of total 16 cemented carbide (WC-6wt.%Co) wire-drawing dies with an aperture of [Formula: see text][Formula: see text]mm in one batch. Drawing results of gas shield welding wires show that the lifespan of the multilayer diamond coated wire-drawing dies is about 20 times of the uncoated cemented carbide dies and 2 times of the monolayer MCD coated dies.

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

1998 ◽  
Vol 120 (4) ◽  
pp. 367-371 ◽  
Author(s):  
S. Kamiya ◽  
H. Takahashi ◽  
M. Saka ◽  
H. Abe´
Keyword(s):  
Adhesive Strength ◽  
Diamond Film ◽  
Fracture Resistance ◽  
Early Stage ◽  
Chemical Vapor ◽  
Maximum Load ◽  
Cvd Diamond ◽  
Adhesive Fracture ◽  
Diamond Particles ◽  
Cvd Diamond Film

Diamond film produced by chemical vapor deposition (CVD) is being used in the electronics industry because of their excellent properties. In order to measure the adhesive strength of CVD diamond, external load is directly applied in a scanning electron microscope to the CVD diamond particles that sparsely appear on silicon substrate in the early stage of deposition. These particles are called nuclei when they are small and grow into contact with each other to form polycrystalline CVD diamond film. Diamond film was supposed to adhere to the substrate at only these discrete nucleation points, which might result in weak adhesive strength. We measure the maximum load, as the adhesive fracture resistance, required to scratch off the particles with 2–13 μm diameter. Adhesive fracture resistance is found to increase with the diameter of the particle. Hence we conclude that CVD diamond does not adhere only at the nucleation points but that the whole contact area to the substrate is responsible for its adhesive strength.

THE ABRASION RESISTANCE AND ADHESION OF HFCVD BORON AND SILICON-DOPED DIAMOND FILMS ON WC–Co DRAWING DIES

2017 ◽  
Vol 24 (07) ◽  
pp. 1750090 ◽  
Author(s):  
LIANG WANG ◽  
JINFEI LIU ◽  
TANG TANG ◽  
FANGHONG SUN ◽  
NAN XIE
Keyword(s):  
Adhesive Strength ◽  
Abrasion Resistance ◽  
Copper Wire ◽  
Diamond Films ◽  
Chemical Vapor ◽  
High Growth ◽  
Diamond Powder ◽  
Wire Drawing ◽  
High Growth Rate ◽  
Drawing Dies

Diamond films have been deposited on the interior hole surface of cobalt-cemented tungsten carbide (WC–Co) drawing dies from acetone, trimethyl borate (C3H9BO3), tetraethoxysilane (C8H[Formula: see text]O4Si, TEOS) and hydrogen mixture by hot-filament chemical vapor deposition (HFCVD) method. The structures and quality of as-deposited diamond films are characterized with field-emission scanning electron microscopy (FESEM) and Raman spectroscopy. The abrasion ratio and the adhesive strength of as-deposited diamond films are evaluated by copper wire drawing tests and ultrasonic lapping tests, respectively. The results suggest that diamond films with small grain size and high growth rate can be obtained due to the mutual effects of boron and silicon impurities in the gas phases. The results of ultrasonic lapping tests show that diamond films doped with boron and/or silicon can bear the severe erosion of the large diamond powder. Diamond films peeling off within the reduction zone of the drawing dies cannot be observed after testing of 2[Formula: see text]h. The abrasion ratio of boron and silicon-added diamond films is five times that of diamond films without any addition. Adding boron and/or silicon in the diamond films is proved to be an efficient way to obtain high-adhesive-strength and high-abrasion-resistance diamond-coated drawing dies.

Selective Growth of B-Doped Diamond on Si-Doped Diamond Film

2012 ◽  
Vol 217-219 ◽  
pp. 1013-1017
Author(s):  
Y.X. Cui ◽  
B. Shen ◽  
F.H. Sun ◽  
Z.M. Zhang
Keyword(s):  
Diamond Film ◽  
Sacrificial Layer ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Cvd Diamond ◽  
Selective Area ◽  
Si Doped ◽  
Cvd Diamond Film ◽  
Hot Filament ◽  
Area Deposition

Si doped CVD diamond films are prepared on Si substrate by means of hot filament chemical vapor deposition (HFCVD) through adding tetraethoxysilane (TEOS) into acetone as source of reactant gas during the growth process. The samples of diamond films are investigated by scanning electron micrograph (SEM), Raman spectrum, X-ray diffractometry (XRD) and surface profiler. The experimental results show that compared with pure diamond film, Si doped CVD diamond film exhibits grain refinement and smoother surface. Then selective area deposition (SAD) of B-doped diamond films are achieved on both Si doped CVD diamond film and pure CVD diamond film with silicon dioxide layer as sacrificial layer. SEM investigation demonstrates that the boundary of patterning on pure diamond film is rather fuzzy while on pure diamond film it is trim and distinct, which is mainly attributed to the relatively low surface roughness.

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