Microstructural Study of Sn-3.0Ag0.5Cu Alloy on Cu/NiP-Coated Substrate by Addition of Fe, Sb and Ce

2013 ◽  
Vol 858 ◽  
pp. 116-121
Author(s):  
Abu Seman Anasyida ◽  
Mohd Sharif Nurulakmal ◽  
Mahani Yusoff ◽  
Chia Li Teh
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Alloying Element ◽  
Microstructural Study ◽  
Coated Substrate ◽  
Spreading Behavior ◽  
Free Solder

In this study, the effects of alloying elements Fe (0.2 wt.%), Sb (0.5 wt.%) and Ce (0.5 wt.%) on the Sn-3.0Ag-0.5Cu lead-free solder system were investigated. The solder alloy was reflowed on electroless Cu/NiP-coated substrates and their behavior such as microstructure, wetting angle and intermetallic compound (IMC) formation were analyzed. The results showed that the presence of Fe, Ce and Sb reduced the grain size of β-Sn as compared to solder without addition of alloying element. The addition of Fe and Ce was the most significantly refined the microstructure of Sn-3.0Ag-0.5Cu solder alloys. Sn3.0Ag0.5Cu0.2Fe0.5Ce solder was revealed better spreading behavior on Cu/NiP coated substrates which have the lowest IMC thickness of 0.558 μm.

Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys

2015 ◽  
Vol 9 (1) ◽  
pp. 2287-2298
Author(s):  
Rizk Mostafa Shalaby
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Creep Resistance ◽  
Melt Spinning ◽  
Microstructural Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
Hardness Tester ◽  
Free Solder

AbstractThe harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. The melt-spinning processes of ternary Sn-10 wt.%Sb-3 wt.%X (X=In, Ag, Bi and Zn) were analyzed using x-ray diffractometer (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and Vickers hardness tester (HV). The investigation showed that, the addition of a small amount of the third element enhances the ductility of the Sn–10 wt.% Sb lead-free solder due to the formation of a fine, homogeneous ternary microstructure.. It is concluded that, the addition of 3.0 wt% Ag improves the grain size of the ternary microstructure. Moreover, SnSb intermetallic compound, precipitated finely from the solid tin solution near the grain boundaries with antimony. This fine precipitated intermetallic compound suppresses the coarsening of the ternary structure and thus enhances solder ductility. Structural and microstructural analysis revealed that the origin of change in mechanical behaviors was due to refined beta-Sn grains and formation of intermetallic compounds (IMCs) SnSb, InSn19, β-In3Sn and Ag3Sn. The results indicated that the melting point of Sn-10Sb-3 wt.% Ag and Sn-10 wt.%Sb- 3 wt.% Zn alloys reduced to  230 and 240 ˚C respectively.  In particular, the zinc addition at 3 wt.%  is the most effective in improving solder ductility. The good creep resistance of Sn-10 wt.% Sb-3 wt.% Zn lead-free solder correlated to a large β-Sn grain size and complete soluble of SnSb IMC particles in the β-Sn matrix.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder

Enhancement of solder properties of Sn-9Zn lead-free solder alloy

2006 ◽  
Vol 41 (12) ◽  
pp. 1210-1213 ◽  
Author(s):  
M. Kamal ◽  
E. S. Gouda
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder
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