CAE Analysis of the Big-Size Injection Mold of Rear Bumper
2009 ◽
Vol 87-88
◽
pp. 375-380
The MPI/Cool analysis module is used to simulate and analyze the cooling system of the car’s bumper. After improvement, a comparably reasonable cooling system is designed. The situation of curling and warping of the formed bumper parts is simulated and analyzed through the MPI/Warp analysis module, the cause of the excessive warpage in the formed parts is found out and relative solutions are put forward. The forming technology of injection mold is optimized and the problem of excessive warpage is resolved.
2020 ◽
Vol 1578
◽
pp. 012097
2014 ◽
Vol 989-994
◽
pp. 3127-3131
Keyword(s):
2021 ◽
Vol 2044
(1)
◽
pp. 012101
2012 ◽
Vol 152-154
◽
pp. 531-535
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Keyword(s):
2002 ◽
Vol 41
(2)
◽
pp. 261-271
◽
Keyword(s):
Keyword(s):
2013 ◽
Vol 423-426
◽
pp. 1982-1989