RF MEMS for Reconfigurable RF Front-End: Research in Australia

2014 ◽  
Vol 901 ◽  
pp. 105-110 ◽  
Author(s):  
Liang Gong ◽  
King Yuk Chan ◽  
Yi Yang ◽  
Rodica Ramer

This paper reviews some ground breaking development of RF MEMS technology in Australia at the UNSW, over the past decade. It presents some unique and novel designs using RF MEMS switches to achieve reconfigurable RF front-end circuits. These designs include multiport RF MEMS switches, switch matrices, reconfigurable filters and antennas. The resulting devices achieved RF performance that is unmatched by any existing RF andmicrowave technologies.

2011 ◽  
Vol 3 (5) ◽  
pp. 509-520 ◽  
Author(s):  
Montserrat Fernández-Bolaños Badía ◽  
Pierre Nicole ◽  
Adrian Mihai Ionescu

This paper reports on the potential of RF-MEMS technology based on aluminum nitride capacitive dielectric and nickel-suspended membranes to provide RF circuit functions in reconfigurable front-end radios. The RF performance of capacitive switches, distributed MEMS transmission lines (DMTLs) phase shifters for beam steering and tunable filters, including center frequency and bandwidth tuning of bandpass and band-stop filters are presented. Detailed characterization based on S-parameter data demonstrates very promising figures of merit of all fabricated demonstrators from 5 to 40 GHz.


Author(s):  
Kanthamani Sundharajan

Micro-electro mechanical systems (MEMS) technology has facilitated the need for innovative approaches in the design and development of miniaturized, effective, low-cost radio frequency (RF) microwave circuits and systems. This technology is expected to have significant role in today's 5G applications for the development of reconfigurable architectures. This chapter presents an overview of the evolution of MEMS-based subsystems and devices, especially switches and phased array antennas. This chapter also discusses the key issues in design and analysis of RF MEMS-based devices, particularly with primary emphasis on RF MEMS switches and antennas.


2014 ◽  
Vol 2014 ◽  
pp. 1-14 ◽  
Author(s):  
Insu Yeom ◽  
Junghan Choi ◽  
Sung-su Kwoun ◽  
Byungje Lee ◽  
Changwon Jung

The RF front-end performances in the far-field condition of reconfigurable antennas employing two commonly used RF switching devices (PIN diodes and RF-MEMS switches) were compared. Two types of antennas (monopole and slot) representing general direct/coupled feed types were used for the reconfigurable antennas to compare the excited RF power to the RF switches by the reconfigurable antenna types. For the switching operation of the antennas, a biasing circuit was designed and embedded in the same antenna board, which included a battery to emphasize the antenna’s adaptability to mobile devices. The measurement results of each reconfigurable antenna (radiation patterns and return losses) are presented in this study. The receiving power of the reference antenna was measured by varying the transmitting power of the reconfigurable antennas in the far-field condition. The receiving power was analyzed using the “Friis transmission equation” and compared for two switching elements. Based on the results of these measurements and comparisons, we discuss what constitutes an appropriate switch device and antenna type for reconfigurable antennas of mobile devices in the far-field condition.


2016 ◽  
Vol 22 (7) ◽  
pp. 1741-1746 ◽  
Author(s):  
Anna Persano ◽  
Fabio Quaranta ◽  
Giovanni Capoccia ◽  
Emanuela Proietti ◽  
Andrea Lucibello ◽  
...  

Author(s):  
F. Coccetti ◽  
B. Ducarouge ◽  
E. Scheid ◽  
D. Dubuc ◽  
K. Grenier ◽  
...  

2017 ◽  
Vol 2017 (NOR) ◽  
pp. 1-4
Author(s):  
Selin Tolunay Wipf ◽  
Alexander Göritz ◽  
Matthias Wietstruck ◽  
Maurizio Cirillo ◽  
Christian Wipf ◽  
...  

Abstract In this paper, the effect of silicon (Si) cap packaging on the BiCMOS embedded RF-MEMS switch performance is studied. The RF-MEMS switches are designed and fabricated in a 0.25μm SiGe BiCMOS technology for K-band (18 – 27 GHz) applications. The packaging is done based on a wafer-to-wafer bonding technique and the RF-MEMS switches are electrically characterized before and after the Si cap packaging. The experimental data shows the effect of the wafer-level Si cap package on the C-V and S-parameter measurements. The performed 3D FEM simulations prove that the low resistive Si cap, specifically 1 Ω·cm, results in a significant RF performance degradation of the RF-MEMS switch in terms of insertion loss.


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