Development of Cu Brazing Sheet with Cu-P Composite Plating

2007 ◽  
Vol 353-358 ◽  
pp. 2025-2028 ◽  
Author(s):  
Ikuo Shohji ◽  
Susumu Arai ◽  
Naoki Kano ◽  
Noboru Otomo ◽  
Masahisa Uenishi
Keyword(s):  
Joint Strength ◽  
Composite Layer ◽  
Sulfate Solution ◽  
Copper Sulfate Solution ◽  
Composite Plating ◽  
Cu Alloys ◽  
Plating Method ◽  
Brazed Joint ◽  
Plating Layer ◽  
Start Temperature

A Cu brazing sheet has been developed using a Cu-P composite plating method. A Cu-P composite plating layer, which contains 7mass%P, was formed on a Cu plate with a copper sulfate solution including P particles. The melting start temperature of the Cu-P composite layer was determined to be approximately 765°C. Microstructure and joint strength of a brazed joint with the Cu-P composite layer were investigated and compared with those of the joint with a conventional Cu-7P filler foil. As the results of the study, it was clarified that the Cu-P composite layer developed is feasible to use as a brazing material for Cu and Cu alloys.

Computed tomography assessment of soil and sediment porosity modifications from exposure to an acid copper sulfate solution

2021 ◽  
Vol 108 ◽  
pp. 103194
Author(s):  
Francisco R.A. Ziegler-Rivera ◽  
Blanca Prado ◽  
Alfonso Gastelum-strozzi ◽  
Jorge Márquez ◽  
Lucy Mora ◽  
...  
Keyword(s):  
Computed Tomography ◽  
Copper Sulfate ◽  
Sulfate Solution ◽  
Copper Sulfate Solution ◽  
Soil And Sediment

scholarly journals Visualization of Latent Fingerprints on Aluminum

2019 ◽  
Vol 73 (11) ◽  
pp. 945-946
Author(s):  
Rachel Fischer ◽  
Marco Oetken
Keyword(s):  
Corrosion Inhibitor ◽  
Copper Sulfate ◽  
Direct Contact ◽  
Sulfate Solution ◽  
Copper Deposition ◽  
Decisive Factor ◽  
Visualization Method ◽  
Latent Fingerprints ◽  
Copper Sulfate Solution ◽  
Negative Image

For aluminum, a new visualization method is presented in which copper is deposited electrochemically. The fingerprint on the aluminum (trace carrier) serves as an insulator as it prevents direct contact between electrolyte and aluminum. The decisive factor is the choice of an ammoniacal copper sulfate solution, which acts as a corrosion inhibitor due to the ammonia molecules. This enables uniform copper deposition on aluminum and thus the development of a clearly defined negative image.

Fabrication of Nanorod Arrays for Organic Solar Cell Applications

2004 ◽  
Vol 836 ◽  
Author(s):  
Susan Huang ◽  
Harry Efstathiadis ◽  
Pradeep Haldar ◽  
Hee-Gyoun Lee
Keyword(s):  
Solar Cell ◽  
Organic Solar Cells ◽  
Indium Tin Oxide ◽  
Ion Beam ◽  
Sulfate Solution ◽  
Nanorod Array ◽  
Metal Foil ◽  
Nanorod Arrays ◽  
Copper Sulfate Solution ◽  
Copper Nanorods

ABSTRACTWe report on a novel use of nanorod arrays for organic based solar cell devices. A metal foil with copper nanorods attached to the surface was developed by electrodepositing copper from a copper sulfate solution into an anodic alumina oxide (AAO) template that had been coated with a metal on one side. The AAO membrane was dissolved in NaOH leaving behind an aligned array of copper nanorods. This nanorod array was evaluated to explore the possibility of increasing the power conversion efficiency of organic solar cells. Nanorod array characteristics were investigated by focus ion beam, scanning electron microscopy, and x-ray diffraction spectroscopy. A solar cell device was made by applying a polymer layer of poly(2-methoxy-5-(3', 7'-dimethyloctyloxy)-1, 4-phenylene-vinylene) (MDMO-PPV) mixed with 6, 6 phentl-C61-butyl acid-methylester (PCBM) onto the copper nanorod array and sandwiching it with a film of poly(3, 4-ethylenedioxythiophene): poly(styrene-sulfonate) (PEDOT:PSS) applied onto a indium tin oxide coated glass substrate.

Influence on Rare Earth Re3+ by the Performance of Composite Brush Plating of Ni-P

2014 ◽  
Vol 940 ◽  
pp. 7-10
Author(s):  
Zhong Bao Jiang ◽  
Yu Feng Zhang ◽  
Shao Li Duan ◽  
Shou Liang Cao
Keyword(s):  
Corrosion Resistance ◽  
Rare Earth ◽  
Sodium Citrate ◽  
High Hardness ◽  
Abrasive Resistance ◽  
Binding Force ◽  
Plating Method ◽  
Low Phosphorus ◽  
Brush Plating ◽  
Plating Layer

Using the sodium citrate as ligands and adopting electric brush plating method, Re will be deposited together with Ni-P from the solution, and a complex brush plating of Ni-P-Re can be attained. It is discussed the effect of the rare earth Re3+ on the deposition rate, corrosion resistance and bonding strength of the Ni-P composite brush plating. Adding some appropriate Re3+ to the brush plating solution, the amorphous tissue can be obtained under the condition of the low phosphorus brush plating, which make the brush plating layer with high hardness and high abrasive resistance at the same time, binding force and corrosion resistance are improved, and greatly improve the performance of the brush plating.

Formation of Copper Nanowires by Electroless Deposition Using Microtubules as Templates

2008 ◽  
Vol 8 (7) ◽  
pp. 3416-3421
Author(s):  
K. Valenzuela ◽  
S. Raghavan ◽  
P. A. Deymier ◽  
J. Hoying
Keyword(s):  
Electroless Deposition ◽  
Inner Core ◽  
Average Diameter ◽  
Sulfate Solution ◽  
Copper Metallization ◽  
Copper Nanowires ◽  
Electron Microscopic ◽  
Copper Sulfate Solution ◽  
Plating Bath ◽  
Self Assembling

Microtubules (MTs) are self-assembling, protein-based, tubular structures several micrometers long with outer and inner diameters of 25 nm and 15 nm, respectively. This aspect ratio makes MTs ideal templates for producing nanowires for applications such as electrical nano-interconnects. MTs are poorly conductive and their use as interconnects necessitates their metallization. We report a process for metallization of MTs with copper using a biologically benign electroless deposition chemistry consisting of copper sulfate solution containing acetic acid as a complexant and ascorbic acid as reducing agent. The pH of the plating bath is controlled such that copper metallization occurs without disassembling the MTs. Electron microscopic characterization of the morphology and dimensions of the copper nanowires shows that metallization for approximately 1 minute produces a uniform nanowire with an average diameter of approximately 15 nm, suggesting that metallization is initiated selectively from the MT inner core.

Copper deposition on textiles via an automated dispensing process for flexible microstrip antennas

2014 ◽  
Vol 84 (19) ◽  
pp. 2026-2035 ◽  
Author(s):  
Bing Li ◽  
Dapeng Li ◽  
Jiping Wang
Keyword(s):  
Copper Sulfate ◽  
Copper Deposit ◽  
Sulfate Solution ◽  
Microstrip Antennas ◽  
Driving Pressure ◽  
Copper Deposition ◽  
Electrical Performance ◽  
Complexing Agent ◽  
Patch Antennas ◽  
Copper Sulfate Solution

A three-axis automatic robot was coupled with a precision liquid dispenser to deposit copper on fabrics to be used as the conductive layer for assembly of textile-based flexible microstrip patch antennas. Two reactive solutions, copper sulfate and sodium borohydride, were sequentially dispensed on fabrics and a conductive copper was produced in situ and in real time, through a simple redox mechanism. Driving pressure, the number of dispensing cycles, concentration and composition (i.e. the addition of a complexing agent sodium citrate to the copper sulfate solution) of the reactive solutions were studied to optimize the dispensing process in favor of rapid copper deposition. The electrical performance of the resulting copper deposit and its adhesion to the textile substrates were characterized. A copper coating of about 0.2 ohm/□ sheet resistance could be prepared in less than 1 hour under a 45 kPa driving pressure, at a 200 mm·s−1 moving speed, and within 60 dispensing cycles.

Sign in / Sign up

Export Citation Format

Share Document