The Effect of a Rotating Heat Pipe in a Brazed Diamond Grinding Wheel on Grinding Temperature

A new type of brazed diamond grinding wheel with a rotating heat pipe is developed to effectively remove the heat generated in the grinding zone meanwhile minimize the pollution and contamination of the environment. A grinding temperature-measurement experiment of titanium alloy was conducted to evaluate enhanced heat transfer effect of the rotating heat pipe on the grinding zone. The experiment results show that, when grinding using the wheel with heat pipe the grinding temperature decreases 30% than that using the wheel without heat pipe.

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Research on Grinding Temperature of Nano ZrO2 Ceramics Using Diamond Grinding Wheel Dressed by Elliptic Ultrasonic Vibration

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.42.313 ◽

2010 ◽

Vol 42 ◽

pp. 313-316 ◽

Cited By ~ 4

Author(s):

Jin Xue Xue ◽

Bo Zhao

Keyword(s):

Comparative Analysis ◽

Ceramic Material ◽

Ultrasonic Vibration ◽

Grinding Wheel ◽

Grinding Temperature ◽

Grinding Wheels ◽

Vibration Method ◽

Diamond Grinding Wheel ◽

Diamond Grinding

In order to investigate the influence of dressing methods on grinding temperature, two kinds of diamond grinding wheels dressed by traditional dressing(TD) and elliptic ultrasonic vibration dressing(ED) respectively were used to grind the same nano-ceramic material. Through grinding experiments, the comparative analysis of the grinding temperature was conducted. The results show that diamond grinding wheel dressed by elliptical ultrasonic vibration method can decrease the grinding temperature.

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Investigation on Heat Transfer Performance of Heat Pipe Grinding Wheel in Dry Grinding

Journal of Manufacturing Science and Engineering ◽

10.1115/1.4033445 ◽

2016 ◽

Vol 138 (11) ◽

Cited By ~ 4

Author(s):

Qingshan He ◽

Yucan Fu ◽

Jiajia Chen ◽

Wei Zhang

Keyword(s):

Heat Transfer ◽

Thermal Conductivity ◽

Heat Pipe ◽

Heat Transfer Performance ◽

Grinding Wheel ◽

Grinding Temperature ◽

Transfer Performance ◽

Equivalent Thermal Conductivity ◽

Dry Grinding ◽

Pipe Heat

The use of fluid in grinding enhances heat exchange at the contact zone and reduces grinding temperature. However, the massive use of fluid can cause negative influences on environment and machining cost. In this paper, a novel method of reducing grinding temperature based on heat pipe technology is proposed. One new heat pipe grinding wheel and its heat transfer principle are briefly introduced. A heat transfer mathematical model is established to calculate equivalent thermal conductivity of heat pipe grinding wheel. Compared with the wheel without heat pipe, heat transfer effect of heat pipe grinding wheel is presented, and the influences of heat flux input, cooling condition, wheel speed, and liquid film thickness on heat transfer performance are investigated. Furthermore, dry grinding experiments with two different wheels are conducted to verify the cooling effectiveness on grinding temperature. The results show that thermal conductivity of the wheel with heat pipe can be greatly improved compared to the one without heat pipe; heat transfer performance of heat pipe grinding wheel can change with different grinding conditions; meanwhile, grinding temperatures can be significantly decreased by 50% in dry grinding compared with the wheel without heat pipe.

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The Application of Enhanced Cooling Technology to Grinding Process

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.442.36 ◽

2013 ◽

Vol 442 ◽

pp. 36-39

Author(s):

Ke Ma

Keyword(s):

Heat Transfer ◽

Grinding Wheel ◽

Grinding Process ◽

Grinding Temperature ◽

Creep Feed Grinding ◽

Creep Feed ◽

Surface Burning ◽

New Type ◽

Cooling Technology ◽

The Comparative Study

An experimental study was performed to analyze the feasibility of heat pipe cooling in creep feed grinding applications. A new type of grinding wheel is developed to enhance the heat transfer of the grinding contact zone then decrease the grinding temperature. The performance of the new type grinding wheel was evaluated by measuring the grinding temperature when it was creep feed grinding the Ti-6Al-4V Alloy and the experimental results were compared with an ordinary grinding wheel. Results of the comparative study indicated that the use of enhanced cooling technology in a grinding wheel can decrease the grinding temperature significantly thus avoid the surface burning in grinding.

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Heat Pipe Grinding Wheel in Grinding Titanium Alloy Ti-6Al-4V

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.797.534 ◽

2013 ◽

Vol 797 ◽

pp. 534-539 ◽

Cited By ~ 1

Author(s):

Qing Shan He ◽

Yu Can Fu ◽

Jia Jia Chen ◽

Wei Zhang

Keyword(s):

Heat Transfer ◽

Titanium Alloy ◽

Heat Pipe ◽

Heat Transfer Enhancement ◽

Contact Zone ◽

Grinding Wheel ◽

Grinding Temperature ◽

Transfer Principle ◽

Transfer Enhancement

Heat pipe grinding wheel (HPGW) is a new grinding wheel which can improves heat transfer enhancement with the contact zone by means of the heat pipe technology. In this paper, the heat transfer principle and making process about heat pipe grinding wheel is illustrated. After then, grinding experiments with HPGW were carried out to verify the effect of heat transfer in the grinding titanium alloy Ti-6Al-4V. Results showed that using HPGW could significantly reduce grinding temperature and prevent the burnout in the grinding.

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Research on Grinding Temperature of a New Diamond Grinding Wheel

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.652-654.2205 ◽

2013 ◽

Vol 652-654 ◽

pp. 2205-2208

Author(s):

Qiao Ping Wu ◽

Zhao Hui Deng ◽

Yan Li Gong

Keyword(s):

Diamond Wheel ◽

Experimental Results ◽

Grinding Wheel ◽

Grinding Process ◽

Grinding Temperature ◽

Al2o3 Ceramic ◽

Diamond Grinding Wheel ◽

Diamond Grinding

It is aimed at developing a new diamond wheel in order to overcome the shortages of traditional grinding wheel, such as the abrasive easily fall off the grinding wheel prematurely, high grinding temperature, random grits distribution and the loading problems become more severe in grinding process. And further study on the grinding temperature of the new diamond wheel prepared in comparison with traditional resin-bonded diamond grinding wheel in machining Al2O3 ceramic. The prepared new diamond wheel has many diamond fibers involved in grinding process which are artificially ordered, diamond grits are not easily fall off, and it has big chip-pocket space and heat dissipating capability. The experimental results indicated that the grinding temperature of the new diamond wheel in comparison with the conventional diamond wheel under the same conditions was decreased by 80°C-120°C.

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Experimental Study on Heat Transfer Effect of Heat Pipe Grinding Wheel

Materials Science Forum ◽

10.4028/www.scientific.net/msf.770.95 ◽

2013 ◽

Vol 770 ◽

pp. 95-99

Author(s):

Jia Jia Chen ◽

Yu Can Fu ◽

Qing Shan He ◽

Chen Chen ◽

Wei Zhang

Keyword(s):

Heat Transfer ◽

Experimental Study ◽

Heat Pipe ◽

Thermal Damage ◽

Transfer Effect ◽

Working Fluid ◽

Grinding Wheel ◽

Rotating Speed ◽

Enhancing Heat Transfer ◽

Zone Temperature

High temperature in grinding can cause thermal damage to the workpiece. In order to reduce the grinding zone temperature, a method about enhancing heat transfer based on the rotation heat pipe technology is proposed. In this paper, the heat transfer effect of heat pipe grinding wheel (HPGW) under different conditions such as the rotating speed of grinding wheel, the kinds of working fluid and the film thickness are analyzed. The results show that the HPGW has great superiority of heat transfer under certain conditions.

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Investigation of tribological conditions on grinding of bioceramic material using diamond grinding wheel under different cooling and lubrication environment

Journal of Manufacturing Processes ◽

10.1016/j.jmapro.2021.09.004 ◽

2021 ◽

Vol 71 ◽

pp. 550-564

Author(s):

N. Arunachalam ◽

P. Suya Prem Anand ◽

L. Vijayaraghavan

Keyword(s):

Grinding Wheel ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Cooling And Lubrication

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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.389-390.36 ◽

2008 ◽

Vol 389-390 ◽

pp. 36-41

Author(s):

Feng Wei Huo ◽

Dong Ming Guo ◽

Ren Ke Kang ◽

Zhu Ji Jin

Keyword(s):

Surface Topography ◽

Sampling Interval ◽

Grinding Wheel ◽

Height Distribution ◽

Wheel Surface ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Cutting Surface ◽

Ultra Precision ◽

Cutting Direction

A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface topography of a #3000 diamond grinding wheel, and a large sampling area could be achieved by its stitching capability without compromising its lateral or vertical resolution. The protrusion height distribution of diamond grains and the static effective grain density of the grinding wheel were derived, and the wheel chatter and the deformation of the wheel were analyzed as well. The study shows that the grain protrusion height obeys an approximate normal distribution, the static effective grain density is much lower than the theoretical density, and only a small number of diamond grains are effective in the grinding process with fine diamond grinding wheel. There exists waviness on the grinding wheel surface parallel with the wheel cutting direction. The cutting surface of the grinding wheel is not flat but umbilicate, which indicates that the elastic deformation at the wheel edges is much larger than in the center region.

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