Current Activities for Standardization of Test Method for Interfacial Fracture Toughness of Thermal Spray Coatings in Japan

2013 ◽  
Vol 577-578 ◽  
pp. 149-152
Author(s):  
Masayuki Arai ◽  
Yasuhiro Yamazaki ◽  
Masato Suzuki ◽  
Yukio Miyashita ◽  
H. Waki
Keyword(s):  
Fracture Toughness ◽  
Thermal Spray ◽  
Indentation Test ◽  
Hardness Test ◽  
Interfacial Fracture ◽  
Standard Test ◽  
Test Method ◽  
Test Machine ◽  
Interfacial Fracture Toughness ◽  
Spray Coatings

Collaborative research has been conducted by the Japan Thermal Spray Society (JTSS) to establish a standard test method for evaluating the interfacial fracture toughness of thermal sprayed coatings, including thermal barrier coatings. The test method is based upon the indentation test method utilizing a conventional Vickers hardness test machine. In this committee, round robin tests were performed to check differences in the evaluated results among collaborators. This paper reports on the progress of such activity in Japan.

Determination of Interfacial Fracture Toughness of Thermal Spray Coatings by Indentation

2013 ◽  
Vol 22 (8) ◽  
pp. 1358-1365 ◽  
Author(s):  
Yasuhiro Yamazaki ◽  
Masayuki Arai ◽  
Yukio Miyashita ◽  
Hiroyuki Waki ◽  
Masato Suzuki
Keyword(s):  
Fracture Toughness ◽  
Thermal Spray ◽  
Interfacial Fracture ◽  
Thermal Spray Coatings ◽  
Interfacial Fracture Toughness ◽  
Spray Coatings

Interfacial Fracture Toughness Measurement of Thick Ceramic Coatings by Indentation

2005 ◽  
Vol 290 ◽  
pp. 183-190 ◽  
Author(s):  
Marion Bartsch ◽  
Iulian Mircea ◽  
Jens Suffner ◽  
Bernd Baufeld
Keyword(s):  
Fracture Toughness ◽  
Cross Sections ◽  
Interfacial Fracture ◽  
Ceramic Coatings ◽  
Test Method ◽  
Propagation Path ◽  
Material System ◽  
Coating System ◽  
Interfacial Fracture Toughness ◽  
Adhesive Properties

The basic requirement for the use of a ceramic coating is sufficient adhesion to its substrate. A measure of the adhesive properties of a coating is the interfacial fracture toughness. The test method applicable for interfacial fracture toughness measurements depends on the mechanical properties of the material system and the geometry of the test piece. In this work, indentation methods have been evaluated for the estimation of the fracture toughness of ceramic thermal barrier coatings on metallic substrates. Coatings of 100 to 300 µm thickness were applied by electron beam – physical vapour deposition. The performed test types were Vickers indentation at the interface of polished cross sections of the coating system and Rockwell indentation with a brale C indenter, penetrating the coating perpendicular to the surface. Both tests generate delamination, in which the delamination crack length corresponds to the interfacial fracture toughness. Fracture surfaces and cross sections of the fractured coatings were investigated by optical and scanning electron microscope. Determined fracture toughness values are discussed with respect to the loading conditions in the test and the fracture process – i.e. interaction between indenter and coating system and the crack propagation path.

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

2005 ◽  
Author(s):  
Jiantao Zheng ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Critical Energy ◽  
Test Method ◽  
Interfacial Fracture Toughness ◽  
Critical Energy Release Rate ◽  
Nano Scale ◽  
Thin Film Adhesion ◽  
Single Strip

A new test method, Single-Strip Decohesion Test (SSDT), has been developed and used to measure the interfacial fracture toughness of nano-scale thin film on substrate. This fixtureless test employs a stress-engineered superlayer deposited on patterned titanium (Ti) film strips to supply the energy for the delamination from a thick silicon (Si) substrate. The amount of energy available for delamination propagation is varied by fabricating an etchable thin release layer of varying width between the film strips and the substrate. By designing a decreasing area of the release layer, it is possible to arrest the delamination at a given location, and the interfacial fracture toughness or critical energy release rate can be found at the location where the delamination ceases to propagate. Common IC fabrication techniques are used to prepare the sample and execute the test, thereby making the test compatible with current microelectronic or MEMS facilities and suitable for in process measurement of thin film adhesion strength. The methodology presented in this paper is generic in nature, and can be used to measure the process-dependent interfacial fracture toughness of various micro-scale and nano-scale thin film interfaces. Ti thin film with thickness ranging from 5nm to 100nm can be studied using this method.

Numerical Analysis of Three-Dimensional Semi-Elliptical Interfacial Cracks Subjected to Indentation Load

2014 ◽  
Vol 627 ◽  
pp. 289-292 ◽  
Author(s):  
N. Kurihara ◽  
Masayuki Arai
Keyword(s):  
Fracture Toughness ◽  
Three Dimensional ◽  
Analytical Formula ◽  
Interfacial Crack ◽  
Indentation Test ◽  
Interfacial Fracture ◽  
Indentation Load ◽  
J Integral ◽  
Interfacial Fracture Toughness ◽  
Interfacial Cracks

The aim of this study is to show elastic J-integral needed to evaluate the interfacial fracture toughness of bi-material in indentation test. Three dimensional J-integrals along the crack front tip in semi-elliptical crack lying on the interface were analyzed using domain integral technique installed in commercialized finite element code MARC. The J-integral was calculated under several kind of aspect ratio of semi-elliptical cracks. In order to have to evaluate the interfacial fracture toughness from interfacial crack length and indentation load obtained in indentation tests, the analytical formula for two dimensional interfacial crack J-integral under plane stress, which had been introduced by J. R. Rice and G. C. Sih, was modified in reflecting upon the three dimensional effect. Finally, the indentation test was conducted for Aluminum alloy/ PMMA combination sample, and the associated fracture toughness was evaluated.Fig.1 Schematic illustration of indentation testFig.2 Schematic illustration of analysis mode

Sign in / Sign up

Export Citation Format

Share Document