The Optimization of Process Parameters by Fixed Abrasive Pad for Lapping Magnesium Aluminate Spinel

2016 ◽  
Vol 693 ◽  
pp. 973-981
Author(s):  
Zhan Kui Wang ◽  
Yan Ling Zheng ◽  
Jian Guo Yao ◽  
Jian Xiu Su
Keyword(s):  
Surface Quality ◽  
Process Parameters ◽  
Removal Rate ◽  
Orthogonal Experiment ◽  
Magnesium Aluminate ◽  
Magnesium Aluminate Spinel ◽  
Optimization Of Process Parameters ◽  
Fixed Abrasive Pad ◽  
Fixed Abrasive

The process parameters affect the lapping efficiency and the surface quality of work pieces. The fixed abrasive pad of w3-5 diamond abrasive was used for lapping magnesium aluminate spinel wafers in orthogonal experiment. The affection of lapping pressure, plate speed and slurry type on material removal rate (MRR) and surface roughness Ra were investigated. Finally, the process parameters were optimized. The results showed that lapping efficiencies were higher and the surface quality was better on the conditions of Zhongjing slurry, lapping pressure 10.37Kpa and plate speed 100rpm.

Fixed Abrasive Lapping and Polishing of Hard Brittle Materials

2010 ◽  
Vol 426-427 ◽  
pp. 589-592 ◽  
Author(s):  
Jun Li ◽  
Yong Wei Zhu ◽  
Dun Wen Zuo ◽  
Kui Lin ◽  
M. Li
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Removal Rate ◽  
Brittle Materials ◽  
Process Conditions ◽  
High Productivity ◽  
Fixed Abrasive ◽  
K9 Glass ◽  
Panel Glass

Fixed abrasive lapping and polishing (FALP) is a new machining technology and was adopted to manufacture hard brittle materials and obtain the high productivity because of fixed abrasive. The preparation process of fixed abrasive pad (FAP) was described. FALP of K9 glass, mobile panel glass and Si were investigated with fixed 5-10 µm diamond abrasives. The effect on material removal rate (MRR) and surface quality of different materials was studied. The results show that in the same FALP process conditions, Si is the highest MRR and reaches 4428 nm/min, mobile panel glass is inferior to and K9 glass is the lowest. And surface quality of mobile panel glass that surface roughness Sa is 2.10 nm and little and less damages is the best, Si is followed and K9 glass is the worst. So FALP can obtain the higher MRR and reaches several micrometers per minute and the better quality that surface roughness Sa can reach nanometer level for different materials.

scholarly journals The effect of slurries on lapping performance of fixed abrasive pad for Si3N4 ceramics

2020 ◽  
Vol 103 (4) ◽  
pp. 003685042098245
Author(s):  
Wang Zhankui ◽  
Pang Minghua ◽  
Liang Mingchao ◽  
Yao Jianguo ◽  
Ma Lijie ◽  
...  
Keyword(s):  
Surface Quality ◽  
Ph Value ◽  
Removal Rate ◽  
Hydrogen Ion ◽  
Wafer Surface ◽  
Series Of Experiments ◽  
Fixed Abrasive Pad ◽  
Fixed Abrasive ◽  
Si3n4 Ceramics ◽  
Scanning Electron

In this paper, a series of experiments were carried out to explore the effect of slurry pH on materials removal rate (MRR) and surface quality in lapping of Si3N4 ceramics wafers with fixed abrasive pad (FAP) using different slurries with different pH. Then, the scanning electron microscope was employed to detect the microtopography and abrade smooth of FAP for exploring the effect of slurries pH on self-conditioning of pad. Experimental results demonstrated that the roughness of wafers increase with the increasing of slurry pH value. The surface of wafers is the best when the pH = 1 and the worst When the pH = 13. The MRR decreases firstly and then decreases with the increasing of the pH. The MRR reaches the lowest when slurry pH = 7, and reaches the highest when slurry pH = 13. These results further suggest that the soften layer of SiO2 could be formed due to the reactions between water and materials on wafer surface, which facilitates increasing material remove rate and improving the surface quality. The hydrogen ion and triethanolamine in slurry could react with the copper in fixed abrasive pad, which also could enhance the materials remove rate and affect the surface quality.

Optimization of Process Parameters Based on Multi-Process and Multi-Evaluation Index for Function Ceramics in CMP

2013 ◽  
Vol 797 ◽  
pp. 266-272
Author(s):  
Zi Hua Hu ◽  
Jiao Peng ◽  
Man Ke Gao
Keyword(s):  
Surface Roughness ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Orthogonal Experiment ◽  
Weight Ratio ◽  
Optimization Method ◽  
Evaluation Index ◽  
Optimization Of Process Parameters

To enhance polishing quality, polishing efficiency and improve the backward state based on single-process way for function ceramics in CMP, a new optimization method of process parameters based on multi-process and multi-evaluation theory is put forward. Firstly, based on experimental data obtained from orthogonal experiment, the optimal combinations of process parameters are got separately in term of surface roughness and material removal rate, which is optimized by Taguchi method in each process. Secondly, combining analysis of evaluation index weight ratio with analysis of variance, the final optimal combination of process parameters is received under the integrated evaluation of surface roughness and material removal rate. Finally, the contrast verification results show that the proposed optimization method is effective.

scholarly journals Modeling and Parameter Optimization of Flexible NC Polishing Vibration of Abrasive Cloth Wheel Based on Sensitivity Analysis

2020 ◽  
Vol 2020 ◽  
pp. 1-12
Author(s):  
Xiaojun Lin ◽  
Rui Yang ◽  
Xiaopeng Xin ◽  
Zhaozhao Lei ◽  
Luzhou Sun
Keyword(s):  
Sensitivity Analysis ◽  
Surface Quality ◽  
Process Parameters ◽  
Orthogonal Experiment ◽  
Theoretical Research ◽  
Stable Range ◽  
Polishing Process ◽  
Stability Range ◽  
Polishing Tool

The blisk is a typical cantilever beam structure, which is prone to vibration during the polishing process. This vibration will cause the polishing tool to wear seriously and reduce the surface quality of the blade.In order to control the vibration of polishing process, a method of predicting the RMS (root mean square) value of polishing vibration signal was proposed. Firstly, an empirical model of process parameters for polishing vibration was established by an orthogonal experiment. Then, based on the response surface and sensitivity analysis method, the stability range of the process parameters and the influence on the polishing vibration are obtained. Finally, through the polishing experiment, it is determined that the stable range of each process parameter is reliable. There is no significant vibration during the polishing process. By analyzing the surface texture and surface topography of the blade, the surface quality of the blade meets the requirements. The results showed that the optimal stability ranges of significant parameters through sensitivity analysis are compression depth within [0.6 mm, 0.9 mm], spindle speed within [6000 r/min, 7500 r/min], feed rate within [0.4 mm/min, 0.6 mm/min], and granularity within [400#, 600#]. This study provides a basis for the theoretical research of polishing vibration in the flexible polishing process and the relationship between process parameters and polishing vibration.

Lapping and Polishing of Sapphire Wafer with Fixed Abrasive Pad

2014 ◽  
Vol 1027 ◽  
pp. 68-71 ◽  
Author(s):  
Jian Bin Wang ◽  
Yong Wei Zhu ◽  
Jun Xu ◽  
Zhan Kui Wang ◽  
Ji Hua Miao
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Sapphire Wafer ◽  
Good Surface ◽  
Good Surface Quality ◽  
Fixed Abrasive Pad ◽  
Fixed Abrasive

The processing technology of sapphire with a high material removal rate a good surface quality is critical for its applications. The experiment of sapphire lapping and polishing was carried out by using three different fixed abrasive pad (FAP). Their material removal rate (MRR) and surface roughness (Ra) were measured and analyzed. Results indicate that a MRR of 5.6μm/min reaches in rough lapping and a MRR of 0.4μm/min in fine lapping. The average surface roughness Ra of rough lapping and fine lapping is 142nm and 1.2nm respectively. The processing efficiency of sapphire wafer is effectively improved and a good surface quality is obtained when FAP adopted.

Process Optimization of Lapping Sapphire Substrate with Fixed Diamond Abrasive Pad

2016 ◽  
Vol 693 ◽  
pp. 1090-1097 ◽  
Author(s):  
Jian Bin Wang ◽  
Zhen Li ◽  
Hong Gao ◽  
Da Shu ◽  
Ping Xiao
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Sapphire Substrate ◽  
Material Removal ◽  
Removal Rate ◽  
Orthogonal Experiment ◽  
Machining Parameters ◽  
Fixed Abrasive Pad ◽  
Fixed Abrasive ◽  
Diamond Abrasive

The production cost of the sapphire substrate was restricted by the efficiency of processing and the surface quality. A proposed level orthogonal experiment was conducted to reveal the effect of workbench speed, lapping pressure, the Concentration of triethanolamine and abrasive pad types on the material removal rate and surface roughness and morphology of sapphire substrate when lapped with a diamond fixed-abrasive pad. The results showed that the average material removal rate of sapphire is about 24μm/min, and the surface roughness Ra achieves 0.36μm when the 200/230 mesh diamond fixed-abrasive pad was used. The material removal rate and the surface roughness as the optimization goal, the optimal lapping parameters were as follows: the lapping pad with raised, lapping pressure 0.075MPa, workbench speed 120rpm and the Concentration of triethanolamine 1%. Under these optimal machining parameters, the material removal rate reached 42μm /min and the surface roughness Ra reached 0.37μm.

Effect of process parameters on fixed abrasive pad self-conditioning in micro/nano machining

2017 ◽  
Vol 182 (1) ◽  
pp. 53-64 ◽  
Author(s):  
Jun Li ◽  
Yongkai Tang ◽  
Chengxu Hua ◽  
Taiyu Guo ◽  
Yongwei Zhu ◽  
...  
Keyword(s):  
Process Parameters ◽  
Fixed Abrasive Pad ◽  
Fixed Abrasive

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

The mechanism of process parameters influencing the AlSi10Mg side surface quality fabricated via laser powder bed fusion

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Shimin Dai ◽  
Hailong Liao ◽  
Haihong Zhu ◽  
Xiaoyan Zeng
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Process Parameters ◽  
Laser Power ◽  
Side Surface ◽  
Laser Powder Bed Fusion ◽  
Scanning Velocity ◽  
Content Type ◽  
Powder Bed

Purpose For the laser powder bed fusion (L-PBF) technology, the side surface quality is essentially important for industrial applicated parts, such as the inner flow parts. Contour is generally adopted at the parts’ outline to enhance the side surface quality. However, the side surface roughness (Ra) is still larger than 10 microns even with contour in previous studies. The purpose of this paper is to study the influence of contour process parameters, laser power and scanning velocity on the side surface quality of the AlSi10Mg sample. Design/methodology/approach Using L-PBF technology to manufacture AlSi10Mg samples under different contour process parameters, use a laser confocal microscope to capture the surface information of the samples, and obtain the surface roughness Ra and the maximum surface height Rz of each sample after analysis and processing. Findings The results show that the side surface roughness decreases with the increase of the laser power at the fixed scanning velocity of 1,000 mm/s, the side surface roughness Ra stays within the error range as the contour velocity increases. It is found that the Ra increases with the scanning velocity increasing and the greater the laser power with the greater Ra increases when the laser power of contour process parameters is 300 W, 350 W and 400 W. The Rz maintain growth with the contour scanning velocity increasing at constant laser power. The continuous uniform contour covers the pores in the molten pool of the sample edge and thus increase the density of the sample. Two mechanisms named “Active adhesion” and “Passive adhesion” cause sticky powder. Originality/value Formation of a uniform and even contour track is key to obtain the good side surface quality. The side surface quality is determined by the uniformity and stability of the contour track when the layer thickness is fixed. These research results can provide helpful guidance to improve the surface quality of L-PBF manufactured parts.

Sign in / Sign up

Export Citation Format

Share Document