Towards the Problem of Construction an SPD Stress-Strain Curve for Low-Plastic Materials

2020 ◽  
Vol 839 ◽  
pp. 189-195
Author(s):  
Pavel G. Morrev ◽  
Kostya I. Kapyrin ◽  
I.M. Gryadunov ◽  
Sergey Y. Radchenko ◽  
Daniil O. Dorokhov ◽  
...  

Stress-strain curve construction for low-plastic alloys under severe plastic deformation conditions is considered. A material under investigation is cast bronze Cu85-Pb5-Sn5-Zn5. Experiments on upsetting and deep rolling were conducted. Based on these data, the initial hardening modular and the hardening modular at large strain were evaluated. Classic tests on determining an initial segment of stress-strain curve can lead to grate mistakes because shear band sliding can diminishes appreciably both yield stress and hardening modular. A correct methodology for stress-strain curve construction is proposed.

1948 ◽  
Vol 15 (3) ◽  
pp. 222-225
Author(s):  
H. F. Bohnenblust ◽  
Pol Duwez

Abstract Various mechanical models explaining the plastic deformation of metals have been proposed. One of the present authors has shown that in some cases an analytical expression for the stress-strain curve and the hysteresis curve of a metal in the plastic range can be deduced from such a model. The present investigation is a further analysis of the model leading to the computation of the change in potential energy of the metal due to work-hardening.


2010 ◽  
Vol 2010.85 (0) ◽  
pp. _2-1_
Author(s):  
Keishi YONEDA ◽  
Akio YONEZU ◽  
Masayuki SAKIHARA ◽  
Hiroyuki HIRAKATA ◽  
Koji MINOSHIMA

1997 ◽  
Vol 119 (2) ◽  
pp. 81-84 ◽  
Author(s):  
A. Gilat ◽  
K. Krishna

A new configuration for testing thin layers of solder is introduced and employed to study the effects of strain rate and thickness on the mechanical response of eutectic Sn-Pb solder. The solder in the test is loaded under a well defined state of pure shear stress. The stress and deformation in the solder are measured very accurately to produce a reliable stress-strain curve. The results show that both the stress needed for plastic deformation and ductility increase with increasing strain rate.


2014 ◽  
Vol 600 ◽  
pp. 82-89 ◽  
Author(s):  
Yasuhiro Yogo ◽  
Masatoshi Sawamura ◽  
Masafumi Hosoya ◽  
Michiaki Kamiyama ◽  
Noritoshi Iwata ◽  
...  

2017 ◽  
Vol 207 ◽  
pp. 161-166 ◽  
Author(s):  
Yasuhiro Yogo ◽  
Masatoshi Sawamura ◽  
Risa Harada ◽  
Kosei Miyata ◽  
Noritoshi Iwata ◽  
...  

Author(s):  
Qian Wu ◽  
Yong Wang ◽  
Tao Han ◽  
Hongtao Wang ◽  
Laihui Han ◽  
...  

Abstract The tensile tests of BCC Fe nanowires were simulated through molecular dynamics methods. The temperature and strain rate effects on the mechanical properties as well as the orientation-dependent plastic deformation mechanism were analyzed. For [001]-oriented BCC Fe nanowires, as the temperature increased, the yield stress and Young's modulus decreased. While the yield stress and Young's modulus increased as the strain rate increased. With the increase of temperature, when the temperature was less than 400 K, the twin propagation stress decreased dramatically, and then tended to reach a saturation value at higher temperatures. Under different temperatures and strain rates, the [001]-oriented Fe nanowires all deformed by twinning. The oscillation stage in the stress-strain curve corresponds to the process from the nucleation of the twin to the reorientation of the nanowire. For [110]-oriented Fe nanowires, the plastic deformation is dominated by dislocation slip. The independent events such as the nucleation, slip, and annihilation of dislocations are the causes of the unsteady fluctuations in the stress-strain curve. The Fe nanowires eventually undergo shear damage along the dominant slip surface.


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