Micro Electrical Discharge Machining Thermal Effect on Micro-Cracks Generation on Silicon Material

2021 ◽  
Vol 1047 ◽  
pp. 41-49
Author(s):  
Xiao Zhong Song
Keyword(s):  
Electrical Discharge Machining ◽  
Crystalline Silicon ◽  
Local Area ◽  
Silicon Wafers ◽  
Adverse Side Effect ◽  
Micro Edm ◽  
Crystalline Orientation ◽  
Surface Machining ◽  
Crack Generation ◽  
Micro Cracks

Various novel 3D micro machining technologies were researched and developed for silicon micro mechanical system fabrication. Micro EDM is one of them. The material removal mechanism is thermal sparking erosion and is completely independent with regards to the crystalline orientation of silicon, therefore there is no orientation constraint in processing the complex 3D geometry of silicon wafers. As thermal sparking implied, the process features local area high temperature melting and evaporating, and this characteristic has an adverse side-effect on the sparked surface integrity. One important concern is the generation of micro cracks, which would provide an adverse effect on the fatigue life of the micro feature element made of silicon. For this consideration, in this paper, with the experiment and SEM picture analysis approach, the author explored the micro crack generation characteristics on mono crystalline silicon wafers under micro EDM with available sparking energies and on the different crystal orientation surface machining. The generation of micro cracking is not only related with the sparking energy but also related with the crystalline orientation. The {100} orientation is the strongest surface to resist crack generation. For a strong-doped P type silicon wafer, there exists a maximum crack energy threshold. If single sparking energy is over this threshold, micro cracks unavoidably would be generated on any orientation surface. Two types of chemical etching post processes that can remove cracks on sparked surfaces are also tested and discussed.

Detection and analysis of micro-cracks in multi-crystalline silicon wafers during solar cell production

2011 ◽  
Author(s):  
Matthias Demant ◽  
Stefan Rein ◽  
Jonas Krisch ◽  
Stephan Schoenfelder ◽  
Carola Fischer ◽  
...  
Keyword(s):  
Solar Cell ◽  
Crystalline Silicon ◽  
Silicon Wafers ◽  
Cell Production ◽  
Micro Cracks

Recombination Characteristics of Single-Crystalline Silicon Wafers with a Damaged Near-Surface Layer

2013 ◽  
Vol 58 (2) ◽  
pp. 142-150 ◽  
Author(s):  
A.V. Sachenko ◽  
◽  
V.P. Kostylev ◽  
V.G. Litovchenko ◽  
V.G. Popov ◽  
...  
Keyword(s):  
Surface Layer ◽  
Crystalline Silicon ◽  
Silicon Wafers ◽  
Single Crystalline Silicon ◽  
Near Surface ◽  
Single Crystalline

Recent Patents on Micro-EDM Milling

2020 ◽  
Vol 13 (3) ◽  
pp. 219-229
Author(s):  
Baocheng Xie ◽  
Jianguo Liu ◽  
Yongqiu Chen
Keyword(s):  
Electrical Discharge ◽  
Electrical Discharge Machining ◽  
Three Dimensional ◽  
Processing Method ◽  
Electrode Wear ◽  
Micro Edm ◽  
Processing Efficiency ◽  
Processing Methods ◽  
Machining Quality ◽  
Micro Electrical Discharge Machining

Background: Micro-Electrical Discharge Machining (EDM) milling is widely used in the processing of complex cavities and micro-three-dimensional structures, which is a more effective processing method for micro-precision parts. Thus, more attention has been paid on the micro-EDM milling. Objective : To meet the increasing requirement of machining quality and machining efficiency of micro- EDM milling, the processing devices and processing methods of micro-EDM milling are being improved continuously. Methods: This paper reviews various current representative patents related to the processing devices and processing methods of micro-EDM milling. Results: Through summarizing a large number of patents about processing devices and processing methods of micro-EDM milling, the main problems of current development, such as the strategy of electrode wear compensation and the development trends of processing devices and processing methods of micro-EDM milling are discussed. Conclusion: The optimization of processing devices and processing methods of micro-EDM milling are conducive to solving the problems of processing efficiency and quality. More relevant patents will be invented in the future.

Carrier Lifetime Measurements by Photoconductance at Low Temperature on Passivated Crystalline Silicon Wafers

2013 ◽  
Vol 1536 ◽  
pp. 119-125 ◽  
Author(s):  
Guillaume Courtois ◽  
Bastien Bruneau ◽  
Igor P. Sobkowicz ◽  
Antoine Salomon ◽  
Pere Roca i Cabarrocas
Keyword(s):  
Low Temperature ◽  
Electron Mobility ◽  
Carrier Density ◽  
Carrier Lifetime ◽  
Minority Carrier ◽  
Crystalline Silicon ◽  
Silicon Wafers ◽  
Doping Density ◽  
Lifetime Measurements ◽  
Effective Lifetime

ABSTRACTWe propose an implementation of the PCD technique to minority carrier effective lifetime assessment in crystalline silicon at 77K. We focus here on (n)-type, FZ, polished wafers passivated by a-Si:H deposited by PECVD at 200°C. The samples were immersed into liquid N2 contained in a beaker placed on a Sinton lifetime tester. Prior to be converted into lifetimes, data were corrected for the height shift induced by the beaker. One issue lied in obtaining the sum of carrier mobilities at 77K. From dark conductance measurements performed on the lifetime tester, we extracted an electron mobility of 1.1x104 cm².V-1.s-1 at 77K, the doping density being independently calculated in order to account for the freezing effect of dopants. This way, we could obtain lifetime curves with respect to the carrier density. Effective lifetimes obtained at 77K proved to be significantly lower than at RT and not to depend upon the doping of the a-Si:H layers. We were also able to experimentally verify the expected rise in the implied Voc, which, on symmetrically passivated wafers, went up from 0.72V at RT to 1.04V at 77K under 1 sun equivalent illumination.

Research on Material Erosion Mechanisms of High Si-Al Alloy by Micro-EDM

2013 ◽  
Vol 652-654 ◽  
pp. 1157-1162
Author(s):  
Fu Qiang Hu ◽  
Jian Fei Sun ◽  
Jun Qi Wei ◽  
Yong Zhang ◽  
Yan Dong Jia ◽  
...  
Keyword(s):  
Electrical Discharge Machining ◽  
Spray Forming ◽  
Copper Electrode ◽  
Al Alloy ◽  
Micro Edm ◽  
Tungsten Electrode ◽  
Micro Electrical Discharge Machining ◽  
Material Erosion ◽  
Erosion Mechanisms ◽  
Set Up

This paper researches the material erosion mechanisms of high silicon- aluminum (Si-Al) alloy in micro electrical discharge machining (Micro-EDM). By using Quanta 200F environment scanning electron microscope, the microstructure of Al-50wt%Si alloy by spray forming was observed. And a simplified model of high Si-Al alloy was set up. The Al-50wt%Si alloy was machined by using copper electrode and tungsten electrode respectively. And the differences of surface morphologies and element energy spectrum were compared. The process and the material erosion mechanisms of high Si-Al alloy in Micro-EDM were analyzed in detail. The results may provide theoretical basis for Micro-EDM of high Si-Al alloy.

The Downsizing Effects in EDM Drilling of Micro Holes

2013 ◽  
Vol 549 ◽  
pp. 503-510 ◽  
Author(s):  
Gianluca D'Urso ◽  
Giancarlo Maccarini ◽  
C. Merla
Keyword(s):  
Electrical Discharge Machining ◽  
Steel Plates ◽  
Drilling Process ◽  
Micro Edm ◽  
Micro Electrical Discharge Machining ◽  
Micro Holes ◽  
Micro Drilling ◽  
Micro Features ◽  
Electron Microscopes ◽  
Manufacturing Technologies

The recent miniaturization trend in manufacturing, has enhanced the production of new and highly sophisticated systems in various industrial fields. In recent years, machining of the so called difficult to cut materials has become an important issue in several sectors. Micro Electrical Discharge Machining (micro-EDM) thanks to its contactless nature, is one of the most important technologies for the machining of this type of materials and it can be considered as one of the most promising manufacturing technologies for the fabrication of micro components. One of the most relevant applications of micro-EDM is micro-drilling. Micro holes in fact, are widely used for example in micro-electromechanical systems (MEMS), serving as channels or nozzles to connect two micro-features, and in micro-mechanical components. The present study is about micro drilling of metal plates by means of micro-EDM technology. In particular, the aim of this work is to investigate the effects of the downsizing of the micro holes diameter on the drilling performances. The influence of the reduction of the diameters in terms of both process performances (e.g., tool wear, taper rate, diametrical overcut) and general quality of the holes was investigated. Steel plates having thickness equal to 0.8 mm were taken into account. The drilling process was carried out using a micro-EDM machine Sarix SX 200 with carbide electrodes having diameter equal to 300, 200, 100 and 50 μm. Since the standard electrodes adopted in this study had a diameter equal to 300 μm, a wire EDM unit was used to obtain the other electrodes. The relationship between the process parameters considered the most significant and the final output, was studied. Furthermore, the geometrical and dimensional properties of the micro-holes were analyzed using both optical and scanning electron microscopes. In particular, it is demonstrated that the diameter size has a significant influence on the final value of the diametrical overcut while peak current and frequency parameters have a negligible effect.

scholarly journals An Experimental Study on Processing TC4 with Nano Particle Surfactant Mixed Micro EDM

Materials ◽  
2021 ◽  
Vol 14 (20) ◽  
pp. 6074
Author(s):  
Tingting Ni ◽  
Qingyu Liu ◽  
Zhiheng Chen ◽  
Dongsheng Jiang ◽  
Shufeng Sun
Keyword(s):  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Open Circuit ◽  
Deionized Water ◽  
Micro Edm ◽  
Nano Particle ◽  
Machining Performance ◽  
Machined Surface ◽  
Micro Electrical Discharge Machining ◽  
Lower Tool

Micro electrical discharge machining (micro EDM) is able to remove conductive material by non-contact instantaneous high temperature, which is more suitable for machining titanium and its alloys compared with traditional machining methods. To further improve the machining efficiency and machined surface quality of micro EDM, the nano particle surfactant mixed micro EDM method is put forward in this paper. Experiments were conducted to explore the effect of nano particle surfactant on the micro EDM performance of titanium alloy. The results show that the material removal rate of micro EDM in dielectric mixed with TiO2 is the highest when open-circuit voltage is 100 V, followed by Al2O3 and ZrO2. Lower tool wear rate can be produced by using dielectric mixed with nano particle surfactant. The taper ratio of micro EDM in dielectric mixed with nano particle surfactant is higher than that in deionized water. The surface roughness Ra of micro EDM in dielectric mixed with TiO2 can be 50% lower than that in deionized water. It is helpful to improve the machining performance by adding surface surfactant in the dielectric of micro EDM.

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