Nucleation and Texture Development during Dynamic Recrystallization of Copper

2005 ◽  
Vol 495-497 ◽  
pp. 1195-1200 ◽  
Author(s):  
D.T. McDonald ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Boundary Migration ◽  
Deformation Texture ◽  
Texture Development ◽  
Polycrystalline Copper ◽  
High Angle ◽  
Resolution Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Dynamic recrystallization and texture development in polycrystalline copper have been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 0.7 within the temperature range 200°C to 600°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization in copper was initiated by the bulging of pre-existing high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM). Increasing misorientations from parent to dynamically recrystallizing grains indicated the occurrence of lattice rotations within the bulges, leading, in some cases to the formation of a HAGB behind the bulge. Discrimination between recrystallized and deformed components in material which had partially undergone dynamic recrystallization was carried out, followed by texture analysis. This revealed most of the recrystallized material to have orientations close to that of the deformed material, however, some remote orientations were observed which could not be related to the deformation texture by twin or 40° <111> relationships.

Microstructure and Texture of Dynamically Recrystallized Copper and Copper – Tin Alloys

2007 ◽  
Vol 550 ◽  
pp. 393-398 ◽  
Author(s):  
D.T. McDonald ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Boundary Migration ◽  
Cube Texture ◽  
Solute Drag ◽  
Deformation Texture ◽  
Tin Alloys ◽  
Resolution Electron ◽  
Recrystallized Grain Size ◽  
Backscatter Diffraction

The microstructure and texture in dynamically recrystallized copper and two copper – tin alloys (2wt% and 4.5wt% tin) has been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 1.22 within the temperature range 200°C to 700°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization was initiated by the bulging of preexisting high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM) and twinning. The addition of tin led to an increase in the temperature at which dynamic recrystallization initiated, and furthermore to a smaller dynamically recrystallized grain size. This was attributed to the effects of solute drag causing lower HAGB mobility. Dynamic recrystallization was observed to weaken the deformation texture components of brass and Goss, as well as introduce a cube texture component which generally tended to strengthen with temperature but weaken with increasing tin additions.

scholarly journals Analysis of Strain Partitioning in Intercritically Deformed Microstructures via Interrupted Tensile Tests

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 112
Author(s):  
Unai Mayo ◽  
Nerea Isasti ◽  
José M. Rodríguez-Ibabe ◽  
Pello Uranga
Keyword(s):  
Electron Backscatter Diffraction ◽  
Tensile Tests ◽  
Correlation Technique ◽  
Strain Partitioning ◽  
High Angle ◽  
Electron Backscatter ◽  
Different Types ◽  
Final Deformation ◽  
Micro Alloyed Steel ◽  
Backscatter Diffraction

Intercritically deformed steels present combinations of different types of ferrite, such as deformed ferrite (DF) and non-deformed ferrite (NDF) grains, which are transformed during the final deformation passes and final cooling step. Recently, a grain identification and correlation technique based on EBSD has been employed together with a discretization methodology, enabling a distinction to be drawn between different ferrite populations (NDF and DF grains). This paper presents a combination of interrupted tensile tests with crystallographic characterization performed by means of Electron Backscatter Diffraction (EBSD), by analyzing the evolution of an intercritically deformed micro-alloyed steel. In addition to this, and using the nanoindentation technique, both ferrite families were characterized micromechanically and the nanohardness was quantified for each population. NDF grains are softer than DF ones, which is related to the presence of a lower fraction of low-angle grain boundaries. The interrupted tensile tests show the different behavior of low- and high-angle grain boundary evolution as well as the strain partitioning in each ferrite family. NDF population accommodates most of the deformation at initial strain intervals, since strain reaches 10%. For higher strains, NDF and DF grains behave similarly to the strain applied.

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