Ultrasonic Welding of Aluminum and Silicon Wafer
2006 ◽
Vol 505-507
◽
pp. 841-846
Keyword(s):
There are several types of welding method to join metal and ceramic. This paper gives a description of an experimental study of the ultrasonic welding of aluminum wire and silicon wafer under the conditions of the frequency of ultrasonic vibration f = 38000Hz, the applied duration T=0.2-1.5 sec, and the welding force Ps =40-140 gf. In this study, vacuum deposition was first applied to deposit surface modification aluminum on silicon wafer, then ultrasonic welding processes were investigated to join aluminum wire and modified silicon wafer. Based on the results of the microstructure observation and tensile test, it is believed that the joining ability can be improved under optimum welding condition.
2022 ◽
pp. 095440892110730
Keyword(s):
2020 ◽
Vol 1527
◽
pp. 012021
2014 ◽
Vol 783-786
◽
pp. 1782-1787
◽
Keyword(s):
2013 ◽
Vol 25
(7)
◽
pp. 1731-1735
2015 ◽
Vol 137
(3)
◽
Keyword(s):