Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System

2010 ◽  
Vol 654-656 ◽  
pp. 1381-1384 ◽  
Author(s):  
Tina Ventura ◽  
Young Hee Cho ◽  
Arne K. Dahle
Keyword(s):  
Binary Alloys ◽  
Alloy System ◽  
Lead Free Solder ◽  
Complex Phase ◽  
Wave Soldering ◽  
Ni Alloys ◽  
Cu Alloy ◽  
Free Solder ◽  
Ni Additions

Pb-free solders based on near-eutectic Sn-0.7Cu-xNi alloys provide excellent solderability during wave soldering with cost advantages compared to Ag-containing alternatives. However, there is only limited knowledge of the solidification mechanisms in this alloy system and, furthermore, the ternary Sn-Cu-Ni phase diagram is not yet fully established. In this study, unidirectional solidification has been conducted in a Bridgman furnace using both binary alloys from the Sn-Cu6Sn5 system and ternary Sn-rich Sn-Cu-Ni alloys. The influence of Ni additions on the solidification mechanisms is assessed by comparing the microstructures of the ternary and binary alloys. The results are used to discuss the contrasting Sn-Cu-Ni phase diagrams reported in the literature. The results demonstrate the complex phase relations in the Sn-Cu alloy system, and the important role of trace amounts of various solute elements.

IMC and creep behavior in Lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method

2014 ◽  
Vol 15 (7) ◽  
pp. 1137-1142 ◽  
Author(s):  
Z. J. Yang ◽  
S. M. Yang ◽  
H. S. Yu ◽  
S. J. Kang ◽  
J. H. Song ◽  
...  
Keyword(s):  
Creep Behavior ◽  
Solder Joints ◽  
Alloy System ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Alloy ◽  
Free Solder

The Role of the Si Network to the Stabilization of Hardening Precipitates in the Al-Mg-Si(-Cu) Alloy System

2012 ◽  
pp. 279-284
Author(s):  
Flemming J. H. Ehlers ◽  
Sigurd Wenner ◽  
Sigmund J. Andersen ◽  
Calin D. Marioara ◽  
R. Holmestad
Keyword(s):  
Alloy System ◽  
Cu Alloy

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

1998 ◽  
Vol 13 (10) ◽  
pp. 2859-2865 ◽  
Author(s):  
Katsuaki Suganuma ◽  
Koichi Niihara ◽  
Takeshi Shoutoku ◽  
Yoshikazu Nakamura
Keyword(s):  
Tensile Strength ◽  
Binary Alloys ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interface Microstructure ◽  
Free Solder ◽  
Rigid Interface ◽  
Liquidus Temperatures

Sn–Zn binary alloys have been examined as a lead-free solder. Zn distributes in a Sn matrix as platelets. The hypoeutectic alloys show two endothermic peaks in DTA, which correspond to the eutectic and the liquidus temperatures. Three reaction layers are formed at the Sn–Zn/Cu interface without containing Sn: the thick γ–Cu5Zn8 adjacent to the solder, the thin β′–CuZn in the middle, and the thinnest layer adjacent to Cu. Although many nonwetting regions and voids are formed at the interface because of poor wetting, soldering at 290 °C can form a rigid interface, and tensile strength reaches about 40 MPa.

The Role of Pb Impurity in SAC Solder Alloy

2013 ◽  
Vol 752 ◽  
pp. 42-47
Author(s):  
Gréta Gergely ◽  
Alíz Molnár ◽  
Zoltán Gácsi
Keyword(s):  
European Union ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Hazardous Substances ◽  
Lead Free ◽  
Lead Free Solder ◽  
The European Union ◽  
Free Solder ◽  
Sac Solder

The European Union and Japan initiated the issue of RoHS, the directive about the restriction of hazardous substances, which prohibits certain hazardous substances in electronic equipment - including lead - application. Due to the directive the use of lead free solder alloys is spreaded, however the Pb in the form of contamination may be appear under technological process. The lead impurity has significant effect on microstrucutre and lifetime so it is necessary to carry out detailed examinations. In this paper the study of intermetallic compounds in six-element, Pb impured, thermal cycles test-subjected, Sn-Ag-Cu (SAC) solder alloy is demonstrated

The Role of the Si Network to the Stabilization of Hardening Precipitates in the Al-Mg-Si(-Cu) Alloy System

2012 ◽  
pp. 279-284
Author(s):  
Fleming J.H. Ehlers ◽  
Sigurd Wenner ◽  
Sigmund J. Anderson ◽  
Calin D. Marioara ◽  
R. Holmestad
Keyword(s):  
Alloy System ◽  
Cu Alloy

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

2016 ◽  
Vol 857 ◽  
pp. 535-539 ◽  
Author(s):  
Syarifah Aminah Ismail ◽  
Noorina Hidayu Jamil ◽  
Kamarudin Hussin ◽  
Mohd Arif Anuar Mohd Salleh
Keyword(s):  
Hydrochloric Acid ◽  
Thermal Treatment ◽  
Optimum Parameter ◽  
Heating Temperature ◽  
Acid Leaching ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wave Soldering ◽  
Hydrochloric Acid Leaching ◽  
Free Solder

The pyrometallurgical method of tin extraction from lead free solder dross after leaching treatment is discussed. The solder dross is sieved into 75 μm was used for the experiment. The samples were leached using 0.3 M HCl, 12 hours stirring times and temperature of 60°C was used for the leaching before thermal treatment. The sample was thermally treated at temperature of 650,850 and 1050°C. The increase of heating temperature causes the lowering of the tin extraction. The optimum parameter for heating temperature is 850°C with 98.71% of tin recovery.

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