The Role of Pb Impurity in SAC Solder Alloy

The European Union and Japan initiated the issue of RoHS, the directive about the restriction of hazardous substances, which prohibits certain hazardous substances in electronic equipment - including lead - application. Due to the directive the use of lead free solder alloys is spreaded, however the Pb in the form of contamination may be appear under technological process. The lead impurity has significant effect on microstrucutre and lifetime so it is necessary to carry out detailed examinations. In this paper the study of intermetallic compounds in six-element, Pb impured, thermal cycles test-subjected, Sn-Ag-Cu (SAC) solder alloy is demonstrated

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Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

10.21203/rs.3.rs-36424/v1 ◽

2020 ◽

Author(s):

Manoj Kumar Pal ◽

Gréta Gergely ◽

Dániel Koncz-Horváth ◽

Zoltán Gácsi

Keyword(s):

Silicon Carbide ◽

Intermetallic Compounds ◽

Solder Alloy ◽

Solder Matrix ◽

Microstructure Analysis ◽

Lead Free ◽

Lead Free Solder ◽

Sac305 Solder ◽

Small Change ◽

Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

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Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

Materials Science Forum ◽

10.4028/www.scientific.net/msf.803.273 ◽

2014 ◽

Vol 803 ◽

pp. 273-277 ◽

Cited By ~ 2

Author(s):

Norhayanti Mohd Nasir ◽

Norainiza Saud ◽

Mohd Nazree Derman ◽

Arif Anuar Mohd Salleh ◽

Mohd Izrul Izwan Ramli ◽

...

Keyword(s):

Titanium Dioxide ◽

Powder Metallurgy ◽

Solder Alloy ◽

Composite Solder ◽

Lead Free ◽

Lead Free Solder ◽

Physical Performances ◽

Free Solder ◽

Sac Solder ◽

Solder Composite

This research has investigated the physical performances of low-silver Sn-Ag-Cu (SAC) lead-free composite solder reinforced with titanium dioxide (TiO2). The SAC/TiO2 composite solder were fabricated via powder metallurgy (PM) technique. The five different composition chosen were 0, 0.25, 0.5, 0.75, and 1.0. The results showed that distribution of TiO2 along the grain boundaries has increased the hardness of the SAC/TiO2 composite solders compared to monolithic SAC solder alloy.

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Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

Materials Science Forum ◽

10.4028/www.scientific.net/msf.928.188 ◽

2018 ◽

Vol 928 ◽

pp. 188-193

Author(s):

Suchart Chantaramanee ◽

Worawit Sriwittayakul ◽

Phairote Sungkhaphaitoon

Keyword(s):

Intermetallic Compounds ◽

Solder Alloy ◽

Interfacial Reaction ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Rich Phase ◽

Pasty Range ◽

Free Solder

The effects of antimony and indium addition on wettability and interfacial reaction of Sn-3.0Ag-0.5Cu lead free solder on copper substrate were investigated. The experimental results showed the melting point of solder alloy containing 0.5 wt.% In and 0.5 wt.% Sb were slightly increased about 3.66°C. The pasty range of solder alloys were increased about 6°C while the undercooling of solder alloys were decreased. The microstructures of solder alloy were contained of In and Sb consists of Ag3Sn, Cu6(Sn,In)5, SnIn, Ag3(Sn,In) and SnSb intermetallic compounds (IMCs) dispersed on Sn-rich phase. The wettability of solder alloys were improved by increasing soldering times. In addition, the thickness of intermetallic compounds (Cu6Sn5) were obviously increased with increasing soldering times.

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Formation and morphology of the intermetallic compounds formed at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2004.08.009 ◽

2005 ◽

Vol 389 (1-2) ◽

pp. 133-139 ◽

Cited By ~ 22

Author(s):

Moo-Chin Wang ◽

Shan-Pu Yu ◽

Tao-Chih Chang ◽

Min-Hsiung Hon

Keyword(s):

Intermetallic Compounds ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

Free Solder

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Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Metals ◽

10.3390/met11071077 ◽

2021 ◽

Vol 11 (7) ◽

pp. 1077

Author(s):

Umair Ali ◽

Hamza Khan ◽

Muhammad Aamir ◽

Khaled Giasin ◽

Numan Habib ◽

...

Keyword(s):

Mechanical Properties ◽

Intermetallic Compounds ◽

Solder Alloy ◽

Thermal Aging ◽

Lead Free ◽

Lead Free Solder ◽

Scanning Calorimetry ◽

X Ray ◽

Lead Free Solder Alloy ◽

Free Solder

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

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