Effect of Rapid Thermal Annealing Condition on the Structure and Conductivity Properties of Polycrystalline Silicon Films on Glass

2011 ◽  
Vol 687 ◽  
pp. 634-640 ◽  
Author(s):  
Wei Yan Wang ◽  
Jin Hua Huang ◽  
Xian Peng Zhang ◽  
Wei Jie Song ◽  
Rui Qin Tan
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Polycrystalline Silicon ◽  
X Ray Diffraction ◽  
Carrier Scattering ◽  
Uv Reflectance ◽  
Amorphous Si ◽  
Si Films ◽  
Polycrystalline Silicon Films ◽  
Reflectance Measurements

The effect of rapid thermal annealing (RTA) temperature (700~1200 °C) and time (1~8 min) on the structure and conductivity properties of polycrystalline silicon (Si) films on glass, grown by RTA crystallization of magnetron sputtering (MS) deposited amorphous Si (a-Si) films, was investigated by means of X-ray diffraction (XRD) and UV reflectance. It was observed the critical temperature for crystallizing a-Si films was ~750 °C and ~700 °C based on XRD and reflectance measurements, respectively. As soon as RTA temperature reached and exceeded the critical value, the structural property of polycrystalline Si films increased with RTA temperature or time. The above results were related to the thermal and photon effects induced by RTA. Moreover, it was revealed that the resistivity of polycrystalline Si films decreased with RTA temperature, however, even the resistivity of the polycrystalline Si films annealed at 1200 °C was 2 orders of magnitude higher than that of Si target, attributed to the carrier scattering by grain boundaries or defects. The polycrystalline Si films on glass fabricated by MS deposition combined with RTA crystallization may endow them with great application potentials in Si thin-film solar cells.

Thin-Film Transistors with Polycrystalline Silicon Films Prepared by Two-Step Rapid Thermal Annealing

2000 ◽  
Vol 39 (Part 2, No. 1A/B) ◽  
pp. L19-L21 ◽  
Author(s):  
Huang-Chung Cheng ◽  
Chun-Yao Huang ◽  
Fang-Shing Wang ◽  
Kuen-Hsien Lin ◽  
Fu-Gow Tarntair
Keyword(s):  
Thin Film ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Thin Film Transistors ◽  
Polycrystalline Silicon ◽  
Silicon Films ◽  
Polycrystalline Silicon Films

Recrystallization of Implanted LPCVD Amorphous Si Films Using Rapid Thermal Annealing

1986 ◽  
Vol 74 ◽  
Author(s):  
R. Kwor ◽  
S. M. Tang ◽  
N. S. Alvi
Keyword(s):  
Electron Microscopy ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Dwell Time ◽  
Hall Effect Measurement ◽  
Temperature Coefficient Of Resistance ◽  
Annealing Conditions ◽  
Transmission Electron ◽  
Amorphous Si ◽  
Si Films

AbstractThe effect of rapid thermal annealing on the crystallization of arsenic and boron implanted amorphous silicon films is studied. Amorphous Si films of 4000 Å were deposited using LPCVD and implanted with arsenic or boron to doses of 5 × 1013, 5 × 1014, and 5 × 1015 cm−2. These films were then annealed using an Eaton Nova-400 RTA system (with temperature ranging from 900 to 1200 °C and dwell time ranging from 1 to 30 sec). The annealed films were studied using transmission electron microscopy, Hall effect measurement and temperature coefficient of resistance measurement. The optimal annealing conditions for the films were found.

The Two-Step Rapid Thermal Annealing Effect of the Prepatterned A-SI Films

1998 ◽  
Vol 525 ◽  
Author(s):  
Kee-Chan Park ◽  
Kwon-Young Choi ◽  
Min-Cheol Lee ◽  
Min-Koo Han ◽  
Chan-Eui Yoon
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Glass Substrate ◽  
Polycrystalline Silicon ◽  
Chemical Vapor ◽  
Heat Propagation ◽  
Halogen Lamp ◽  
Si Films ◽  
Hydrogenated Amorphous ◽  
Temperature Crystallization

ABSTRACTHydrogenated amorphous silicon (a-Si:H) films which were deposited by plasma enhanced chemical vapor deposition (PECVD) have been recrystallized by the two-step rapid thermal annealing (RTA) employing the halogen lamp. The a-Si:H films evolve hydrogen explosively during the high temperature crystallization step. In result, the recrystallized polycrystalline silicon (poly-Si) films have poor surface morphology. In order to avoid the hydrogen evolution, the films have undergone the dehydrogenation step prior to the crystallization step.Before the RTA process, the active area of thin film transistors (TFT's) was patterned. The prepatterning of the a-Si:H active islands may reduce the thermal damage to the glass substrate during the recrystallization. The computer generated simulation shows the heat propagation from the a-Si:H islands into the glass substrate. We have fabricated the poly-Si TFT's on silicon wafers. The maximum ON/OFF current ratio of the devices was over 10.

Polycrystalline silicon films fabricated by rapid thermal annealing

2012 ◽  
Vol 23 (7) ◽  
pp. 1279-1283 ◽  
Author(s):  
Lei Zhang ◽  
Honglie Shen ◽  
Jiayi You ◽  
Feng Jiang ◽  
Tianru Wu ◽  
...  
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Polycrystalline Silicon ◽  
Silicon Films ◽  
Polycrystalline Silicon Films

In-Situ x-Ray Diffraction Analysis of TiSi2 Phase Formation from a Titanium-Molybdenum Bilayer

1996 ◽  
Vol 441 ◽  
Author(s):  
C. Cabral ◽  
L. A. Clevenger ◽  
J. M. E. Harper ◽  
R. A. Roy ◽  
K. L. Saenger ◽  
...  
Keyword(s):  
Diffraction Analysis ◽  
Thermal Annealing ◽  
Phase Formation ◽  
Rapid Thermal Annealing ◽  
Polycrystalline Silicon ◽  
Silicon Substrates ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
X Ray

AbstractWe demonstrate that the addition of a molybdenum interlayer between titanium and silicon enhances the formation of C54 TiSi2, without bypassing the formation of the C49 TiSi2 phase. In situ x-ray diffraction analysis during rapid thermal annealing, at a rate of 3 °C/s, was used to study the phase formation sequence of TiSi2 starting from a blanket bilayer of Ti on Mo on a polycrystalline Si substrate. It was shown, as in the case without the Mo layer, that the C49 TiSi2 phase forms first, followed by the C54 TiSi2 phase. The results were similar for undoped or arsenic, boron, and phosphorous doped polycrystalline silicon substrates. The temperature range over which the C49 phase is stable is reduced, on average, by 80 °C. The lower end of the range (appearance of C49) is increased by approximately 60 °C and the upper end of the range (disappearance of C49) is decreased by about 20 0C. The orientation of the C49 phase differs in that both the C49(131) and C49(060) orientations are observed, compared to the case without the Mo layer where only the C49(131) orientation is observed.

Polycrystalline silicon films prepared by improved pulsed rapid thermal annealing

2000 ◽  
Vol 62 (1-2) ◽  
pp. 143-148 ◽  
Author(s):  
Yuwen Zhao ◽  
Wenjing Wang ◽  
Feng Yun ◽  
Ying Xu ◽  
Xianbo Liao ◽  
...  
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Polycrystalline Silicon ◽  
Silicon Films ◽  
Polycrystalline Silicon Films
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