Dynamic Recrystallization of Biomedical Co-Cr-W-Ni (L-605) Alloy

2012 ◽  
Vol 706-709 ◽  
pp. 472-477 ◽  
Author(s):  
Julien Favre ◽  
Akihiko Chiba ◽  
Yuichiro Koizumi ◽  
Damien Fabrègue ◽  
Éric Maire
Keyword(s):  
High Temperature ◽  
Dynamic Recrystallization ◽  
High Strain Rate ◽  
Strain Rate ◽  
Grain Boundaries ◽  
High Strain ◽  
Nucleation Mechanism ◽  
Compression Tests ◽  
Annealing Twins ◽  
Low Strain Rate

Compression tests are carried out at high-temperature on Thermec-master Z, followed by gas quench. Microstructures after deformation are evaluated using SEM-EBSD. Significant grain refinement occurs by dynamic recrystallization for high temperature and low strain rate (T>1100°C, SR<0.1s-1), and at high strain rate (SR~10s-1). Dynamic recrystallization is discontinuous and takes place from the grain boundaries, leading to a necklace structure. The nucleation mechanism is most likely to be bulging of grain boundaries. However, recrystallization occurs also by rotation of annealing twins. Thereafter the twin boundaries can bulge as well. The modeling of mechanical behavior gives a fair quantification of flow softening due to dynamic recrystallization indicating the progress of dynamic recrystallization with deformation.

scholarly journals Dynamic Recrystallization During High-Strain-Rate Tension of Copper

2016 ◽  
Vol 47 (6) ◽  
pp. 2555-2559 ◽  
Author(s):  
Nooshin Mortazavi ◽  
Nicola Bonora ◽  
Andrew Ruggiero ◽  
Magnus Hörnqvist Colliander
Keyword(s):  
Dynamic Recrystallization ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

2018 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Thermal Aging ◽  
High Strain ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Aging Effects ◽  
Model Predictions

Electronics in automotive underhood and downhole drilling applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. SAC solders used for second level interconnects have been shown to experience degradation in high strain-rate mechanical properties under sustained exposure to high temperatures. Industry search for solutions for resisting the high-temperature degradation of SAC solders has focused on the addition of dopants to the alloy. In this study, a doped SAC solder called SAC-Q solder have been studied. The high strain rate mechanical properties of SAC-Q solder have been studied under elevated temperatures up to 200°C. Samples with thermal aging at 50°C for up to 6-months have been used for measurements in uniaxial tensile tests. Measurements for SAC-Q have been compared to SAC105 and SAC305 for identical test conditions and sample geometry. Data from the SAC-Q measurements has been fit to the Anand Viscoplasticity model. In order to assess the predictive power of the model, the computed Anand parameters have been used to simulate the uniaxial tensile test and the model predictions compared with experimental data. Model predictions show good correlation with experimental measurements. The presented approach extends the Anand Model to include thermal aging effects.

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