High dI/dt Pulse Switching of 1.0 cm2 SiC GTOs

2012 ◽  
Vol 717-720 ◽  
pp. 1155-1158 ◽  
Author(s):  
Heather O'Brien ◽  
William Shaheen ◽  
Aderinto Ogunniyi ◽  
Charles Scozzie ◽  
Q. Jon Zhang ◽  
...  

The Army Research Laboratory has collaborated with Cree, Inc. and Silicon Power Corp. to develop 9 kV-blocking, 1.0 cm2Super-GTOs. In this study, several 1.0 cm2GTOs were individually switched up to 6.0 kA in a low-inductance, highdI/dt(2.1 kA/µs) circuit to evaluate turn-on delay and optimize the gate control. Turn-on delay was evaluated relative to gate drive current, and the delay was reduced by 1.1 µs when gate amplitude was increased from 1 A to 8 A. Increasing gate current delivered to each GTO also successfully reduced variation in turn-on delay from device to device by at least 50%, and mitigated mismatch in turn-on between pairs of GTOs switched in parallel. As silicon carbide material processing and device development continue to evolve, the ultimate solution will be to reduce remaining material defects and to control minority carrier diffusion length through more uniform doping across the wafer. These steps will enable modules of parallel GTOs to perform at maximum capability.

Author(s):  
D.P. Malta ◽  
M.L. Timmons

Measurement of the minority carrier diffusion length (L) can be performed by measurement of the rate of decay of excess minority carriers with the distance (x) of an electron beam excitation source from a p-n junction or Schottky barrier junction perpendicular to the surface in an SEM. In an ideal case, the decay is exponential according to the equation, I = Ioexp(−x/L), where I is the current measured at x and Io is the maximum current measured at x=0. L can be obtained from the slope of the straight line when plotted on a semi-logarithmic scale. In reality, carriers recombine not only in the bulk but at the surface as well. The result is a non-exponential decay or a sublinear semi-logarithmic plot. The effective diffusion length (Leff) measured is shorter than the actual value. Some improvement in accuracy can be obtained by increasing the beam-energy, thereby increasing the penetration depth and reducing the percentage of carriers reaching the surface. For materials known to have a high surface recombination velocity s (cm/sec) such as GaAs and its alloys, increasing the beam energy is insufficient. Furthermore, one may find an upper limit on beam energy as the diameter of the signal generation volume approaches the device dimensions.


2015 ◽  
Vol 23 (4) ◽  
Author(s):  
T. Piotrowski ◽  
M. Węgrzecki ◽  
M. Stolarski ◽  
T. Krajewski

AbstractOne of the key parameters determining detection properties of silicon PIN detector structures (pThe paper presents a method for measuring the spatial distribution of effective carrier diffusion length in silicon detector structures, based on the measurement of photoelectric current of a non-polarised structure illuminated (spot diameter of 250 μm) with monochromatic radiation of two wavelengths λ


2018 ◽  
Vol 24 (S1) ◽  
pp. 1842-1843
Author(s):  
Zoey Warecki ◽  
Vladimir Oleshko ◽  
Kimberlee Celio ◽  
Andrew Armstrong ◽  
Andrew Allerman ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document