Improved Electrical Properties of 4H-SiC MOS Devices with High Temperature Thermal Oxidation
Keyword(s):
We reported that high oxidation temperature is attributed to break Si-C bond and release nitrogen gas to nitrogen ions over 1350°C. The capacitance-voltage characteristics of SiO2/4H-SiC (0001) MOS capacitors fabricated under different thermal oxidation conditions are compared. The dependence of oxidation temperature on device characteristics (such as VFB and ΔVFB) is also analyzed. After a high temperature oxidation, the device reliability of SiC MOS is improved. Such behavior can be attributed to the reduction of the interface traps during high temperature oxidation.
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