The Regularities of Copper-Aluminum System Polymetallic Samples Manufacturing by the Additive Electron-Beam Technology

2020 ◽  
Vol 992 ◽  
pp. 517-522
Author(s):  
K.N. Kalashnikov ◽  
Kseniya S. Osipovich ◽  
T.A. Kalashnikova
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Defect Formation ◽  
Boundary Zone ◽  
Copper Aluminum ◽  
Printing Parameters ◽  
Amg5 Aluminum Alloy ◽  
Scanning Electron

The structure and composition of polymetallic materials samples obtained by electron-beam manufacturing from AMg5 aluminum alloy and M1 grade copper were investigated by optical and scanning electron microscopy. Mechanisms of defect formation in the structure of samples at different 3D printing parameters are determined. The features of gradient structures formation in the boundary zone at successive deposition of aluminum alloy and copper layers are investigated.

High Resolution Scanning Electron Microscopy

1991 ◽  
Vol 49 ◽  
pp. 478-479
Author(s):  
David Joy ◽  
James Pawley
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Electron Probe ◽  
Impact Point ◽  
Interaction Volume ◽  
Scanning Electron

The scanning electron microscope (SEM) builds up an image by sampling contiguous sub-volumes near the surface of the specimen. A fine electron beam selectively excites each sub-volume and then the intensity of some resulting signal is measured. The spatial resolution of images made using such a process is limited by at least three factors. Two of these determine the size of the interaction volume: the size of the electron probe and the extent to which detectable signal is excited from locations remote from the beam impact point. A third limitation emerges from the fact that the probing beam is composed of a finite number of discrete particles and therefore that the accuracy with which any detectable signal can be measured is limited by Poisson statistics applied to this number (or to the number of events actually detected if this is smaller).

Investigation of Die Tilting of Packages with Single and Multi-chips

2018 ◽  
Author(s):  
Lo Chea Wee ◽  
Tan Sze Yee ◽  
Gan Sue Yin ◽  
Goh Cin Sheng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Optical Microscopy ◽  
Device Performance ◽  
Electronic Components ◽  
Area Of Interest ◽  
On Chip ◽  
Scanning Electron

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.

Preparation and Characterisation of TiO2 Thick Films Fabricated by Electrophoretic Deposition

2007 ◽  
Vol 561-565 ◽  
pp. 2163-2166 ◽  
Author(s):  
H.Z. Abdullah ◽  
Charles C. Sorrell
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Grain Growth ◽  
Electrophoretic Deposition ◽  
Defect Formation ◽  
Titanium Foil ◽  
X Ray Diffraction ◽  
Voltage Range ◽  
X Ray ◽  
Scanning Electron

Rutile nano-powders were suspended in a solution of acetylacetone and iodine. The suspensions were electrophoretically deposited on titanium foil at a voltage range of 5-30 V over times of 5-120 s. The dried tapes then were sintered at 800°C for 2 h in flowing argon. Both the green and fired tapes were examined by field emission scanning electron microscopy, optical microscopy, X-ray diffraction, and Raman microspectroscopy. The thickness of the films depended on the voltage and the time of deposition. The sintered microstructures depended significantly on the thickness of the film, which was a function the proximity to the Ti/TiO2 interface. The interface is critical to the microstructure because it acts as the source of defect formation, which enhances sintering, grain growth, and grain facetting.

Effects of Homogenization-Free on the Microstructures of an Al-Mg-Si-Cu Hot-Rolled Plate for Automotive Pannel

2018 ◽  
Vol 941 ◽  
pp. 1529-1534
Author(s):  
Ni Tian ◽  
Qi Long Liu ◽  
Zi Yan Zhao ◽  
Gang Zhao ◽  
Kun Liu
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Alloy ◽  
Rolling Direction ◽  
Rolled Plate ◽  
Alloy Plate ◽  
Solution Treated ◽  
Aluminum Alloy Plate ◽  
Hot Rolled ◽  
Scanning Electron

The microstructure of Al-1.01Mg-1.11Si-0.38Cu-0.69Mn aluminum alloy plate hot-rolled from homogenization and homogenization-free ingots were investigated by optical microscopy and scanning electron microscopy assisted with energy dispersive spectroscopy (SEM/EDS). The results showed that there are 3 main kinds of constituents such as Mg2Si, AlCuMgSi and AlFeMnSi in the as-cast Al-1.01Mg-1.11Si-0.38Cu-0.69Mn aluminum alloy ingot. After homogenization treated at 545°C for 24h, the black Mg2Si and the white bright AlCuMgSi particles in the ingot dissolved into matrix, but the grey AlFeMnSi phase partly dissolved, contracted into sphere and become coarse, many ultrafine dispersoids appear in the dendritic arms. The constituents in the plates hot-rolled from the homogenization and homogenization-free ingots are both distributed as broken chains along the rolling direction. However, compared with the particles configuration in the plate that hot-rolled from homogenization ingot, the particles in the plate that hot-rolled from the homogenization-free ingot are finer, more numerous and more homogenous, and with insufficient recrystallization when the plates are solution treated at 545°C for 2 h and then water quenched.

Process Study on Prepared Al2O3-TiB2 Composite Coating by Reactive Spray

2012 ◽  
Vol 472-475 ◽  
pp. 309-312
Author(s):  
Xiao Ping Zhou ◽  
Ming Li ◽  
Xin Zhou
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Alloy ◽  
Composite Coating ◽  
Milled Powder ◽  
X Ray ◽  
Phase Constituent ◽  
Process Study ◽  
High Microhardness ◽  
Scanning Electron

The microstructures and properties of Al2O3-TiB2 composite coating on the surface of the aluminum alloy by reactive spraying was studied. The influences of mechanical alloying and spraying temperature on the phase constituent and microstructure of the composite were analyzed by X-ray diffractometry(XRD) and scanning electron microscopy(SEM). The results indicate that Al2O3-TiB2 composite coating is obtained by plasma spraying using milled powder of Al，TiO2，B2O and B2O3. The coating possesses high microhardness of 1300 HV0.1.

Microstructure Analysis of Electron-Beam Brazed γ-Titanium Aluminide

2011 ◽  
Vol 690 ◽  
pp. 153-156
Author(s):  
Uwe Reisgen ◽  
Simon Olschok ◽  
Alexander Backhaus
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Titanium Aluminide ◽  
Titanium Aluminides ◽  
Microstructure Analysis ◽  
Energy Dispersive ◽  
X Ray ◽  
Scanning Electron

This paper gives an account of research which has been carried out on electron-beam brazed specimens made of high-Niobium γ-titanium aluminides. The microstructure in the brazing area of two different brazes (TiCuNi and Ni 102) is explained and analysed via scanning electron microscopy and energy dispersive X-ray spectroscopy.

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