Molecular Dynamics Simulation of Nanocrystalline Tantalum under Uniaxial Tension

2008 ◽  
Vol 139 ◽  
pp. 83-88 ◽  
Author(s):  
Zhi Liang Pan ◽  
Yu Long Li ◽  
Qiu Ming Wei

Using molecular dynamics (MD) simulation, we have investigated the mechanical properties and the microstructural evolution of nanocrystalline tantalum (NC-Ta, grain size from 3.25 nm to ~13.0 nm) under uniaxial tension. The results show the flow stress at a given offset strain decreases as the grain size is decreased within the grain size regime studied, implying an inverse Hall-Petch effect. A strain rate sensitivity of ~0.14, more than triple that of coarse-grain Ta, is derived from the simulation results. Twinning is regarded to be a secondary deformation mechanism based on the simulations. Similar to nanocrystalline iron, stress-induced phase transitions from body-centered cubic (BCC) to face-centered cubic (FCC) and hexagonal close-packed (HCP) structures take place locally during the deformation process, The maximum fraction of FCC atoms varies linearly with the tensile strength. We can thus conclude that a critical stress exists for the phase transition to occur. It is also observed that the higher the imposed strain rate, the further delayed is the phase transition. Such phase transitions are found to occur only at relatively low simulation temperatures, and are reversible with respect to stress.

2008 ◽  
Vol 32 ◽  
pp. 255-258
Author(s):  
Bohayra Mortazavi ◽  
Akbar Afaghi Khatibi

Molecular Dynamics (MD) are now having orthodox means for simulation of matter in nano-scale. It can be regarded as an accurate alternative for experimental work in nano-science. In this paper, Molecular Dynamics simulation of uniaxial tension of some face centered cubic (FCC) metals (namely Au, Ag, Cu and Ni) at nano-level have been carried out. Sutton-Chen potential functions and velocity Verlet formulation of Noise-Hoover dynamic as well as periodic boundary conditions were applied. MD simulations at different loading rates and temperatures were conducted, and it was concluded that by increasing the temperature, maximum engineering stress decreases while engineering strain at failure is increasing. On the other hand, by increasing the loading rate both maximum engineering stress and strain at failure are increasing.


2021 ◽  
Vol 11 (11) ◽  
pp. 1841-1855
Author(s):  
Alexandre Melhorance Barboza ◽  
Ivan Napoleão Bastos ◽  
Luis César Rodríguez Aliaga

The grain size refinement of metallic materials to the nanometer scale produces interesting properties compared to the coarse-grained counterparts. Their mechanical behavior, however, cannot be explained by the classical deformation mechanisms. Using molecular dynamics simulations, the present work examines the influence of grain size on the deformation mechanisms and mechanical properties of nanocrystalline nickel. Samples with grain sizes from 3.2 to 24.1 nm were created using the Voronoi tessellation method and simulated in tensile and relaxation tests. The yield and ultimate tensile stresses follow an inverse Hall-Petch relationship for grain sizes below ca. 20 nm. For samples within the conventional Hall-Petch regime, no perfect dislocations were observed. Nonetheless, a few extended dislocations were nucleated from triple junctions, suggesting that the suppression of conventional slip mechanism is not uniquely responsible for the inverse Hall-Petch behavior. For samples respecting the inverse Hall-Petch regime, the high number of triple junctions and grain boundaries allowed grain rotation, grain boundary sliding, and diffusion-like behavior that act as competitive deformation mechanisms. For all samples, the atomic configuration analysis showed that Shockley partial dislocations are nucleated at grain boundaries, crossing the grain before being absorbed in opposite grain boundaries, leaving behind stacking faults. Interestingly, the stress relaxation tests showed that the strain rate sensitivity decreases with grain size for a specific grain size range, whereas for grains below approximately 10 nm, the strain rate sensitivity increases as observed experimentally. Repeated stress relaxation tests were also performed to obtain the effective activation volume parameter. However, the expected linear trend in pertinent plots required to obtain this parameter was not found.


Crystals ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 855
Author(s):  
Ting Ruan ◽  
Binjun Wang ◽  
Chun Xu ◽  
Yunqiang Jiang

In a previous study, it was shown that the (111)fcc, (110)fcc and (111)bcc free surfaces do not assist the phase transitions as nucleation sites upon heating/cooling in iron (Fe) thin slabs. In the present work, the three surfaces are denoted as “inactive” free surfaces. The phase transitions in Fe thin films with these “inactive” free surfaces have been studied using a classical molecular dynamics simulation and the Meyer–Entel potential. Our results show that shear deformation helps to activate the free surface as nucleation sites. The transition mechanisms are different in dependence on the surface orientation. In film with the (111)fcc free surface, two body-centered cubic (bcc) phases with different crystalline orientations nucleate at the free surface. In film with the (110)fcc surface, the nucleation sites are the intersections between the surfaces and stacking faults. In film with the (111)bcc surface, both heterogeneous nucleation at the free surface and homogeneous nucleation in the bulk material are observed. In addition, the transition pathways are analyzed. In all cases studied, the unstrained system is stable and no phase transition takes place. This work may be helpful to understand the mechanism of phase transition in nanoscale systems under external deformation.


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