Ge and GeSn Light Emitters on Si

2015 ◽  
Vol 242 ◽  
pp. 353-360
Author(s):  
Michael Oehme ◽  
Martin Gollhofer ◽  
Konrad Kostecki ◽  
Roman Koerner ◽  
Stefan Bechler ◽  
...  

The heteroepitaxial growth of GeSn and Ge crystals on Si substrates are investigated for Si-based photonic applications. Light Emitting Diodes with emission wavelengths from 2,100 to 1,550 nm could be demonstrated with active intrinsic GeSn light emitting layers between Ge barriers. A clear shift of the direct band gap toward the infrared beyond 2 μm is measured. Emission intensity is increased compared to Ge Light Emitting Diodes. Room temperature lasing from electrically pumped n-type doped Ge edge emitting devices are demonstrated. The edge emitter is formed by cleaving Si-Ge waveguide heterodiodes, providing optical feedback through a Fabry-Pérot resonator. The electroluminescence spectra of the devices showed optical bleaching and intensity gain for wavelengths between 1,660 nm and 1,700 nm.

2017 ◽  
Vol 56 (3) ◽  
pp. 032102 ◽  
Author(s):  
Kazuki Tani ◽  
Shin-ichi Saito ◽  
Katsuya Oda ◽  
Makoto Miura ◽  
Yuki Wakayama ◽  
...  

Author(s):  
Yen-Yu Chen ◽  
Chia-Chun Yen ◽  
Yi-Hsin Nien ◽  
Wen-Wei Hsu ◽  
Qing-Qi Chen ◽  
...  

1998 ◽  
Vol 4 (S2) ◽  
pp. 668-669
Author(s):  
R.-J. Liu ◽  
L. L. Smith ◽  
M. J. Kim ◽  
R. W. Carpenter ◽  
R. F. Davis

GaN is a semiconductor with a direct band-gap of 3.4 eV which has a potential application in optoelectronic devices such as UV-emitting lasers and blue light emitting diodes. Extensive efforts have been made to develop low-resistance, thermally stable and uniform ohmic contacts on GaN. In this study, n-GaN films (Si-doped) with an intermediate A1N buffer layer were grown on 6H-SiC substrates via MOVPE. The contacts were formed by depositing Ti and then Au films on GaN by e-beam evaporation at room temperature. Current-voltage measurements as a function of temperature showed that the ohmicity of the Au/Ti contact improved upon annealing, corresponding to changes in the microstructure of the contact interfaces involving a redistribution of nitrogen and gold.Fig. 1 shows the microstructure of the as-deposited Au/Ti/GaN films. The nanocrystalline Ti film was about 50 nm thick. Au film was polycrystalline, containing many growth twins. The thickness of Au film varied from 260 to 350 nm.


2013 ◽  
Vol 50 (9) ◽  
pp. 305-308 ◽  
Author(s):  
P. Velha ◽  
K. F. Gallacher ◽  
D. C. Dumas ◽  
D. J. Paul ◽  
M. Myronov ◽  
...  

2009 ◽  
Vol 17 (16) ◽  
pp. 13365 ◽  
Author(s):  
Martin Blazek ◽  
Wolfgang Elsäßer ◽  
Mark Hopkinson ◽  
Patrick Resneau ◽  
Michel Krakowski ◽  
...  

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