High Temperature Potting Materials for Wire Bond Encapsulation
2016 ◽
Vol 2016
(HiTEC)
◽
pp. 000061-000065
Keyword(s):
Abstract Test results for a range of potting materials for encapsulation of wire bonds for a high temperature multi-chip module is presented. The potting materials include gels and more rigid epoxies, silicone, and silicone-ceramic materials. The materials were initially screened based on ease of processing, cracking, and weight loss at 200, 225, and 250°C. Materials that performed well after this initial screening were tested for insulation resistance at 200, 225, and 250°C and wire bonds were encapsulated for thermal cycled at −55 to 200°C and −55 to 250°C.
Keyword(s):
2014 ◽
Vol 11
(4)
◽
pp. 146-157
◽
Keyword(s):
2021 ◽
pp. 107754
2001 ◽
Vol 357-360
◽
pp. 1241-1244
◽
2012 ◽
Vol 52
(9-10)
◽
pp. 1966-1970
◽
Keyword(s):
1983 ◽
Vol 105
(2)
◽
pp. 348-353
◽
Characteristics of Phenomena in Powders Type RE2Zr2O7-Al2O3 in High Temperature Annealing Conditions
2011 ◽
Vol 312-315
◽
pp. 583-588
◽
2015 ◽
Vol 830-831
◽
pp. 191-194
Keyword(s):