Wire Bonding Advances for Multi-Chip and System in Package Devices

2018 ◽  
Vol 2018 (1) ◽  
pp. 000583-000588 ◽  
Author(s):  
Hui Xu ◽  
Aashish Shah ◽  
Basil Milton ◽  
Ivy Qin

Abstract Wire bonding continues to be the most commonly used interconnection technology due to its low cost, high yield rate, increased flexibility and improved reliability. Among wire bonded packages, the high growth areas include Multi-Chip modules and System in Package (SiP) applications. A type of wire bonding, Stand-Off-Stitch Bond (SSB), is widely used in Multi-chip, die-to-die, SiP and light-emitting diodes (LEDs). The SSB process starts with a flat-topped bump bonding on the substrate or die, followed by the formation of a new ball bond (1st bond). The stitch bond (2nd bond) of that wire is bonded on top of the initial bump. This paper focuses on key SSB process steps, by examining the main challenges and solutions of SSB applications. We demonstrate ultra-fine pitch SSB process capability with 0.6 mil Au wire using newly developed response-based processes for sub-20 nm node wafer technology.

2012 ◽  
Vol 65 (9) ◽  
pp. 1244 ◽  
Author(s):  
Prashant Sonar ◽  
Sonsoles Garcia Santamaria ◽  
Ting Ting Lin ◽  
Alan Sellinger ◽  
Henk Bolink

The synthesis and characterisation of 2,5-bis(5′-hexyl-[2,2′-bithiophen]-5-yl)pyridine (Th4PY) and its use as a blue emitter in organic light emitting diodes (OLEDs) is reported. Th4PY was synthesised in high yield using a straightforward Suzuki coupling route with commercially available starting materials. As Th4PY is both soluble and has low molecular weight, blue OLEDs were fabricated using both spin-coating and vacuum deposition thin film processing techniques to study the effect of processing on device performance. OLED devices using a spin-coated layer consisting of 4′,4′′-tris(N-carbazolyl)triphenylamine (TCTA) and 2-(4-biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (PBD) as a host matrix together with Th4PY as emitter exhibited highly efficient sky-blue emission with a low turn-on voltage of 3 V, a maximum brightness close to 15000 cd m–2 at 8 V, and a maximum luminous efficiency of 7.4 cd A–1 (6.3 lm W–1) with CIE coordinates of x = 0.212, y = 0.320. The device performance characteristics are compared using various matrices and processing techniques. The promising sky-blue OLED performance, solution processability, and ambient stability make Th4PY a promising blue emitter for application in OLEDs.


Author(s):  
Ting Zhang ◽  
Lin Wang ◽  
Lingmei Kong ◽  
Chengxi Zhang ◽  
Haiyong He ◽  
...  

Metal halide perovskite light-emitting diodes (PeLEDs) have aroused extensive attention due to their high color purity, wide color gamut, low-cost solution processability, showing great potential for application in next-generation high-definition...


Author(s):  
Jianfeng Zhang ◽  
Bin Wei ◽  
Lin Wang ◽  
Xuyong Yang

Metal halide perovskite light-emitting diodes (PeLEDs) have emerged as one of the most promising candidates for next-generation high-resolution displays, due to their wide color gamut, high color purity and low-cost...


2020 ◽  
Vol 2020 ◽  
pp. 1-7
Author(s):  
Wei Wan ◽  
Zhanxu Chen ◽  
Yongzhu Chen ◽  
Gengyan Chen

The optical output of near-ultraviolet (NUV) light-emitting diodes (LEDs) was improved by including a monolayer of hexagonal close-packed polystyrene (PS) nanospheres. PS nanospheres with different sizes were deposited on the indium tin oxide layer of the NUV LEDs. The electroluminescence results showed that the light extraction efficiency of the NUV LEDs was increased by the inclusion of PS nanospheres, and the maximum optical output enhancement was obtained when the size of the nanospheres was close to the light wavelength. The largest enhancement of the optical output of 1.27-fold was obtained at an injection current of 100 mA. The enhanced optical output was attributed to part of the incident light beyond the critical angle being extracted when the exit surface of the NUV LEDs had a PS nanosphere monolayer. This method may serve as a low-cost and effective approach to raise the efficiency of NUV LEDs.


2019 ◽  
Vol 30 (11) ◽  
pp. 1969-1973 ◽  
Author(s):  
Bing Yang ◽  
Jianfeng Zhao ◽  
Zepeng Wang ◽  
Zhenlin Yang ◽  
Zongqiong Lin ◽  
...  

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