3D-CERAMIC INTERCONNECTION DEVICES

2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000306-000311
Author(s):  
Pascal METAYER
Keyword(s):  
Low Cost ◽  
High Volume ◽  
High Dimensional ◽  
Assembly Process ◽  
Laser Structuring ◽  
High Volume Production ◽  
Volume Production ◽  
Materials Used ◽  
Simple Assembly ◽  
Design Freedom

Electronic packaging can benefit from 3D interconnect devices that combine mechanical and electrical functions on a single 3D-shape part. Design freedom, miniaturisation, simple assembly process, low cost and reliability are some of the advantages that stimulate innovation or replacement of existing products. This monolithic concept was developed for high volume production with moulded thermoplastics as materials used for circuit carriers. Ceramic counterparts have been implemented so far to a smaller extent although their thermal, mechanical and dielectric make them suitable for applications requiring high dimensional stability. This article presents the use of ceramics for 3D-interconnect devices. Ceramics properties will be highlighted with some existing applications. Fabrication processes will be overviewed with emphasis on laser structuring.

EFFECT OF PET PARISON SIZE ON INJECTION MOULDING MOULD DESIGN

2015 ◽  
Vol 76 (6) ◽  
Author(s):  
Najiy Rizal Suriani Rizal ◽  
Aidah Jumahat ◽  
Ummu Raihanah Hashim ◽  
Mohd Sobri Omar
Keyword(s):  
Injection Moulding ◽  
Low Cost ◽  
High Volume ◽  
Manufacturing Processes ◽  
Light Weight ◽  
Thermoplastic Material ◽  
High Volume Production ◽  
Volume Production ◽  
Mould Design ◽  
Main Component

Injection molding is one of the most popular manufacturing processes for producing good finishing plastic products with low cost and high volume production, especially for the production of plastic bottles. In order to produce high quality plastic bottle with specific size, the injection moulding mould need to be properly designed. This study is aimed to design injection moulding mould for producing three different sizes of Polyethylene Terephthalate (PET) parison. The actual dimensions of a commercial bottle preform of parisan of 25g weight were measured. PET was used as thermoplastic material because it has good strength and light weight properties. The designing process involved two primary components; (1) Female section consists of cavity plate as the main component and (2) male section consists of core plate as the main component. The effect of parisan size on the mould design was evaluated. Three different designs of female and male sections were constructed using CATIA software based on 15g, 20g and 30g parisan weight. The designs were also compared to the existing mould system of 25g PET parisan. It was shown that the design of insert cavity of female section and core cavity of male section were highly influenced by the size of the preform.

scholarly journals Economics and Design Approaches for Small Commercial Turbogenerators

1997 ◽  
Author(s):  
Phillip F. Myers
Keyword(s):  
Material Selection ◽  
Low Cost ◽  
High Volume ◽  
Integrated Approach ◽  
Organizational Setting ◽  
Successful Development ◽  
Aerospace Applications ◽  
High Volume Production ◽  
Volume Production ◽  
Almost All

The successful development of small commercial turbogenerators for automotive and other applications presents a major economic challenge. Current aerospace turbogenerators in the 60 kilowatt power range sell for around $500 per kilowatt. Volume automotive turbogenerators prices must be $30 per kilowatt, or less — a 94% reduction. Turbogenerators for aerospace applications have drastically different requirements on almost all important criteria from automotive turbogenerators. The production of commercial turbogenerators requires a radically different organizational setting, mindset, and overhead structure from that necessary for the aerospace industry. Ground up designs which take an integrated approach to material selection, method of operation, fabrication techniques, supplier base, assembly methods, and low cost overheads will be necessary for commercial success. Significant innovation and simplification, and the natural effects of high volume production are also required. Success will likely require lean, agile, innovative, and specialized organizations.

Printable Electronics: Patterning of Conductive Materials for Novel Applications

2004 ◽  
Vol 828 ◽  
Author(s):  
Anupama Karwa ◽  
Yu Xia ◽  
Daniel M. Clark ◽  
Thomas W. Smith ◽  
Bruce E. Kahn
Keyword(s):  
Materials Science ◽  
Low Cost ◽  
High Volume ◽  
Production Volume ◽  
Wearable Electronics ◽  
Conductive Materials ◽  
High Volume Production ◽  
Volume Production ◽  
Novel Applications ◽  
Printing Processes

ABSTRACTThe convergence of materials science, printing, and electronics promises to offer low cost and high volume production of devices such as transistors, RFID tags, wearable electronics and other novel applications. Although a number of “soft lithographic” techniques have been used to make these devices, they are slow and have a limited production volume [5], [14-15].Here high volume printing processes like rotary letterpress, flexography and offset lithography have been investigated for patterning conductive materials [1]. The synthesis and development of conducting inks using electrically functional polymers has been studied. The feasibility of using such inks in high volume printing processes has been studied. An attempt has been made to print conductive interdigitated electrodes using these inks to obtain uniform coating properties and appropriate electrical characteristics. Various process parameters like type of substrate, inking time and speed, printing pressure, printing force and ink formulation have been investigated.

Satellite-on-a-Chip Development for Future Distributed Space Missions

2006 ◽  
Author(s):  
David J. Barnhart ◽  
Tanya Vladimirova ◽  
Martin N. Sweeting
Keyword(s):  
Low Cost ◽  
High Volume ◽  
Cmos Technology ◽  
Space Mission ◽  
Space Missions ◽  
Small Satellites ◽  
High Volume Production ◽  
Volume Production ◽  
Detailed Assessment ◽  
Distributed Space Systems

A new dimension of space mission architectures is emerging where hundreds to thousands of very small satellites will collectively perform missions in a distributed fashion. To support this architecture, high volume production of femto-scale satellites at low cost is required. This paper reviews current and emerging distributed space systems. A conceptual design of SpaceChip, which is a monolithic “satellite-on-a-chip” based on commercial CMOS technology is detailed. Assessment of the SpaceChip design is given and its use in future distributed space missions is discussed.

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