Predicting Truck Tire Problems with the Thermal Image Inspection Station (TIIS) in the Lab and in the Field

2000 ◽  
Author(s):  
Douglas Miller ◽  
Ray Schandelmeier ◽  
Ferdinand Zegel
Author(s):  
HyungTae Kim ◽  
Cheol Woong Ko ◽  
Gi-Ho Seo ◽  
Jong-Ik Song ◽  
Ji-Won Seo

2005 ◽  
Vol 33 (3) ◽  
pp. 156-178 ◽  
Author(s):  
T. J. LaClair ◽  
C. Zarak

Abstract Operating temperature is critical to the endurance life of a tire. Fundamental differences between operations of a tire on a flat surface, as experienced in normal highway use, and on a cylindrical test drum may result in a substantially higher tire temperature in the latter case. Nonetheless, cylindrical road wheels are widely used in the industry for tire endurance testing. This paper discusses the important effects of surface curvature on truck tire endurance testing and highlights the impact that curvature has on tire operating temperature. Temperature measurements made during testing on flat and curved surfaces under a range of load, pressure and speed conditions are presented. New tires and re-treaded tires of the same casing construction were evaluated to determine the effect that the tread rubber and pattern have on operating temperatures on the flat and curved test surfaces. The results of this study are used to suggest conditions on a road wheel that provide highway-equivalent operating conditions for truck tire endurance testing.


Author(s):  
M. Palaniappan ◽  
V. Ng ◽  
R. Heiderhoff ◽  
J.C.H. Phang ◽  
G.B.M. Fiege ◽  
...  

Abstract Light emission and heat generation of Si devices have become important in understanding physical phenomena in device degradation and breakdown mechanisms. This paper correlates the photon emission with the temperature distribution of a short channel nMOSFET. Investigations have been carried out to localize and characterize the hot spots using a spectroscopic photon emission microscope and a scanning thermal microscope. Frontside investigations have been carried out and are compared and discussed with backside investigations. A method has been developed to register the backside thermal image with the backside illuminated image.


Clinical Pain ◽  
2019 ◽  
Vol 18 (2) ◽  
pp. 70-75
Author(s):  
Jihyun Park ◽  
Jang Woo Lee ◽  
Sang Eok Lee ◽  
Byung Hee Kim ◽  
Dougho Park

Author(s):  
S. W. Kwon ◽  
I. S. Song ◽  
S. W. Lee ◽  
J. S. Lee ◽  
J. H. Kim ◽  
...  

1974 ◽  
Vol 10 (22) ◽  
pp. 452 ◽  
Author(s):  
H.A.H. Boot ◽  
J.G. Castledine
Keyword(s):  

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