scholarly journals Synthesis of Poly(epoxy-imide)-Nano Silica Hybrid Film via CS Sol-gel Process and Their Dielectric Properties

2010 ◽  
Vol 177 ◽  
pp. 686-689 ◽  
Author(s):  
Shu Wang Duo ◽  
Mi Mi Song ◽  
Ying Luo ◽  
Ting Zhi Liu ◽  
Wei Min Gao

To improve AO resistance of polyimide, a type of polyimide/silica (PI/SiO2) hybrid film was prepared by the sol-gel process. The coupling agent p-aminophenyltrimeth- oxysilane (APTMOS) was chosen to enhance the compatibility between the polyimide (PI) and silica (SiO2). AO resistance of the PI/SiO2 hybrid films were tested in the ground-based simulation AO facility. The erosion yield of the films was 4.7×10-26 cm3/atom, decreased by two orders of magnitude compared with the value of 3.0×10-24 cm3/atom of the polyimide film. Results from FTIR, XPS, AFM on AO treated polyimide/silica hybrid films indicate the formation of a passivating inorganic SiO2 layer. The layer significantly retards the penetration of oxygen atoms, preventing further degradation of the polymer in the bulk. The addition of SiO2 in polyimide does not significantly alter the optical properties of polyimide during AO exposure.


1992 ◽  
Vol 5 (2) ◽  
pp. 393-396 ◽  
Author(s):  
Atsushi Morikawa ◽  
Hidehiro Yamaguchi ◽  
Yoshitake Iyoku ◽  
Masa-aki Kakimoto ◽  
Yoshio Imai

2019 ◽  
Vol 38 (9) ◽  
pp. 586-597 ◽  
Author(s):  
Ananda S. Amarasekara ◽  
Deping Wang

Two chitosan silica hybrid materials were prepared by a two-step process in 78–84% yields using the homogeneous phase reaction of 3-(triethoxysilyl)propyl isocyanate with chitosan dissolved in 1-n-butyl-3-methylimidazolium chloride ionic liquid (∼10% w/w), which was followed by NH4OH catalyzed hydrolysis of triethoxysilyl groups and then sol-gel process. These new hybrid materials were shown to adsorb up to about 95% of Fe3+ from 5 × 10−4 M aqueous solution at room temperature in 24 h.


2003 ◽  
Vol 99 (1-3) ◽  
pp. 382-385 ◽  
Author(s):  
W.X Cheng ◽  
A.L Ding ◽  
P.S Qiu ◽  
X.Y He ◽  
X.Sh Zheng

2009 ◽  
Vol 79-82 ◽  
pp. 1767-1770 ◽  
Author(s):  
Shu Ang Han ◽  
Kai Hui Jiang ◽  
Jun Wu Tang

In this paper, 2.5D SiO2f/SiO2 composites were fabricated via sol-gel process employing 2.5D braided silica fiber fabrics as reinforcements and high pure silicasol as slurry. The process parameters are optimized and the optimal parameters are as follows: the silicasol of 30.8 wt. % as slurry, microwave drying, and sintering at 900 °C. Utilizing the optimal process parameters, the density and the flexural strength of the composites can reach 1.65 g•cm-3 and 80.68 MPa respectively. Dielectric properties of the 2.5D SiO2f/SiO2 composites were also measured, and the real part of the permittivity is 3.40 at 5 GHz. The excellent mechanical and dielectric properties of the 2.5D SiO2f/SiO2 composites can well meet the requirements of radome materials.


2010 ◽  
Vol 21 (8) ◽  
pp. 1101-1104
Author(s):  
Cheng Yi-Xiang ◽  
Liu Tian-Dong ◽  
Chen Ling-Wu

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