scholarly journals Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization

2007 ◽  
Vol 8 (2) ◽  
pp. 53-57 ◽  
Author(s):  
Yun Zhuanga ◽  
Leonard Borucki ◽  
Ara Philipossian ◽  
Eric Dien ◽  
Mohamed Ennahali ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Chemical Mechanical Planarization ◽  
Interlayer Dielectric

Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization

2005 ◽  
Vol 44 (1A) ◽  
pp. 82-86 ◽  
Author(s):  
Yun Zhuang ◽  
Zhonglin Li ◽  
Yoshitomo Shimazu ◽  
Nobuo Uotani ◽  
Leonard Borucki ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Chemical Mechanical Planarization

Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process

2013 ◽  
Vol 52 (1R) ◽  
pp. 018001 ◽  
Author(s):  
Xiaoyan Liao ◽  
Yun Zhuang ◽  
Leonard J. Borucki ◽  
Jiang Cheng ◽  
Siannie Theng ◽  
...  
Keyword(s):  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Interlayer Dielectric ◽  
Planarization Process

Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization

2005 ◽  
Vol 44 (3) ◽  
pp. 1225-1231 ◽  
Author(s):  
Yoshiyuki Seike ◽  
Darren DeNardis ◽  
Masano Sugiyama ◽  
Keiji Miyachi ◽  
Toshiro Doi ◽  
...  
Keyword(s):  
High Pressure ◽  
Chemical Mechanical Planarization ◽  
Interlayer Dielectric ◽  
Pad Conditioning

Pad Wear Analysis during Interlayer Dielectric Chemical Mechanical Planarization

2012 ◽  
Vol 1 (5) ◽  
pp. N103-N105 ◽  
Author(s):  
Yubo Jiao ◽  
Yun Zhuang ◽  
Xiaomin Wei ◽  
Yasa Sampurno ◽  
Anand Meled ◽  
...  
Keyword(s):  
Chemical Mechanical Planarization ◽  
Interlayer Dielectric ◽  
Wear Analysis ◽  
Pad Wear
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